ESD5344D-MS

www.msksemi.com ESD5344D-MS Semiconductor Compiance Features        150 Watts peak pulse power (tp = 8/20μs) Transient protection for high speed data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Working voltages : 5V Protects two or four I/O lines Ultra Low capacitance:0.3pf (typical between I/O channel) Low operating and clamping voltages Solid-state silicon avalanche technology Applications DFN-2510-10L  High Definition Multi-Media Interface (HDMI)  USB 1.1/2.0/3.0/OTG  IEEE 1394 Firewire Ports  Projection TV Monitors and Flat PanelDisplays  Notebook Computers  Set Top Box Maximum Rating @ Ta=25℃ unless otherwise specified Symbol PPK Parameter Peak Pulse Power (tp = 8/20μs) Ratings Units 150 Watts TL Lead Soldering Temperature 260(10sec.) ℃ TJ Operating Temperature -55 to +125 ℃ Storage Temperature -55 to +150 ℃ TSTG www.msksemi.com ESD5344D-MS Semiconductor Compiance Electrical Characteristics@ Ta=25℃ unless otherwise Symbol Parameter Conditions VRWM Reverse Working Voltage Any I/O to Ground VBR Reverse Breakdown Voltage IT = 1mA, Any I/O to Ground IR Reverse Leakage Current VRWM = 5V, Any I/O to Ground VF Diode Forward Voltage IF = 15mA VC CJ Clamping Voltage Junction Capacitance Min. Typ. Max. Units 5.0 V 6.0 V 1 μA 1.2 V IPP = 1A, tp =8/20μs, any I/O pin to Ground 9.8 V IPP = 3A, tp =8/20μs, any I/O pin to Ground 15 V 0.85 VR = 0V, f = 1MHz, between I/O pins 0.25 0.3 pF VR = 0V, f = 1MHz, any I/O pin to Ground 0.5 0.6 pF www.msksemi.com ESD5344D-MS Semiconductor Compiance Typical Characteristics@ Ta=25℃ unless otherwise specified www.msksemi.com ESD5344D-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A A b1xN bbb 1 E/2 C A1 R0.125 E C A B 2 DIMENSI LxN DIM 2X R0.075 PLACES 7 N bxN e B SEATING PLANE aaa C A2 D bbb D/2 C A B Dimensions in millimeters A A1 A2 b b1 D E e L N aaa bbb ONS INCHES MIN MILLIMETERS NOM MAX .020 .023 0.00 .001 (.005) .006 .008 .014 .016 .094 .098 .035 .039 .020 BSC .012 .015 8 .003 .004 .026 .002 .010 .018 .102 .043 .017 MIN NOM MAX 0.50 0.58 0.00 0.03 (0.13) 0.15 0.20 0.35 0.40 2.40 2.50 0.90 1.00 0.50 BSC 0.30 0.38 8 0.08 0.10 0.65 0.05 0.25 0.45 2.60 1.10 0.425 DIMENSIONS P1 P Y Z (C) (Y1) G X X1 DIM INCHES MILLIMETERS C (.034) (0.875) G .008 0.20 P .020 0.50 P1 .039 1.00 X .008 0.20 X1 .016 0.40 Y .027 0.675 Y1 (.061) (1.55) Z .061 1.55 NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N ESD5344D-MS PKG QTY DFN-2510-10L 3000 www.msksemi.com ESD5344D-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com