MSUSBLC6-2SC6

www.msksemi.com MSUSBLC6-2SC6 Semiconductor Compiance Features Ultra low leakage: nA level Operating voltage: 5V Low clamping voltage Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: ±30kV – IEC61000-4-4 (EFT) 40A (5/50ns) –IEC61000-4-5 (Lightning) 6A (8/20μs) RoHS Compliant Applications USB 2.0 interface 10/100 Ethernet Personal digital assistants (PDA's) Notebooks, Desktops and Servers Portable instrumentation Digital cameras SOT23-6L USBLC6-2SC6 I/O1 1 1 6 I/O1 GND 2 5 VBUS I/O2 3 4 I/O2 Mechanical Characteristics Package: SOT23-6 Lead Finish: Matte Tin UL Flammability Classification Rating 94V-0 Pb-Free, Halogen Free, RoHS/WEEE Compliant Absolute Maximum Ratings (TA=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppk 150 W Peak Pulse Current (8/20µs) Ipp 6 A ESD per IEC 61000−4−2 (Air) ESD per IEC 61000−4−2 (Contact) Operating Temperature Range Storage Temperature Range VESD ±30 ±30 kV TJ −55 to +125 °C Tstg −55 to +150 °C www.msksemi.com MSUSBLC6-2SC6 Semiconductor Compiance Electrical Characteristics (TA=25°C unless otherwise specified) Symbol Parameter Reverse stand-off voltage Test Condition Typ Min VRWM Reverse breakdown voltage 6 Max Unit 5 V 9 V VBR IBR=1mA Reverse leakage current IR VR=5V 0.1 ȝA Clamping voltage (tp=8/20ȝs) VC IPP=1A 10 V Clamping voltage (tp=8/20ȝs) VC IPP=6A 15 V CJ 0Vdc,f=1MHz Between I/O pins and GND 0.8 1 pF CJ 0Vdc,f=1MHz I/O to I/O 0.35 0.4 pF Junction capacitance Typical Characteristics Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) Fig1. 8/20µ s Pulse Waveform 100 Peak Value IPP 80 100% TEST WAVEFORM PARAMETERS tr=8 s td=20 s Percent of Peak Pulse Current % tr 60 40 td=t IPP/2 20 0 0 5 10 15 20 25 90% 10% tr = 0.7~1ns Time (ns) 30ns 30 60ns t - Time ( s) Fig3. Power Derating Curve 110 100 % of Rated Power IPP - Peak Pulse Current - % of IPP 120 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 Ambient Temperature –TA(ºC) www.msksemi.com MSUSBLC6-2SC6 Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E1 E e e1 L θ Dimensions In Millimeters Min. Max. 1.050 1.250 0.000 0.100 1.050 1.150 0.300 0.500 0.100 0.200 2.820 3.020 1.500 1.700 2.650 2.950 0.950(BSC) 1.800 2.000 0.300 0.600 0° 8° Dimensions In Inches Min. Max. 0.041 0.049 0.000 0.004 0.041 0.045 0.012 0.020 0.004 0.008 0.111 0.119 0.059 0.067 0.104 0.116 0.037(BSC) 0.071 0.079 0.012 0.024 0° 8° REEL SPECIFICATION P/N MSUSBLC6-2SC6 PKG SOT-23-6 QTY 3000 www.msksemi.com MSUSBLC6-2SC6 Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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