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FR101 THRU FR107
Semiconductor
FEATURES
▪ For surface mounted applications
▪ Low profile package
▪ Glass Passivated Chip Juntion
▪ Ideal for automated placement
▪ Fast reverse recovery time
Compiance
PINNING
PIN
▪ Lead free in comply with EU RoHS 2011/65/EU directives
DESCRIPTION
1
Cathode
2
Anode
1
2
MECHANICAL DATA
▪ Case: SOD-123FL
▪ Terminals: Solderable per MIL-STD-750, Method 2026
SOD-123FL
▪ Approx. Weight:15mg 0.00048oz
Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %.
Symbols
Parameter
FR101
F1
FR102
F2
FR103
F3
FR104
F4
FR105
F5
FR106
F6
FR107
F7
Units
Maximum Repetitive Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current at
Ta = 65 °C
IF(AV)
1.0
A
Peak Forward Surge Current 8.3 ms Single Half
Sine Wave Superimposed on Rated Load (JEDEC
Method)
IFSM
30
A
Maximum Instantaneous Forward Voltage at 1 A
VF
1.3
V
Maximum DC Reverse Current
at Rated DC Blocking Voltage
IR
1
50
μA
Ta = 25 °C
Ta =125 °C
ns
Maximum Reverse Recovery Time 1)
trr
Typical Junction Capacitance 2)
Cj
15
pF
Tj, Tstg
-55 ~ +150
°C
Operating and Storage Temperature Range
1)
2)
150
250
500
Measured with IF = 0.5 A, IR = 1 A, Irr = 0.25 A
Measured at 1MHz and applied reverse voltage of 4V D.C
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FR101 THRU FR107
Semiconductor
Fig.1 Forward Current Derating Curve
Fig.2 Typical Reverse Characteristics
Instaneous Reverse Current(μA)
Average Forward Current (A)
1.2
1.0
0.8
0.6
0.4
Single phase half-wave 60 Hz
resistive or inductive load
0.2
0.0
25
50
75
100 125 150 175
100
TJ=125°C
10
1.0
0.1
Ambient Temperature (°C)
00
20
40
60
80
100 120
140
Fig.4 Typical Junction Capacitance
100
Junction Capacitance (pF)
10
Instaneous Forward Current (A)
TJ=25°C
percent of Rated Peak Reverse Voltage (%)
Fig.3 Typical Instaneous Forward
Characteristics
TJ=25°C
1.0
0.1
pulse with 300μs
1% duty cycle
0.01
Compiance
0.0
0.5
1.0
1.5
2.0
2.5
Instaneous Forward Voltage (V)
10
TJ=25°C
1
0.1
1.0
10
100
Reverse Voltage (V)
Peak Forward Surage Current (A)
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
30
25
20
15
10
8.3 ms Single Half Sine Wave
(JEDEC Method)
05
00
1
10
100
Number of Cycles
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FR101 THRU FR107
Semiconductor
Compiance
1.8± 0.3
0.95 ±0.25
PACKAGE MECHANICAL DATA
1.15±0.25
0.05-0.30
2.75 ±0.25
0.6±0.3
3.7 ±0.30
Dimensions in millimeters
1.4
2.85
1.2
REEL SPECIFICATION
P/N
FR101 THRU FR107
PKG
SOD-123FL
QTY
3000
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FR101 THRU FR107
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as
life-support
systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
you
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at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
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performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
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such
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without the prior written permission of MSKSEMI Semiconductor.
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guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
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