PESD3V3S1UB

www.msksemi.com PESDXXXS1UB Semiconductor Compiance Features   250 Watts peak pulse power (tp = 8/20μs) Transient protection for high speed data lines to IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns)    Protects One Power or I/O Port Low operating and clamping voltages Solid-state silicon avalanche technology SOD-523 Applications       Notebooks, Desktops, Servers and Video Graphics Cards USB Power & Data Line Protection Monitors and Flat Panel Displays I²C Bus Protection Portable Instrumentation Set Top Box Maximum Rating @ Ta=25℃ unless otherwise specified Symbol Parameter Ratings Units 250 Watts PPK Peak Pulse Power (tp = 8/20μs) TL Lead Soldering Temperature 260(10sec.) ℃ TJ Operating Temperature -55 to +125 ℃ Storage Temperature -55 to +150 ℃ TSTG Electrical Characteristics@ Ta=25℃ unless otherwise VRWM @IR P/N V VBR@ImA VC@1 VC@IPP µA V V V MAX MIN MAX MAX CJ A pF MAX PESD3V3S1UB 3.3 1 4 9.8 13 12 120 PESD5V0S1UB 5 1 5.8 11.8 15 10 100 PESD7V0S1UB 7 1 7.5 14 19 8 80 PESD12VS1UB 12 1 13.3 19 25 6 70 PESD15VS1UB 15 1 16.5 24 33 5 50 PESD24VS1UB 24 1 26.1 44 54 3 30 PESD36VS1UB 36 1 38.2 62 80 3 30 www.msksemi.com PESDXXXS1UB Semiconductor Compiance Typical Characteristics@ Ta=25℃ unless otherwise specified Soldering Parameters www.msksemi.com PESDXXXS1UB Semiconductor PACKAGE MECHANICAL DATA 6\PERO A A1 b c D E E1 E2 L  'LPHQVLRQV,Q0LOOLPHWHUV 0LQ 0D[ 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF 'LPHQVLRQV,Q,QFKHV 0LQ 0D[ 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF REEL SPECIFICATION P/N PESDXXXS1UB PKG SOD-523 QTY 3000 Compiance PESDXXXS1UB Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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