AZC199-04S-MS

www.msksemi.com AZC199-04S-MS Semiconductor Compiance MAIN APPLICATIONS USB 2.0&3.0 power and data line protection Digital video interface (DVI) Notebook computers Video graphics cards Monitors and flat panel displays 10/100/1000 ethernet SIM ports ATM interfaces PIN Configuration PROTECTION SOLUTION TO MEET IEC61000-4-2 (ESD) ±20kV (air), ±20kV (contact) IEC61000-4-4 (EFT) 40A (5/50ns) IEC61000-4-5 (Lightning) 5A (8/20µs) 100 watts peak pulse power per line (tP=8/20µs) Protects four I/O lines Low clamping voltage Low operating voltage Low capacitance Circuit Diagram ABSOLUTE MAXIMUM RATINGS (TA=25℃, RH=45%-75%, unless otherwise noted) Parameter Peak pulse power dissipation on 8/20µs waveform ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Symbol Value Unit PPP 100 W VESD +/- 20 +/-20 kV Lead soldering temperature TL 260 (10 sec.) ℃ Operating junction temperature range TJ -55 to +125 ℃ TSTG -55 to +150 ℃ Storage temperature range ELECTRICAL CHARACTERISTICS (TA=25℃) Parameter Reverse working voltage Reverse breakdown voltage Symbol Conditions Typ VRWM VBR IT=1mA Reverse leakage current IR VRWM=5V Forward voltage VF IT=10mA Clamping voltage (I/O pin to Ground) VC Junction capacitance Min Max Unit 5.0 V 6.0 V 1 µA 0.8 1.0 V IPP=1A, tP=8/20µs 9.5 11 VC IPP=5A, tP=8/20µs 12.5 15 CJ VRWM=0V, f=1MHz Any I/O pin to Ground VRWM=0V, f=1MHz Between I/O pins 0.65 0.8 0.3 0.5 V pF www.msksemi.com AZC199-04S-MS Semiconductor Compiance Electrical Parameter Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IT Test Current VBR Breakdown Voltage @ IT FIG1: Pulse Waveform FIG2:Power Derating www.msksemi.com AZC199-04S-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E1 E e e1 L θ Dimensions In Millimeters Min. Max. 1.050 1.250 0.000 0.100 1.050 1.150 0.300 0.500 0.100 0.200 2.820 3.020 1.500 1.700 2.650 2.950 0.950(BSC) 1.800 2.000 0.300 0.600 0° 8° Dimensions In Inches Min. Max. 0.041 0.049 0.000 0.004 0.041 0.045 0.012 0.020 0.004 0.008 0.111 0.119 0.059 0.067 0.104 0.116 0.037(BSC) 0.071 0.079 0.012 0.024 0° 8° REEL SPECIFICATION P/N AZC199-04S-MS PKG SOT-23-6 QTY 3000 www.msksemi.com AZC199-04S-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. 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MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com