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PRTR5V0U2X-MS
Semiconductor
Feature
Compiance
Applications
350 W Peak Power per Line (tp = 8/20μs)
Ethernet - 10/100 Base T
SOT-143 package
Fire wire
ESD Protection > 15 kV
Wireless communications
Unidirectional configurations
USB interface
Protects 2 I/O Ports & Power Supply
Low Capacitance: 4 pF
Low clamping voltage
RoHS Compliant in Lead-Free Versions
Transient protection for data lines to IEC 61000-4-2(ESD)
±15KV(air) ±8KV(contact); IEC 61000-4-4 (EFT) 40A (5/50ns)
Mechanical Characteristics
Lead finish:100% matte Sn(Tin)
1
4
2
3
Mounting position: Any
Qualified max reflow temperature:260℃
Device meets MSL 1 requirements
Pure tin plating: 7 ~ 17 um
Pin flatness:≤3mil
SOT-143
Electrical characteristics per line@( unless otherwisespecified)
Parameter
Symbol
Conditions
Min.
Reverse Stand-off Voltage
VRWM
Reverse Breakdown Voltage
VBR
It = 1mA
Reverse Leakage Current
IR
VRWM =5.0V, T=25℃
Clamping Voltage
VC
Clamping Voltage
Typ.
Max.
Units
5
V
8.5
V
1
μA
IPP = 1A, tP = 8/20μs
12.5
V
VC
IPP=5A, tP = 8/20μs
24.0
V
Capacitance Between IO and GND
CJ
VR=0V, f = 1MHz
3.0
pF
Capacitance Between IO and I/O
CJ
VR=0V, f = 1MHz
1.5
pF
6
Absolute maximum rating@25℃
Rating
Symbol
Value
Units
Peak Pulse Power (tp=8/20μs)
Ppp
350
W
Peak Pulse Power (tp=8/20μs)
Ipp
9
A
Operating Temperature
TJ
-55 to +150
℃
Storage Temperature
TSTG
-55 to +150
℃
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PRTR5V0U2X-MS
Semiconductor
Compiance
Electronics Parameter
Symbol
Parameter
VRWM
Peak Reverse Working Voltage
IR
Reverse Leakage Current @ VRWM
VBR
Breakdown Voltage @ IT
IT
Test Current
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
PPP
Peak Pulse Power
CJ
Junction Capacitance
IF
Forward Current
VF
Forward Voltage @ IF
I
IF
VC VBRVRWM
IR VF
IT
V
IPP
FIG1: Pulse Waveform
FIG2:Power Derating
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PRTR5V0U2X-MS
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
Symbol
θ
Inches
Min.
Millimeters
Nom. Max. Min. Nom. Max.
A
0.031
A1
A2
-
0.048
0.80
0.000
-
0.008 0.013
0.020
0.035
0.042
0.75
-
1.22
-
0.15
0.90
1.07
b
0.011
-
0.020
0.30
-
0.51
b1
0.029
-
0.037
0.76
-
0.94
c
0.003
-
0.008
0.08
-
0.20
D
0.110
0.114
0.120
2.80
2.90
3.04
E
0.082
0.093
0.104
2.10
2.37
2.64
E1
0.047
0.051
0.055
1.20
1.30
1.40
e
0.075
e1
L
1.92 BSC
0.008
0.015
0.020
0.20 BSC
0.024
0.40
0.50
L1
(0.021)
(0.54)
N
4
4
θ
0°
-
8°
0°
-
aaa
0.006
0.15
bbb
0.008
0.20
ccc
0.004
0.10
0.60
8°
REEL SPECIFICATION
P/N
PRTR5V0U2X-MS
PKG
SOT-143
QTY
3000
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PRTR5V0U2X-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities
concerned
in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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