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PSM712-MS
Semiconductor
Features
400W peak pulse power (8/20µs)
Ultra low leakage: nA level
Operating voltage: 7V or 12V
Low clamping voltage
Complies with following standards:
– IEC 61000-4-2 (ESD) immunity test
Air discharge: ±30kV
Contact discharge: ±30kV
– IEC61000-4-4 (EFT) 40A (5/50ns)
– IEC61000-4-5 (Lightning) 17A (8/20µs)
Compiance
Mechanical Characteristics
Package: SOT-23
Lead Finish: Matte Tin
Case Material: “Green” MoldingCompound.
UL Flammability Classification Rating94V-0
Moisture Sensitivity: Level 3 perJ-STD-020
Terminal Connections: See Diagram Below
RoHS Compliant
Applications
Wireless System
Networks
Portable Instrumentation
RS485 Ports
Circuit Diagram
Pin Configuration
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PSM712-MS
Semiconductor
Compiance
Absolute Maximum Ratings (Tamb=25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Peak Pulse Power (8/20µs)
Ppk
400
W
Peak Pulse Current (8/20µs)
Ipp
12
A
ESD per IEC 61000−4−2 (Air)
±30
VESD
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
Storage Temperature Range
kV
±30
TJ
−55 to +125
°C
Tstg
−55 to +150
°C
Electrical Characteristics (TA=25°C unless otherwise specified)
Pin 1 to 3 and Pin 3 to 1 and
2 to 3
3 to 2
(12V TVS)
Parameter
Reverse Working Voltage
Breakdown Voltage
(7V TVS)
Symbol Min Typ Max Min Typ Max Unit Test Condition
VRWM
VBR
12
13.3
7
7.5
V
V
IT = 1mA
Reverse Leakage Current
IR
0.05
2.0
uA
VR = VRWM
Clamping Voltage
VC
20
10
V
IPP = 5A (8 x 20µs pulse)
Clamping Voltage
VC
26
12
V
IPP = 12A (8 x 20µs pulse)
Junction Capacitance
CJ
75
75
pF
VR = 0V, f = 1MHz
Junction Capacitance
CJ
pF
VR = VRWM, f = 1MHz
45
45
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PSM712-MS
Semiconductor
Compiance
Electrical Parameter
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @
VRWM
IT
Test Current
VBR
Breakdown Voltage @ IT
FIG1: Pulse Waveform
FIG2:Power Derating
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PSM712-MS
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
b
c
D
E1
E
e
e1
L
0
Dimensions In Millimeters
Min.
Max.
1.050
1.250
0.000
0.100
1.050
1.150
0.300
0.500
0.100
0.200
2.820
3.020
1.500
1.700
2.650
2.950
0.950(BSC)
1.800
2.000
0.300
0.600
0°
8°
Dimensions In Inches
Min.
Max.
0.041
0.049
0.000
0.004
0.041
0.045
0.012
0.020
0.004
0.008
0.111
0.119
0.059
0.067
0.104
0.116
0.037(BSC)
0.071
0.079
0.012
0.024
0°
8°
REEL SPECIFICATION
P/N
PSM712-MS
PKG
SOT-23
QTY
3000
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PSM712-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support
systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
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without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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