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SRV05-4
Semiconductor
Compiance
FEATURES
Transient protection for high-speed data lines
IEC 61000-4-2(ESD)
PACKAGE OUTLINE
±20KV(Contact)
±25KV(Air)
IEC 61000-4-4(EFT) 40A(5/50ns)
Package optimized for high-speed lines
Small package(2.9mm*2.8mm*1.1mm)
Protects four data lines and one Vcc line
Low capacitance: 0.20pF (I/O to I/O)
Low leakage current
Low clamping voltage
Each I/O pin can withstand over 1000 ESD strikes
for ±8KV contact discharge
MACHANICAL DATA
SOT-23-6
Flammability Rating: UL 94V-0
Terminal: Matte tin plated.
High temperature soldering guaranteed:
260℃/10s
Packaging: Tape and Reel
PIN CONFIGURATION
Reel size: 7 inch
APPLICATIONS
Serial ATA
MDDI Ports
USB 2.0/3.0 Power and Data Line Protection
Display Ports
High Definition Multi-Media Interface (HDMI)
Digital Visual Interface (DVI)
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SRV05-4
Semiconductor
Compiance
ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Value
Units
PPP
Peak Pulse Power (8/20μs)
60
W
VESD
ESD per IEC 61000-4-2 (Contact)
ESD per IEC 61000-4-2 (Air)
±20
±25
kV
TOPT
Operating Temperature
-55/+125
C
TSTG
Storage Temperature
-55/+150
C
ELECTRICAL CHARACTERISTICS (Tamb=25C)
Symbol
Parameter
Test Condition
VRWM
Reverse Working Voltage
Any I/O pin to GND
VBR
Reverse Breakdown
Voltage
IR
Reverse Leakage Current
IT = 1mA
Any I/O pin to GND
VRWM = 5V
Any I/O pin to GND
IPP = 1A, tp = 8/20μs
Any I/O pin to GND
IPP = 4A, tp = 8/20μs
Any I/O pin to GND
IPP = 8A, tp = 8/20μs
Vcc pin to GND
VR = 0V, f = 1MHz
Between I/O and I/O
VR = 0V, f = 1MHz
Between I/O and GND
VR = 0V, f = 1MHz
Between Vcc and GND
VC
CESD
Clamping Voltage
Parasitic Capacitance
Min
Typ
Max
Units
5.0
V
9.0
V
1.0
μA
10
V
15
V
15
V
0.20
0.30
pF
0.45
0.50
pF
6.0
0.80
pF
Note: I/O Pins are pin 1,3,4,6. Pin 5 is Vcc. Pin 2 is GND.
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SRV05-4
Semiconductor
Compiance
ELECTRICAL CHARACTERISTICS CURVE
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SRV05-4
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
b
c
D
E1
E
e
e1
L
θ
Dimensions In Millimeters
Min.
Max.
1.050
1.250
0.000
0.100
1.050
1.150
0.300
0.500
0.100
0.200
2.820
3.020
1.500
1.700
2.650
2.950
0.950(BSC)
1.800
2.000
0.300
0.600
0°
8°
Dimensions In Inches
Min.
Max.
0.041
0.049
0.000
0.004
0.041
0.045
0.012
0.020
0.004
0.008
0.111
0.119
0.059
0.067
0.104
0.116
0.037(BSC)
0.071
0.079
0.012
0.024
0°
8°
REEL SPECIFICATION
P/N
SRV05-4
PKG
SOT-23-6
QTY
3000
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SRV05-4
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities concerned in
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mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property
rights or other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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