AZ1345-04F-MS

www.msksemi.com AZ1345-04F-MS Semiconductor Compiance Features         Protects two or four I/O lines Low capacitance: 0.5pF Typical between I/O channel Low leakage current 5V operating voltage Response time < 1ns Solid-state silicon avalanche technology Device meets MSL 1 requirements RoHS compliant Applications          High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) USB 1.1/2.0/3.0/OTG IEEE 1394 Firewire Ports Notebooks & Handhelds DFN2510 Projection TV & Monitors Set-top box Flat Panel Displays PCI Express Mechanical Characteristics      DFN2510 package Flammability Rating: UL 94V-0 Terminal: Matte tin plated. Packaging: Tape and Reel High temperature soldering guaranted:260℃/10s  Reel size: 7 inch www.msksemi.com AZ1345-04F-MS Semiconductor Compiance Maximum Ratings And Characteristics @ 25°C Ambient Temperature (unless otherwise noted) Symbol Parameter Value Units PPP Peak Pulse Power (8/20μs) 150 W IPP Peak Pulse Current (8/20μs) 5 A ±15 ±8 kV VESD ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) TOPT Operating Temperature -55/+150 C TSTG Storage Temperature -55/+150 C Electrical Characteristics(Tamb=25C) Symbol Parameter Test Condition VRWM Reverse Working Voltage Any I/O pin to GND VBR Reverse Breakdown Voltage IR Reverse Leakage Current IT = 1mA Any I/O pin to GND VRWM = 5V Any I/O pin to GND VF Diode Forward Voltage IF = 15mA VC1 Clamping Voltage 1 VC2 Clamping Voltage 2 CJ1 Junction Capacitance 1 CJ2 Junction Capacitance 2 Min Typ Max Units 5.0 V 6.0 V 1 μA 1.2 V IPP = 1A, tp = 8/20μs Any I/O pin to GND 15.5 V IPP = 5, tp = 8/20μs Any I/O pin to GND 25 V 0.3 0.6 pF 0.45 0.8 pF VR = 0V, f = 1MHz Between I/O pins VR = 0V, f = 1MHz Any I/O pin to GND 0.85 Note: I/O pins are pin 1,2,4,5. www.msksemi.com AZ1345-04F-MS Semiconductor Compiance Electrical Characteristics Curve www.msksemi.com AZ1345-04F-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A A b1xN bbb 1 E/2 C A1 R0.125 E C A B 2 DIMENSI LxN DIM 2X R0.075 PLACES 7 N bxN e B SEATING PLANE aaa C A2 D bbb D/2 C A B Dimensions in millimeters A A1 A2 b b1 D E e L N aaa bbb ONS INCHES MIN MILLIMETERS NOM MAX .020 .023 0.00 .001 (.005) .006 .008 .014 .016 .094 .098 .035 .039 .020 BSC .012 .015 8 .003 .004 .026 .002 .010 .018 .102 .043 .017 MIN NOM MAX 0.50 0.58 0.00 0.03 (0.13) 0.15 0.20 0.35 0.40 2.40 2.50 0.90 1.00 0.50 BSC 0.30 0.38 8 0.08 0.10 0.65 0.05 0.25 0.45 2.60 1.10 0.425 DIMENSIONS P1 P Y Z (C) (Y1) G X X1 DIM INCHES MILLIMETERS C (.034) (0.875) G .008 0.20 P .020 0.50 P1 .039 1.00 X .008 0.20 X1 .016 0.40 Y .027 0.675 Y1 (.061) (1.55) Z .061 1.55 NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N AZ1345-04F-MS PKG DFN2510 QTY 3000 www.msksemi.com AZ1345-04F-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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