GD32F303VET6

GigaDevice Semiconductor Inc. GD32F303xx ARM® Cortex®-M4 32-bit MCU Datasheet GD32F303xx Table of Contents List of Figures ............................................................................................................................. 3 List of Tables ............................................................................................................................... 4 1 General description ......................................................................................................... 5 2 Device overview ............................................................................................................... 6 2.1 Device information .............................................................................................................................. 6 2.2 Block diagram ...................................................................................................................................... 8 2.3 Pinouts and pin assignment .............................................................................................................. 9 2.4 Memory map ...................................................................................................................................... 12 2.5 Clock tree ........................................................................................................................................... 16 2.6 Pin definitions .................................................................................................................................... 17 Functional description .................................................................................................. 25 3 3.1 ARM® Cortex®-M4 core .................................................................................................................... 25 3.2 On-chip memory................................................................................................................................ 26 3.3 Clock, reset and supply management ........................................................................................... 26 3.4 Boot modes ........................................................................................................................................ 27 3.5 Power saving modes ........................................................................................................................ 27 3.6 Analog to digital converter (ADC) ................................................................................................... 28 3.7 Digital to analog converter (DAC) ................................................................................................... 28 3.8 DMA .................................................................................................................................................... 29 3.9 General-purpose inputs/outputs (GPIOs) ...................................................................................... 29 3.10 Timers and PWM generation........................................................................................................... 30 3.11 Real time clock (RTC) ...................................................................................................................... 31 3.12 Inter-integrated circuit (I2C) ............................................................................................................. 31 3.13 Serial peripheral interface (SPI)...................................................................................................... 32 3.14 Universal synchronous asynchronous receiver transmitter (USART) ....................................... 32 3.15 Inter-IC sound (I2S) .......................................................................................................................... 32 3.16 Universal serial bus on-the-go full-speed (USB 2.0 FS) ............................................................. 33 3.17 Controller area network (CAN) ........................................................................................................ 33 3.18 Secure digital input and output card interface (SDIO) ................................................................. 33 3.19 External memory controller (EXMC) .............................................................................................. 34 3.20 Debug mode ...................................................................................................................................... 34 3.21 Package and operation temperature.............................................................................................. 34 Electrical characteristics .............................................................................................. 35 4 4.1 Absolute maximum ratings .............................................................................................................. 35 4.2 Recommended DC characteristics ................................................................................................. 35 4.3 Power consumption .......................................................................................................................... 36 4.4 EMC characteristics .......................................................................................................................... 37 4.5 Power supply supervisor characteristics ....................................................................................... 38 1 / 52 GD32F303xx 4.6 Electrical sensitivity........................................................................................................................... 38 4.7 External clock characteristics .......................................................................................................... 39 4.8 Internal clock characteristics ........................................................................................................... 40 4.9 PLL characteristics ........................................................................................................................... 41 4.10 Memory characteristics .................................................................................................................... 42 4.11 GPIO characteristics......................................................................................................................... 43 4.12 ADC characteristics .......................................................................................................................... 44 4.13 DAC characteristics .......................................................................................................................... 46 4.14 SPI characteristics ............................................................................................................................ 47 4.15 I2C characteristics ............................................................................................................................ 47 4.16 USART characteristics ..................................................................................................................... 47 Package information ..................................................................................................... 48 5 5.1 LQFP package outline dimensions ................................................................................................ 48 6 Ordering Information ..................................................................................................... 50 7 Revision History............................................................................................................. 51 2 / 52 GD32F303xx List of Figures Figure 1. GD32F303xx block diagram ...................................................................................................................... 8 Figure 2. GD32F303Zx LQFP144 pinouts ............................................................................................................... 9 Figure 3. GD32F303Vx LQFP100 pinouts ............................................................................................................. 10 Figure 4. GD32F303Rx LQFP64 pinouts ............................................................................................................... 11 Figure 5. GD32F303Cx LQFP48 pinouts ............................................................................................................... 11 Figure 6. GD32F303xx memory map ..................................................................................................................... 12 Figure 7. GD32F303xx clock tree............................................................................................................................ 16 Figure 8. LQFP package outline .............................................................................................................................. 48 3 / 52 GD32F303xx List of Tables Table 1. GD32F303xx devices features and peripheral list ................................................................................... 6 Table 2. GD32F303xx pin definitions ...................................................................................................................... 17 Table 3. Absolute maximum ratings ........................................................................................................................ 35 Table 4. DC operating conditions ............................................................................................................................ 35 Table 5. Power consumption characteristics ......................................................................................................... 36 Table 6. EMS characteristics ................................................................................................................................... 37 Table 7. EMI characteristics ..................................................................................................................................... 37 Table 8. Power supply supervisor characteristics ................................................................................................. 38 Table 9. ESD characteristics .................................................................................................................................... 38 Table 10. Static latch-up characteristics ................................................................................................................ 38 Table 11. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics.................. 39 Table 12. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics ................... 39 Table 13. High speed internal clock (IRC8M) characteristics .............................................................................. 40 Table 14. High speed internal clock (IRC48M) characteristics ........................................................................... 40 Table 15. Low speed internal clock (IRC32K) characteristics ............................................................................. 41 Table 16. PLL characteristics ................................................................................................................................... 41 Table 17. PLL2/3 characteristics ............................................................................................................................. 41 Table 18. Flash memory characteristics ................................................................................................................. 42 Table 19. I/O port characteristics ............................................................................................................................. 43 Table 20. ADC characteristics .................................................................................................................................. 44 Table 21. ADC RAIN max for fADC=40MHz ................................................................................................................. 44 Table 22. ADC dynamic accuracy at fADC = 30 MHz ............................................................................................. 45 Table 23. ADC dynamic accuracy at fADC = 30 MHz ............................................................................................. 45 Table 24. ADC dynamic accuracy at fADC = 36 MHz ............................................................................................. 45 Table 25. ADC dynamic accuracy at fADC = 40 MHz ............................................................................................. 45 Table 26. ADC static accuracy at fADC = 15 MHz .................................................................................................. 45 Table 27. DAC characteristics ................................................................................................................................. 46 Table 28. SPI characteristics .................................................................................................................................... 47 Table 29. I2C characteristics .................................................................................................................................... 47 Table 30. USART characteristics ............................................................................................................................ 47 Table 31. LQFP package dimensions ..................................................................................................................... 49 Table 32. Part ordering code for GD32F303xx devices ....................................................................................... 50 Table 33. Revision history......................................................................................................................................... 51 4 / 52 GD32F303xx 1 General description The GD32F303xx device belongs to the mainstream line of GD32 MCU Family. It is a new 32-bit general-purpose microcontroller based on the ARM® Cortex®-M4 RISC core with best cost-performance ratio in terms of enhanced processing capacity, reduced power consumption and peripheral set. The Cortex®-M4 core features implements a full set of DSP instructions to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. It also provides a Memory Protection Unit (MPU) and powerful trace technology for enhanced application security and advanced debug support. The GD32F303xx device incorporates the ARM® Cortex®-M4 32-bit processor core operating at 120 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 3072 KB on-chip Flash memory and 96 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to three 12-bit 2.6M SPS ADCs, two 12-bit DACs, up to ten general-purpose 16-bit timers, two 16-bit PWM advanced-control timers, and two 16-bit basic timers, as well as standard and advanced communication interfaces: up to three SPIs, two I2Cs, three USARTs and two UARTs, two I2Ss, an USB 2.0 FS, a CAN and a SDIO. The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications. The above features make GD32F303xx devices suitable for a wide range of interconnection and advanced applications, especially in areas such as industrial control, motor drives, consumer and handheld equipment, human machine interface, security and alarm systems, POS, automotive navigation, IoT and so on. 5 / 52 GD32F303xx 2 Device overview 2.1 Device information Table 1. GD32F303xx devices features and peripheral list GD32F303xx Part Number CE CG RC RE RG RI RK Code Area (KB) 256 256 256 256 256 256 256 256 Data Area (KB) 0 256 768 0 256 768 1792 2816 Total (KB) 256 512 1024 256 512 1024 2048 3072 48 64 96 48 64 96 96 96 16-bit GPTM 4 4 10 4 4 10 10 10 Adv. 16-bit TM 1 1 1 2 2 2 2 2 Basic 16-bit TM 2 2 2 2 2 2 2 2 SysTick 1 1 1 1 1 1 1 1 Watchdog 2 2 2 2 2 2 2 2 RTC 1 1 1 1 1 1 1 1 USART+UART 3 3 3 3+2 3+2 3+2 3+2 3+2 I2C 2 2 2 2 2 2 2 2 SPI/I2S 3/2 3/2 3/2 3/2 3/2 3/2 3/2 3/2 CAN 2.0B 1 1 1 1 1 1 1 1 USB 2.0 FS 1 1 1 1 1 1 1 1 GPIO 37 37 37 51 51 51 51 51 EXMC 0 0 0 0 0 0 0 0 EXTI 16 16 16 16 16 16 16 16 ADC Unit (CHs) 3(10) 3(10) 3(10) 3(16) 3(16) 3(16) 3(16) 3(16) DAC 2 2 2 2 2 2 2 2 Flash CC Connectivity Timers SRAM (KB) Package LQFP48 LQFP64 6 / 52 GD32F303xx Table 1. GD32F303xx devices features and peripheral list (Cont.) GD32F303xx Part Number VE VG VI VK ZC ZE ZG ZI ZK Code Area (KB) 256 256 256 256 256 256 256 256 256 256 Data Area (KB) 0 256 768 1792 2816 0 256 768 1792 2816 Total (KB) 256 512 1024 2048 3072 256 512 1024 2048 3072 48 64 96 96 96 48 64 96 96 96 16-bit GPTM 4 4 10 10 10 4 4 10 10 10 Adv. 16-bit TM 2 2 2 2 2 2 2 2 2 2 Basic 16-bit TM 2 2 2 2 2 2 2 2 2 2 SysTick 1 1 1 1 1 1 1 1 1 1 Watchdog 2 2 2 2 2 2 2 2 2 2 RTC 1 1 1 1 1 1 1 1 1 1 USART+UART 3+2 3+2 3+2 3+2 3+2 3+2 3+2 3+2 3+2 3+2 I2C 2 2 2 2 2 2 2 2 2 2 SPI/I2S 3/2 3/2 3/2 3/2 3/2 3/2 3/2 3/2 3/2 3/2 CAN 2.0B 1 1 1 1 1 1 1 1 1 1 USB 2.0 FS 1 1 1 1 1 1 1 1 1 1 GPIO 80 80 80 80 80 112 112 112 112 112 EXMC 1 1 1 1 1 1 1 1 1 1 EXTI 16 16 16 16 16 16 16 16 16 16 ADC Unit (CHs) 3(16) 3(16) 3(16) 3(16) 3(16) 3(21) 3(21) 3(21) 3(21) 3(21) DAC 2 2 2 2 2 2 2 2 2 2 Flash VC Connectivity Timers SRAM (KB) Package LQFP100 LQFP144 7 / 52 GD32F303xx 2.2 Block diagram Figure 1. GD32F303xx block diagram SW/JTAG TPIU NVIC Flash Memory Controller Ibus Flash Memory PLL F max : 120MHz Dbus FMC Master GP DMA 12 chs Master AHB Matrix ICode DCode System ARM Cortex-M4 Processor Fmax:120MHz POR/ PDR EXMC Slave Slave CRC LDO 1.2V RCU AHB Peripherals Slave Slave SDIO SRAM Controller AHB to APB Bridge2 IRC 8MHz SRAM HXTAL 4-16MHz AHB to APB Bridge1 LVD Interrput request CAN0 USART0 Slave 12-bit SAR ADC Slave SPI0 WWDGT ADC0~2 TIMER1~3 EXTI SPI1~2\ I2S1~2 GPIOA USART1~2 Powered By V DDA GPIOD GPIOE APB1: Fmax = 60MHZ GPIOC APB2: Fmax = 120MHz GPIOB Powered By VDDA I2C0 I2C1 USBD FWDGT GPIOF RTC GPIOG DAC TIMER0 TIMER4~6 TIMER7 UART3~4 TIMER8~10 TIMER 11~13 CTC 8 / 52 GD32F303xx 2.3 Pinouts and pin assignment Figure 2. GD32F303Zx LQFP144 pinouts PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 VSS_10 VDD_10 PD6 PD7 PG9 PG10 PG11 PG12 PG13 PG14 VSS_11 VDD_11 PG15 PB4 PB3 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS_3 VDD_3 144143142141140139138137136135134133 132131130129128127126125124123122121120 119118117116115114113112111110109 PE2 1 108 PE3 PE4 2 107 VSS_2 3 106 NC PE5 PE6 4 105 PA13 5 104 PA12 VBAT 6 103 PA11 PC13-TAMPER-RTC PC14-OSC32_IN 7 102 PA10 8 101 PA9 PC15-OSC32_OUT 9 100 PA8 PF0 10 99 PC9 PC8 VDD_2 PF1 11 98 PF2 12 97 PC7 PF3 PF4 13 96 PC6 14 95 VDD_9 PF5 15 94 VSS_9 VSS_5 16 93 PG8 92 PG7 91 PG6 90 PG5 89 PG4 88 PG3 VDD_5 17 PF6 18 PF7 19 PF8 20 PF9 21 PF10 22 87 PG2 OSC_IN 23 86 PD15 OSC_OUT 24 85 PD14 NRST 25 84 VDD_8 PC0 26 83 VSS_8 PC1 27 82 PD13 PC2 28 81 PD12 PC3 VSSA 29 80 PD11 30 79 PD10 VREFVREF+ 31 78 PD9 32 77 PD8 VDDA 33 76 PB15 PA0_WKUP 34 75 PB14 PA1 35 74 PB13 PA2 36 73 PB12 GigaDevice GD32F303Zx LQFP144 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 VDD_1 VSS_1 PB11 PB10 PE15 PE13 PE14 PE12 PE11 VDD_7 PE10 VSS_7 PE9 PE7 PE8 PG1 PG0 PF15 PF14 VDD_6 PF13 VSS_6 PF12 PB2 PF11 PB1 PC5 PB0 PA7 PC4 PA6 PA5 VDD_4 PA4 VSS_4 PA3 9 / 52 GD32F303xx Figure 3. GD32F303Vx LQFP100 pinouts PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PB4 PB3 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS_3 VDD_3 PE2 1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 PE3 PE4 2 74 VSS_2 3 73 NC PE5 PE6 4 72 PA13 5 71 PA12 VBAT 6 PC13-TAMPER-RTC PC14-OSC32_IN 7 70 69 PA10 8 68 PA9 PC15-OSC32_OUT 9 67 PA8 VSS_5 10 66 PC9 65 PC8 64 PC7 63 PC6 14 62 PD15 VDD_2 PA11 VDD_5 11 OSC_IN 12 OSC_OUT NRST PC0 13 15 61 PD14 PC1 16 60 PD13 PC2 PC3 17 59 PD12 18 58 PD11 VSSA 19 57 PD10 VREFVREF+ 20 56 PD9 21 55 PD8 VDDA 22 54 PB15 PA0-WKUP 23 53 PB14 PA1 24 52 PB13 PA2 25 51 PB12 GigaDevice GD32F303Vx LQFP100 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSS_1 VDD_1 PB11 PB10 PE15 PE14 PE13 PE11 PE12 PE10 PE9 PE8 PB2 PE7 PB1 PC5 PB0 PA7 PC4 PA6 PA5 PA4 VDD_4 PA3 VSS_4 10 / 52 GD32F303xx Figure 4. GD32F303Rx LQFP64 pinouts PA14 PA15 PC10 PC11 PD2 PC12 PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 VSS_3 VDD_3 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 48 VDD_2 PC13-TAMPER-RTC 2 47 VSS_2 PC14-OSC32_IN 3 46 PA13 PC15-OSC32_OUT PD0-OSC_IN 4 45 PA12 5 44 PA11 PD1 OSC_OUT 6 43 PA10 NRST PC0 7 42 PA9 PC1 9 PC2 PC3 VSSA VDDA PA0-WKUP PA1 PA2 VBAT GigaDevice GD32F303Rx LQFP64 41 PA8 40 PC9 10 39 PC8 11 38 PC7 12 37 PC6 13 36 PB15 14 35 PB14 15 34 PB13 16 33 PB12 8 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PB1 PB2 PB10 PB11 PB5 PB4 PB3 PA15 PA14 VDD_1 PB0 PB6 VSS_1 PC5 PC4 PA7 PA6 PA5 PA4 VDD_4 PA3 VSS_4 Figure 5. GD32F303Cx LQFP48 pinouts PB7 BOOT0 PB8 PB9 VSS_3 VDD_3 48 47 46 45 44 43 42 41 40 39 38 37 1 36 VDD_2 PC13-TAMPER-RTC 2 35 VSS_2 VBAT PC14-OSC32_IN 3 34 PA13 PC15-OSC32_OUT PD0-OSC_IN 4 33 PA12 5 32 PA11 PD1-OSC_OUT NRST VSSA 6 31 PA10 30 PA9 GigaDevice GD32F303Cx LQFP48 7 8 29 VDDA 9 28 PA8 PB15 PA0-WKUP 10 27 PB14 PA1 PA2 11 26 PB13 25 PB12 12 13 14 15 16 17 18 19 20 21 22 23 24 VDD_1 VSS_1 PB11 PB10 PB2 PB1 PB0 PA7 PA6 PA5 PA4 PA3 11 / 52 GD32F303xx 2.4 Memory map Figure 6. GD32F303xx memory map Pre-defined Regions Bus External device AHB3 External RAM AHB1 Peripheral APB2 Address Peripherals 0xA000 0000 - 0xA000 0FFF EXMC - SWREG 0x9000 0000 - 0x9FFF FFFF EXMC - PC CARD 0x7000 0000 - 0x8FFF FFFF EXMC - NAND 0x6000 0000 - 0x6FFF FFFF EXMC - NOR/PSRAM/SRAM 0x5000 0000 - 0x5003 FFFF Reserved 0x4008 0000 - 0x4FFF FFFF Reserved 0x4004 0000 - 0x4007 FFFF Reserved 0x4002 BC00 - 0x4003 FFFF Reserved 0x4002 B000 - 0x4002 BBFF Reserved 0x4002 A000 - 0x4002 AFFF Reserved 0x4002 8000 - 0x4002 9FFF Reserved 0x4002 6800 - 0x4002 7FFF Reserved 0x4002 6400 - 0x4002 67FF Reserved 0x4002 6000 - 0x4002 63FF Reserved 0x4002 5000 - 0x4002 5FFF Reserved 0x4002 4000 - 0x4002 4FFF Reserved 0x4002 3C00 - 0x4002 3FFF Reserved 0x4002 3800 - 0x4002 3BFF Reserved 0x4002 3400 - 0x4002 37FF Reserved 0x4002 3000 - 0x4002 33FF CRC 0x4002 2C00 - 0x4002 2FFF Reserved 0x4002 2800 - 0x4002 2BFF Reserved 0x4002 2400 - 0x4002 27FF Reserved 0x4002 2000 - 0x4002 23FF FMC 0x4002 1C00 - 0x4002 1FFF Reserved 0x4002 1800 - 0x4002 1BFF Reserved 0x4002 1400 - 0x4002 17FF Reserved 0x4002 1000 - 0x4002 13FF RCU 0x4002 0C00 - 0x4002 0FFF Reserved 0x4002 0800 - 0x4002 0BFF Reserved 0x4002 0400 - 0x4002 07FF DMA1 0x4002 0000 - 0x4002 03FF DMA0 0x4001 8400 - 0x4001 FFFF Reserved 0x4001 8000 - 0x4001 83FF SDIO 0x4001 7C00 - 0x4001 7FFF Reserved 0x4001 7800 - 0x4001 7BFF Reserved 12 / 52 GD32F303xx Pre-defined Regions Bus APB1 Address Peripherals 0x4001 7400 - 0x4001 77FF Reserved 0x4001 7000 - 0x4001 73FF Reserved 0x4001 6C00 - 0x4001 6FFF Reserved 0x4001 6800 - 0x4001 6BFF Reserved 0x4001 5C00 - 0x4001 67FF Reserved 0x4001 5800 - 0x4001 5BFF Reserved 0x4001 5400 - 0x4001 57FF TIMER10 0x4001 5000 - 0x4001 53FF TIMER9 0x4001 4C00 - 0x4001 4FFF TIMER8 0x4001 4800 - 0x4001 4BFF Reserved 0x4001 4400 - 0x4001 47FF Reserved 0x4001 4000 - 0x4001 43FF Reserved 0x4001 3C00 - 0x4001 3FFF ADC2 0x4001 3800 - 0x4001 3BFF USART0 0x4001 3400 - 0x4001 37FF TIMER7 0x4001 3000 - 0x4001 33FF SPI0 0x4001 2C00 - 0x4001 2FFF TIMER0 0x4001 2800 - 0x4001 2BFF ADC1 0x4001 2400 - 0x4001 27FF ADC0 0x4001 2000 - 0x4001 23FF GPIOG 0x4001 1C00 - 0x4001 1FFF GPIOF 0x4001 1800 - 0x4001 1BFF GPIOE 0x4001 1400 - 0x4001 17FF GPIOD 0x4001 1000 - 0x4001 13FF GPIOC 0x4001 0C00 - 0x4001 0FFF GPIOB 0x4001 0800 - 0x4001 0BFF GPIOA 0x4001 0400 - 0x4001 07FF EXTI 0x4001 0000 - 0x4001 03FF AFIO 0x4000 CC00 - 0x4000 FFFF Reserved 0x4000 C800 - 0x4000 CBFF CTC 0x4000 C400 - 0x4000 C7FF Reserved 0x4000 C000 - 0x4000 C3FF Reserved 0x4000 8000 - 0x4000 BFFF Reserved 0x4000 7C00 - 0x4000 7FFF Reserved 0x4000 7800 - 0x4000 7BFF Reserved 0x4000 7400 - 0x4000 77FF DAC 0x4000 7000 - 0x4000 73FF PMU 0x4000 6C00 - 0x4000 6FFF BKP 0x4000 6800 - 0x4000 6BFF CAN1 0x4000 6400 - 0x4000 67FF CAN0 13 / 52 GD32F303xx Pre-defined Regions Bus Address 0x4000 6000 - 0x4000 63FF SRAM AHB Peripherals Shared USBD/CAN SRAM 512 bytes 0x4000 5C00 - 0x4000 5FFF USBD 0x4000 5800 - 0x4000 5BFF I2C1 0x4000 5400 - 0x4000 57FF I2C0 0x4000 5000 - 0x4000 53FF UART4 0x4000 4C00 - 0x4000 4FFF UART3 0x4000 4800 - 0x4000 4BFF USART2 0x4000 4400 - 0x4000 47FF USART1 0x4000 4000 - 0x4000 43FF Reserved 0x4000 3C00 - 0x4000 3FFF SPI2/I2S2 0x4000 3800 - 0x4000 3BFF SPI1/I2S1 0x4000 3400 - 0x4000 37FF Reserved 0x4000 3000 - 0x4000 33FF FWDGT 0x4000 2C00 - 0x4000 2FFF WWDGT 0x4000 2800 - 0x4000 2BFF RTC 0x4000 2400 - 0x4000 27FF Reserved 0x4000 2000 - 0x4000 23FF TIMER13 0x4000 1C00 - 0x4000 1FFF TIMER12 0x4000 1800 - 0x4000 1BFF TIMER11 0x4000 1400 - 0x4000 17FF TIMER6 0x4000 1000 - 0x4000 13FF TIMER5 0x4000 0C00 - 0x4000 0FFF TIMER4 0x4000 0800 - 0x4000 0BFF TIMER3 0x4000 0400 - 0x4000 07FF TIMER2 0x4000 0000 - 0x4000 03FF TIMER1 0x2007 0000 - 0x3FFF FFFF Reserved 0x2006 0000 - 0x2006 FFFF Reserved 0x2003 0000 - 0x2005 FFFF Reserved 0x2002 0000 - 0x2002 FFFF Reserved 0x2001 C000 - 0x2001 FFFF Reserved 0x2001 8000 - 0x2001 BFFF 0x2000 5000 - 0x2001 7FFF SRAM 0x2000 0000 - 0x2000 4FFF Code AHB 0x1FFF F810 - 0x1FFF FFFF Reserved 0x1FFF F800 - 0x1FFF F80F Option Bytes 0x1FFF F000 - 0x1FFF F7FF 0x1FFF C010 - 0x1FFF EFFF 0x1FFF C000 - 0x1FFF C00F Boot loader 0x1FFF B000 - 0x1FFF BFFF 14 / 52 GD32F303xx Pre-defined Regions Bus Address Peripherals 0x1FFF 7A10 - 0x1FFF AFFF Reserved 0x1FFF 7800 - 0x1FFF 7A0F Reserved 0x1FFF 0000 - 0x1FFF 77FF Reserved 0x1FFE C010 - 0x1FFE FFFF Reserved 0x1FFE C000 - 0x1FFE C00F Reserved 0x1001 0000 - 0x1FFE BFFF Reserved 0x1000 0000 - 0x1000 FFFF Reserved 0x083C 0000 - 0x0FFF FFFF Reserved 0x0830 0000 - 0x083B FFFF Reserved 0x0810 0000 - 0x082F FFFF 0x0802 0000 - 0x080F FFFF Main Flash 0x0800 0000 - 0x0801 FFFF 0x0030 0000 - 0x07FF FFFF 0x0010 0000 - 0x002F FFFF 0x0002 0000 - 0x000F FFFF Reserved Aliased to Main Flash or Boot loader 0x0000 0000 - 0x0001 FFFF 15 / 52 GD32F303xx 2.5 Clock tree Figure 7. GD32F303xx clock tree CTC CK_IRC48M CK_CTC 48 MHz IRC48M 48 MHz CK48MSEL USBD Prescaler 1,1.5,2,2.5 3,3.5,4 1 SCS[1:0] CK_USBD 0 (to USBD) CK_I2S CK_IRC8M 8 MHz IRC8M 1 I2S enable (by hardware) 00 0 /2 1 PLLPRESEL CK_IRC48M 1 ×2,3,4 …63 PLL PLLSEL PLLMF CK_PLL 10 CK_SYS 120 MHz max AHB Prescaler ÷1,2...512 CK_AHB 120 MHz max (to I2S1,2) CK_EXMC EXMC enable (by hardware) (to EXMC) HCLK 01 AHB enable (to AHB bus,Cortex-M4,SRAM,DMA,FMC) /1 or /2 CK_CST Clock Monitor 0 4-16 MHz HXTAL ÷8 (to Cortex-M4 SysTick) PREDV0 FCLK (free running clock) CK_HXTAL CK_SDIO SDIO enable (by hardware) APB1 Prescaler ÷1,2,4,8,16 (to SDIO) CK_APB1 PCLK1 to APB1 peripherals 60 MHz max Peripheral enable /128 TIMER1,2,3,4,5,6, 11,12,13 if(APB1 prescale =1)x1 else x 2 11 32.768 KHz LXTAL CK_TIMERx TIMERx enable to TIMER1,2,3,4, 5,6,11,12,13 CK_RTC 01 (to RTC) 10 APB2 Prescaler ÷1,2,4,8,16 CK_APB2 PCLK2 to APB2 peripherals 120 MHz max Peripheral enable RTCSRC[1:0] 40 KHz IRC40K CK_FWDGT (to FWDGT) CK_OUT0 0xx 100 101 110 111 NO CLK CK_SYS CK_IRC8M CK_HXTAL /2 CK_PLL CKOUT0SEL[2:0] TIMER0,7,8,9,10 if(APB2 prescale =1)x1 else x 2 ADC Prescaler ÷2,4,6,8,12,1 6 ADC Prescaler ÷5,6,10,20 CK_TIMERx TIMERx enable to TIMER0,7,8,9,10 ADCPSC[3] 0 1 CK_ADCx to ADC0,1,2 40 MHz max Legend: HXTAL: High speed crystal oscillator LXTAL: Low speed crystal oscillator IRC8M: Internal 8M RC oscillators IRC48M: Internal 48M RC oscillators IRC32K: Internal 32K RC oscillator 16 / 52 GD32F303xx 2.6 Pin definitions Table 2. GD32F303xx pin definitions LQFP144 LQFP100 LQFP64 LQFP48 Pin Type(1) I/O(2) Level Pins PE2 1 1 - - I/O 5VT PE3 2 2 - - I/O 5VT PE4 3 3 - - I/O 5VT Pin Name Functions description Default: PE2 Alternate: TRACECK, EXMC_A23 Default: PE3 Alternate: TRACED0, EXMC_A19 Default: PE4 Alternate:TRACED1, EXMC_A20 Default: PE5 PE5 4 4 - - I/O 5VT Alternate:TRACED2, EXMC_A21 Remap: TIMER8_CH0 Default: PE6 PE6 5 5 - - I/O 5VT Alternate:TRACED3, EXMC_A22 Remap: TIMER8_CH1 VBAT 6 6 1 1 P 7 7 2 2 I/O 8 8 3 3 I/O 9 9 4 4 I/O PC13TAMPERRTC PC14OSC32_IN PC15OSC32_OUT Default: VBAT Default: PC13 Alternate: TAMPER, RTC Default: PC14 Alternate: OSC32_IN Default: PC15 Alternate: OSC32_OUT Default: PF0 PF0 10 - - - I/O 5VT Alternate: EXMC_A0 Remap: CTC_SYNC Default: PF1 PF1 11 - - - I/O 5VT PF2 12 - - - I/O 5VT PF3 13 - - - I/O 5VT PF4 14 - - - I/O 5VT PF5 15 - - - I/O 5VT VSS_5 16 10 - - P Default: VSS_5 VDD_5 17 11 - - P Default: VDD_5 Alternate: EXMC_A1 Default: PF2 Alternate: EXMC_A2 Default: PF3 Alternate: EXMC_A3 Default: PF4 Alternate: EXMC_A4 Default: PF5 Alternate: EXMC_A5 Default: PF6 PF6 18 - - - I/O Alternate: ADC2_IN4, EXMC_NIORD Remap: TIMER9_CH0 17 / 52 GD32F303xx I/O(2) Level Pin Type(1) LQFP48 LQFP64 LQFP100 Pin Name LQFP144 Pins Functions description Default: PF7 PF7 19 - - - I/O Alternate: ADC2_IN5, EXMC_NREG Remap: TIMER10_CH0 Default: PF8 PF8 20 - - - I/O Alternate: ADC2_IN6, EXMC_NIOWR Remap: TIMER12_CH0 Default: PF9 PF9 21 - - - I/O Alternate: ADC2_IN7, EXMC_CD Remap: TIMER13_CH0 Default: PF10 PF10 22 - - - I/O OSC_IN 23 12 5 5 I OSC_OUT 24 13 6 6 O NRST 25 14 7 7 I/O PC0 26 15 8 - I/O PC1 27 16 9 - I/O PC2 28 17 10 - I/O PC3 29 18 11 - I/O VSSA 30 19 12 8 P Default: VSSA VREF- 31 20 - - P Default: VREF- VREF+ 32 21 - - P Default: VREF+ VDDA 33 22 13 9 P Default: VDDA Alternate: ADC2_IN8, EXMC_INTR Default: OSC_IN Remap: PD0 Default: OSC_OUT Remap: PD1 Default: NRST Default: PC0 Alternate: ADC012_IN10 Default: PC1 Alternate: ADC012_IN11 Default: PC2 Alternate: ADC012_IN12 Default: PC3 Alternate: ADC012_IN13 Default: PA0 PA0-WKUP 34 23 14 10 I/O Alternate: WKUP, USART1_CTS, ADC012_IN0, TIMER1_CH0_ETI, TIMER4_CH0, TIMER7_ETI PA1 35 24 15 11 I/O PA2 36 25 16 12 I/O Default: PA1 Alternate: USART1_RTS, ADC012_IN1, TIMER1_CH1, TIMER4_CH1 Default: PA2 Alternate: USART1_TX, ADC012_IN2, TIMER1_CH2, TIMER4_CH2, TIMER8_CH0, SPI0_IO2 Default: PA3 PA3 37 26 17 13 I/O Alternate: USART1_RX, ADC012_IN3, TIMER1_CH3, TIMER4_CH3, TIMER8_CH1, SPI0_IO3 VSS_4 38 27 18 - P Default: VSS_4 VDD_4 39 28 19 - P Default: VDD_4 PA4 40 29 20 14 I/O Default: PA4 18 / 52 GD32F303xx I/O(2) Level Pin Type(1) LQFP48 LQFP64 LQFP100 Pin Name LQFP144 Pins Functions description Alternate: SPI0_NSS, USART1_CK, ADC01_IN4, DAC_OUT0 Remap:SPI2_NSS, I2S2_WS PA5 41 30 21 15 I/O Default: PA5 Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1 Default: PA6 PA6 42 31 22 16 I/O Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0, TIMER7_BKIN, TIMER12_CH0 Remap: TIMER0_BKIN Default: PA7 PA7 43 32 23 17 I/O Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1, TIMER7_CH0_ON, TIMER13_CH0 Remap: TIMER0_CH0_ON PC4 44 33 24 - I/O PC5 45 34 25 - I/O PB0 46 35 26 18 I/O Default: PC4 Alternate: ADC01_IN14 Default: PC5 Alternate: ADC01_IN15 Default: PB0 Alternate: ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON Remap: TIMER0_CH1_ON Default: PB1 PB1 47 36 27 19 I/O Alternate: ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON Remap: TIMER0_CH2_ON I/O 5VT Default: PB2, BOOT1 PB2 48 37 28 20 PF11 49 - - - I/O 5VT PF12 50 - - - I/O 5VT VSS_6 51 - - - P Default: VSS_6 VDD_6 52 - - - P Default: VDD_6 PF13 53 - - - I/O 5VT PF14 54 - - - I/O 5VT PF15 55 - - - I/O 5VT PG0 56 - - - I/O 5VT PG1 57 - - - I/O 5VT Default: PF11 Alternate: EXMC_NIOS16 Default: PF12 Alternate: EXMC_A6 Default: PF13 Alternate: EXMC_A7 Default: PF14 Alternate: EXMC_A8 Default: PF15 Alternate: EXMC_A9 Default: PG0 Alternate: EXMC_A10 Default: PG1 Alternate: EXMC_A11 Default: PE7 PE7 58 38 - - I/O 5VT Alternate: EXMC_D4 Remap: TIMER0_ETI 19 / 52 GD32F303xx I/O(2) Level Pin Type(1) LQFP48 LQFP64 LQFP100 Pin Name LQFP144 Pins Functions description Default: PE8 PE8 59 39 - - I/O 5VT Alternate: EXMC_D5 Remap: TIMER0_CH0_ON Default: PE9 I/O 5VT Alternate: EXMC_D6 PE9 60 40 - - VSS_7 61 - - - P Default: VSS_7 VDD_7 62 - - - P Default: VDD_7 Remap: TIMER0_CH0 Default: PE10 PE10 63 41 - - I/O 5VT Alternate: EXMC_D7 Remap: TIMER0_CH1_ON Default: PE11 PE11 64 42 - - I/O 5VT Alternate: EXMC_D8 Remap: TIMER0_CH1 Default: PE12 PE12 65 43 - - I/O 5VT Alternate: EXMC_D9 Remap: TIMER0_CH2_ON Default: PE13 PE13 66 44 - - I/O 5VT Alternate: EXMC_D10 Remap: TIMER0_CH2 Default: PE14 PE14 67 45 - - I/O 5VT Alternate: EXMC_D11 Remap: TIMER0_CH3 Default: PE15 PE15 68 46 - - I/O 5VT Alternate: EXMC_D12 Remap: TIMER0_BKIN Default: PB10 PB10 69 47 29 21 I/O 5VT Alternate: I2C1_SCL, USART2_TX Remap: TIMER1_CH2 Default: PB11 PB11 70 48 30 22 I/O 5VT Alternate: I2C1_SDA, USART2_RX Remap: TIMER1_CH3 VSS_1 71 49 31 23 P Default: VSS_1 VDD_1 72 50 32 24 P Default: VDD_1 PB12 73 51 33 25 Default: PB12 I/O 5VT Alternate: SPI1_NSS, I2C1_SMBA, USART2_CK, TIMER0_BKIN, I2S1_WS PB13 74 52 34 26 I/O 5VT Default: PB13 Alternate: SPI1_SCK, USART2_CTS, TIMER0_CH0_ON, I2S1_CK Default: PB14 PB14 75 53 35 27 I/O 5VT Alternate: SPI1_MISO, USART2_RTS, TIMER0_CH1_ON, TIMER11_CH0 20 / 52 GD32F303xx LQFP100 LQFP64 LQFP48 Pin Type(1) PB15 LQFP144 Pin Name I/O(2) Level Pins 76 54 36 28 I/O 5VT Functions description Default: PB15 Alternate: SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD, TIMER11_CH1 Default: PD8 PD8 77 55 - - I/O 5VT Alternate: EXMC_D13 Remap: USART2_TX Default: PD9 PD9 78 56 - - I/O 5VT Alternate: EXMC_D14 Remap: USART2_RX Default: PD10 PD10 79 57 - - I/O 5VT Alternate: EXMC_D15 Remap: USART2_CK Default: PD11 PD11 80 58 - - I/O 5VT Alternate: EXMC_A16 Remap: USART2_CTS Default: PD12 PD12 81 59 - - I/O 5VT Alternate: EXMC_A17 Remap: TIMER3_CH0, USART2_RTS Default: PD13 PD13 82 60 - - I/O 5VT Alternate: EXMC_A18 Remap: TIMER3_CH1 VSS_8 83 - - - P Default: VSS_8 VDD_8 84 - - - P Default: VDD_8 PD14 85 61 - - Default: PD14 I/O 5VT Alternate: EXMC_D0 Remap: TIMER3_CH2 Default: PD15 PD15 86 62 - - I/O 5VT Alternate: EXMC_D1 Remap: TIMER3_CH3, CTC_SYNC Default: PG2 PG2 87 - - - I/O 5VT PG3 88 - - - I/O 5VT PG4 89 - - - I/O 5VT PG5 90 - - - I/O 5VT PG6 91 - - - I/O 5VT PG7 92 - - - I/O 5VT PG8 93 - - - I/O 5VT Default: PG8 VSS_9 94 - - - P Alternate: EXMC_A12 Default: PG3 Alternate: EXMC_A13 Default: PG4 Alternate: EXMC_A14 Default: PG5 Alternate: EXMC_A15 Default: PG6 Alternate: EXMC_INT1 Default: PG7 Alternate: EXMC_INT2 Default: VSS_9 21 / 52 GD32F303xx LQFP100 LQFP64 LQFP48 Pin Type(1) VDD_9 95 - - - P PC6 96 63 37 - Pin Name I/O(2) Level LQFP144 Pins Functions description Default: VDD_9 Default: PC6 I/O 5VT Alternate: I2S1_MCK, TIMER7_CH0, SDIO_D6 Remap: TIMER2_CH0 Default: PC7 PC7 97 64 38 - I/O 5VT Alternate: I2S2_MCK, TIMER7_CH1, SDIO_D7 Remap: TIMER2_CH1 Default: PC8 PC8 98 65 39 - I/O 5VT Alternate: TIMER7_CH2, SDIO_D0 Remap: TIMER2_CH2 Default: PC9 PC9 99 66 40 - I/O 5VT Alternate: TIMER7_CH3, SDIO_D1 Remap: TIMER2_CH3 Default: PA8 PA8 100 67 41 29 I/O 5VT Alternate: USART0_CK, TIMER0_CH0, CK_OUT0, VCORE, CTC_SYNC Default: PA9 PA9 101 68 42 30 I/O 5VT PA10 102 69 43 31 I/O 5VT PA11 103 70 44 32 I/O 5VT PA12 104 71 45 33 I/O 5VT PA13 105 72 46 34 I/O 5VT NC 106 73 - - VSS_2 107 74 47 35 P Default: VSS_2 VDD_2 108 75 48 36 P Default: VDD_2 PA14 109 76 49 37 Alternate: USART0_TX, TIMER0_CH1 Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP Default: JTMS, SWDIO Remap: PA13 - I/O 5VT Default: JTCK, SWCLK Remap: PA14 Default: JTDI PA15 110 77 50 38 I/O 5VT Alternate: SPI2_NSS, I2S2_WS Remap: TIMER1_CH0_ETI, PA15, SPI0_NSS Default: PC10 PC10 111 78 51 - I/O 5VT Alternate: UART3_TX, SDIO_D2 Remap: USART2_TX, SPI2_SCK, I2S2_CK Default: PC11 PC11 112 79 52 - I/O 5VT Alternate: UART3_RX, SDIO_D3 Remap: USART2_RX, SPI2_MISO PC12 113 80 53 - I/O 5VT Default: PC12 Alternate: UART4_TX, SDIO_CK 22 / 52 GD32F303xx I/O(2) Level Pin Type(1) LQFP48 LQFP64 LQFP100 Pin Name LQFP144 Pins Functions description Remap: USART2_CK, SPI2_MOSI, I2S2_SD Default: PD0 PD0 114 81 - - I/O 5VT Alternate: EXMC_D2 Remap: CAN0_RX, OSC_IN Default: PD1 PD1 115 82 - - I/O 5VT Alternate: EXMC_D3 Remap: CAN0_TX, OSC_OUT PD2 116 83 54 - I/O 5VT Default: PD2 Alternate: TIMER2_ETI, SDIO_CMD, UART4_RX Default: PD3 PD3 117 84 - - I/O 5VT Alternate: EXMC_CLK Remap: USART1_CTS Default: PD4 PD4 118 85 - - I/O 5VT Alternate: EXMC_NOE Remap: USART1_RTS Default: PD5 PD5 119 86 - - I/O 5VT Alternate: EXMC_NWE Remap: USART1_TX VSS_10 120 - - - Default: VSS_10 VDD_10 121 - - - Default: VDD_10 - - I/O 5VT Alternate: EXMC_NWAIT Default: PD6 PD6 122 87 Remap: USART1_RX Default: PD7 PD7 123 88 - - I/O 5VT Alternate: EXMC_NE0, EXMC_NCE1 Remap: USART1_CK Default: PG9 PG9 124 - - - I/O 5VT PG10 125 - - - I/O 5VT PG11 126 - - - I/O 5VT PG12 127 - - - I/O 5VT PG13 128 - - - I/O 5VT PG14 129 - - - I/O 5VT VSS_11 130 - - - P Default: VSS_11 VDD_11 131 - - - P Default: VDD_11 PG15 132 - - - I/O 5VT Default: PG15 55 39 I/O 5VT Default: JTDO PB3 133 89 Alternate: EXMC_NE1, EXMC_NCE2 Default: PG10 Alternate: EXMC_NCE3_0, EXMC_NE2 Default: PG11 Alternate: EXMC_NCE3_1 Default: PG12 Alternate: EXMC_NE3 Default: PG13 Alternate: EXMC_A24 Default: PG14 Alternate: EXMC_A25 23 / 52 GD32F303xx I/O(2) Level Pin Type(1) LQFP48 LQFP64 LQFP100 Pin Name LQFP144 Pins Functions description Alternate:SPI2_SCK, I2S2_CK Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK Default: NJTRST PB4 134 90 56 40 I/O 5VT Alternate: SPI2_MISO Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 PB5 135 91 57 41 I/O Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 136 92 58 42 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0 Remap: USART0_TX, SPI0_IO2 Default: PB7 PB7 137 93 59 43 I/O 5VT Alternate: I2C0_SDA , TIMER3_CH1, EXMC_NADV Remap: USART0_RX, SPI0_IO3 BOOT0 138 94 60 44 I Default: BOOT0 Default: PB8 PB8 139 95 61 45 I/O 5VT Alternate: TIMER3_CH2, SDIO_D4, TIMER9_CH0 Remap: I2C0_SCL, CAN0_RX Default: PB9 PB9 140 96 62 46 I/O 5VT Alternate: TIMER3_CH3, SDIO_D5, TIMER10_CH0 Remap: I2C0_SDA, CAN0_TX Default: PE0 PE0 141 97 - - I/O 5VT PE1 142 98 - - I/O 5VT VSS_3 143 99 63 47 P Default: VSS_3 VDD_3 144 100 64 48 P Default: VDD_3 Alternate: TIMER3_ETI, EXMC_NBL0 Default: PE1 Alternate: EXMC_NBL1 Notes: 1. Type: I = input, O = output, P = power. 2. I/O Level: 5VT = 5 V tolerant. 24 / 52 GD32F303xx 3 Functional description 3.1 ARM® Cortex®-M4 core The ARM® Cortex®-M4 processor is a high performance embedded processor with DSP instructions which allow efficient signal processing and complex algorithm execution. It brings an efficient, easy-to-use blend of control and signal processing capabilities to meet the digital signal control markets demand. The processor is highly configurable enabling a wide range of implementations from those requiring floating point operations, memory protection and powerful trace technology to cost sensitive devices requiring minimal area, while delivering outstanding computational performance and an advanced system response to interrupts. 32-bit ARM® Cortex®-M4 processor core  Up to 120 MHz operation frequency  Single-cycle multiplication and hardware divider  Floating Point Unit (FPU)  Integrated DSP instructions  Integrated Nested Vectored Interrupt Controller (NVIC)  24-bit SysTick timer The Cortex®-M4 processor is based on the ARMv7-M architecture and supports both Thumb and Thumb-2 instruction sets. Some system peripherals listed below are also provided by Cortex®-M4:  Internal Bus Matrix connected with ICode bus, DCode bus, system bus, Private Peripheral Bus (PPB) and debug accesses (AHB-AP)  Nested Vectored Interrupt Controller (NVIC)  Flash Patch and Breakpoint (FPB)  Data Watchpoint and Trace (DWT)  Instrument Trace Macrocell (ITM)  Memory Protection Unit (MPU)  Serial Wire JTAG Debug Port (SWJ-DP)  Trace Port Interface Unit (TPIU) 25 / 52 GD32F303xx 3.2 On-chip memory  Up to 3072 Kbytes of Flash memory, including code Flash and data Flash  Up to 96 KB of SRAM The ARM® Cortex®-M4 processor is structured in Harvard architecture which can use separate buses to fetch instructions and load/store data. 3072 Kbytes of inner Flash at most, which includes code Flash that available for storing programs and data, and accessed (R/W) at CPU clock speed with zero wait states. An extra data Flash is also included for storing data mainly. The Figure of GD32F303xx memory map shows the memory of the GD32F303xx series of devices, including Flash, SRAM, peripheral, and other pre-defined regions. 3.3 Clock, reset and supply management  Internal 8 MHz factory-trimmed RC and external 4 to 32 MHz crystal oscillator  Internal 48 MHz RC oscillator  Internal 32 KHz RC calibrated oscillator and external 32.768 KHz crystal oscillator  2.6 to 3.6 V application supply and I/Os  Supply Supervisor: POR (Power On Reset), PDR (Power Down Reset), and low voltage detector (LVD) The Clock Control Unit (CCU) provides a range of oscillator and clock functions. These include internal RC oscillator and external crystal oscillator, high speed and low speed two types. Several prescalers allow the frequency configuration of the AHB and two APB domains. The maximum frequency of the two AHB domains are 120 MHz. The maximum frequency of the two APB domains including APB1 is 60 MHz and APB2 is 120 MHz. See Figure 6 for details on the clock tree. The Reset Control Unit (RCU) controls three kinds of reset: system reset resets the processor core and peripheral IP components. Power-on reset (POR) and power-down reset (PDR) are always active, and ensures proper operation starting from/down to 2.6 V. The device remains in reset mode when VDD is below a specified threshold. The embedded low voltage detector (LVD) monitors the power supply, compares it to the voltage threshold and generates an interrupt as a warning message for leading the MCU into security. Power supply schemes:  VDD range: 2.6 to 3.6 V, external power supply for I/Os and the internal regulator. Provided externally through VDD pins.  VSSA, VDDA range: 2.6 to 3.6 V, external analog power supplies for ADC, reset blocks, RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.  VBAT range: 1.8 to 3.6 V, power supply for RTC, external clock 32 kHz oscillator and backup registers (through power switch) when VDD is not present. 26 / 52 GD32F303xx 3.4 Boot modes At startup, boot pins are used to select one of three boot options:  Boot from main flash memory (default)  Boot from system memory  Boot from on-chip SRAM The boot loader is located in the internal boot ROM memory (system memory). It is used to reprogram the Flash memory by using USART0, USART1, in device mode. It also can be used to transfer and update the Flash memory code, the data and the vector table sections. In default condition, boot from bank 1 of Flash memory is selected. It also supports to boot from bank 2 of Flash memory by setting a bit in option bytes. 3.5 Power saving modes The MCU supports three kinds of power saving modes to achieve even lower power consumption. They are Sleep mode, Deep-sleep mode, and Standby mode. These operating modes reduce the power consumption and allow the application to achieve the best balance between the CPU operating time, speed and power consumption.  Sleep mode In sleep mode, only the clock of CPU core is off. All peripherals continue to operate and any interrupt/event can wake up the system.  Deep-sleep mode In Deep-sleep mode, all clocks in the 1.2V domain are off, and all of the high speed crystal oscillator (IRC8M, HXTAL) and PLL are disabled. Only the contents of SRAM and registers are retained. Any interrupt or wakeup event from EXTI lines can wake up the system from the Deep-sleep mode including the 23 external lines, the RTC alarm, the LVD output, and USB wakeup. When exiting the Deep-sleep mode, the IRC8M is selected as the system clock.  Standby mode In Standby mode, the whole 1.2V domain is power off, the LDO is shut down, and all of IRC8M, HXTAL and PLL are disabled. The contents of SRAM and registers (except Backup Registers) are lost. There are four wakeup sources for the Standby mode, including the external reset from NRST pin, the RTC, the FWDG reset, and the rising edge on WKUP pin. 27 / 52 GD32F303xx 3.6 Analog to digital converter (ADC)  12-bit SAR ADC's conversion rate is up to 2.6MSPS  12-bit, 10-bit, 8-bit or 6-bit configurable resolution  Hardware oversampling ratio adjustable from 2 to 256x improves resolution to 16-bit  Input voltage range: VSSA to VDDA (2.6 to 3.6 V)  Temperature sensor Up to three 12-bit 2.6MSPS multi-channel ADCs are integrated in the device. It has a total of 18 multiplexed channels: 16 external channels, 1 channel for internal temperature sensor (VSENSE), 1 channel for internal reference voltage (VREFINT). The input voltage range is between 2.6 V and 3.6 V. An on-chip hardware oversampling scheme improves performance while offloading the related computational burden from the CPU. An analog watchdog block can be used to detect the channels, which are required to remain within a specific threshold window. A configurable channel management block can be used to perform conversions in single, continuous, scan or discontinuous mode to support more advanced use. The ADC can be triggered from the events generated by the general-purpose level 0 timers (TMx) and the advanced-control timers (TM0 and TM7) with internal connection. The temperature sensor can be used to generate a voltage that varies linearly with temperature. It is internally connected to the ADC_IN16 input channel which is used to convert the sensor output voltage in a digital value. 3.7 Digital to analog converter (DAC)  Two 12-bit DACs with independent output channels  8-bit or 12-bit mode in conjunction with the DMA controller The two 12-bit buffered DACs are used to generate variable analog outputs. The DAC channels can be triggered by the timer or EXTI with DMA support. In dual DAC channel operation, conversions could be done independently or simultaneously. The maximum output value of the DAC is VREF+. 28 / 52 GD32F303xx 3.8 DMA  7 channel DMA 1 controller and 5 channel DMA 2 controller  Peripherals supported: Timers, ADC, SPIs, I2Cs, USARTs, DAC, I2S The flexible general-purpose DMA controllers provide a hardware method of transferring data between peripherals and/or memory without intervention from the CPU, thereby freeing up bandwidth for other system functions. Four types of access method are supported: peripheral to peripheral, peripheral to memory, memory to peripheral, memory to memory Each channel is connected to fixed hardware DMA requests. The priorities of DMA channel requests are determined by software configuration and hardware channel number. Transfer size of source and destination are independent and configurable. 3.9 General-purpose inputs/outputs (GPIOs)  Up to 112 fast GPIOs, all mappable on 16 external interrupt vectors (EXTI)  Analog input/output configurable  Alternate function input/output configurable There are up to 112 general purpose I/O pins (GPIO) in GD32F303xx, named PA0 ~ PA15 and PB0 ~ PB15, PC0 ~ PC15, PD0 ~ PD15, PE0 ~ PE15, PF0-PF15, PG0-PG15 to implement logic input/output functions. Each of the GPIO ports has related control and configuration registers to satisfy the requirements of specific applications. The external interrupts on the GPIO pins of the device have related control and configuration registers in the External Interrupt Control Unit (EXTI). The GPIO ports are pin-shared with other alternative functions (AFs) to obtain maximum flexibility on the package pins. Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high-current capable except for analog inputs. 29 / 52 GD32F303xx 3.10 Timers and PWM generation  Two 16-bit advanced-control timer (TM0 & TM7), ten 16-bit general-purpose timers (TM1 ~ TM4, TM8 ~ TM13), and two 16-bit basic timer (TM5 & TM6)  Up to 4 independent channels of PWM, output compare or input capture for each generalpurpose timer (GPTM) and external trigger input  16-bit, motor control PWM advanced-control timer with programmable dead-time generation for output match  Encoder interface controller with two inputs using quadrature decoder  24-bit SysTick timer down counter  2 watchdog timers (Free watchdog and window watchdog) The advanced-control timer (TM0 & TM7) can be used as a three-phase PWM multiplexed on 6 channels. It has complementary PWM outputs with programmable dead-time generation. It can also be used as a complete general-purpose timer. The 4 independent channels can be used for input capture, output compare, PWM generation (edge- or center-aligned counting modes) and single pulse mode output. If configured as a general-purpose 16-bit timer, it has the same functions as the TMx timer. It can be synchronized with external signals or to interconnect with other GPTMs together which have the same architecture and features. The general-purpose timer (GPTM), can be used for a variety of purposes including general time, input signal pulse width measurement or output waveform generation such as a single pulse generation or PWM output, up to 4 independent channels for input capture/output compare. TM1 ~ TM4 is based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. TM8 ~ TM13 is based on a 16-bit auto-reload upcounter and a 16-bit prescaler. The GPTM also supports an encoder interface with two inputs using quadrature decoder. The basic timer, known as TM5 & TM6, are mainly used for DAC trigger generation. They can also be used as a simple 16-bit time base. The GD32F303xx have two watchdog peripherals, Independent watchdog and window watchdog. They offer a combination of high safety level, flexibility of use and timing accuracy. The independent watchdog timer includes a 12-bit down-counting counter and a 8-bit prescaler, It is clocked from an independent 40 kHz internal RC and as it operates independently of the main clock, it can operate in stop and standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. The window watchdog is based on a 7-bit down counter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in debug mode. 30 / 52 GD32F303xx The SysTick timer is dedicated for OS, but could also be used as a standard down counter. It features: 3.11  A 24-bit down counter  Auto reload capability  Maskable system interrupt generation when the counter reaches 0  Programmable clock source Real time clock (RTC)  32-bit up-counter with a programmable 20-bit prescaler  Alarm function  Interrupt and wake-up event The real time clock is an independent timer which provides a set of continuously running counters which can be used with suitable software to provide a clock calendar function, and provides an alarm interrupt and an expected interrupt. The RTC features a 32-bit programmable counter for long-term measurement using the compare register to generate an alarm. A 20-bit prescaler is used for the time base clock and is by default configured to generate a time base of 1 second from a clock at 32.768 kHz from external crystal oscillator. 3.12 Inter-integrated circuit (I2C)  Up to two I2C bus interfaces can support both master and slave mode with a frequency up to 1 MHz (Fast mode plus)  Provide arbitration function, optional PEC (packet error checking) generation and checking  Supports 7-bit and 10-bit addressing mode and general call addressing mode The I2C interface is an internal circuit allowing communication with an external I2C interface which is an industry standard two line serial interface used for connection to external hardware. These two serial lines are known as a serial data line (SDA) and a serial clock line (SCL). The I2C module provides several data transfer rates: 100 KHz of standard mode, 400 KHz of the fast mode and 1 MHz of the fast mode plus . The I2C module also has an arbitration detect function to prevent the situation where more than one master attempts to transmit data to the I2C bus at the same time. A CRC-8 calculator is also provided in I2C interface to perform packet error checking for I2C data. 31 / 52 GD32F303xx 3.13 Serial peripheral interface (SPI)  Up to three SPI interfaces with a frequency of up to 30 MHz  Support both master and slave mode  Hardware CRC calculation and transmit automatic CRC error checking The SPI interface uses 4 pins, among which are the serial data input and output lines (MISO & MOSI), the clock line (SCK) and the slave select line (NSS). Both SPIs can be served by the DMA controller. The SPI interface may be used for a variety of purposes, including simplex synchronous transfers on two lines with a possible bidirectional data line or reliable communication using CRC checking. 3.14 Universal synchronous asynchronous receiver transmitter (USART)  Up to three USARTs and two UARTs with operating frequency up to 10.5 MHz  Supports both asynchronous and clocked synchronous serial communication modes  IrDA SIR encoder and decoder support  LIN break generation and detection  USARTs support ISO 7816-3 compliant smart card interface The USART (USART0, USART1 and USART2) and UART (UART3 & UART4) are used to translate data between parallel and serial interfaces, provides a flexible full duplex data exchange using synchronous or asynchronous transfer. It is also commonly used for RS-232 standard communication. The USART/UART includes a programmable baud rate generator which is capable of dividing the system clock to produce a dedicated clock for the USART transmitter and receiver. The USART/UART also supports DMA function for high speed data communication except UART4. 3.15 Inter-IC sound (I2S)  Two I2S bus Interfaces with sampling frequency from 8 kHz to 192 kHz  Support either master or slave mode The Inter-IC sound (I2S) bus provides a standard communication interface for digital audio applications by 3-wire serial lines. GD32F303xx contain two I2S-bus interfaces that can be operated with 16/32 bit resolution in master or slave mode, pin multiplexed with SPI1 and SPI2. The audio sampling frequency from 8 kHz to 192 kHz is supported. 32 / 52 GD32F303xx 3.16 Universal serial bus on-the-go full-speed (USB 2.0 FS)  One full-speed USB Interface with frequency up to 12 Mbit/s  Internal 48 MHz oscillator support crystal-less operation  Internal main PLL for USB CLK compliantly The Universal Serial Bus (USB) is a 4-wire bus with 4 bidirectional endpoints. The device controller enables 12 Mbit/s data exchange with integrated transceivers. Transaction formatting is performed by the hardware, including CRC generation and checking. It supports device modes. Transaction formatting is performed by the hardware, including CRC generation and checking. The status of a completed USB transfer or error condition is indicated by status registers. An interrupt is also generated if enabled. The required precise 48 MHz clock which can be generated from the internal main PLL (the clock source must use an HXTAL crystal oscillator) or by the internal 48 MHz oscillator in automatic trimming mode that allows crystal-less operation. 3.17 Controller area network (CAN)  Two CAN2.0B interface with communication frequency up to 1 Mbit/s  Internal main PLL for CAN CLK compliantly Controller area network (CAN) is a method for enabling serial communication in field bus. The CAN protocol has been used extensively in industrial automation and automotive applications. It can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. Each CAN has three mailboxes for transmission and two FIFOs of three message deep for reception. It also provides 28 scalable/configurable identifier filter banks for selecting the incoming messages needed and discarding the others. 3.18 Secure digital input and output card interface (SDIO)  Support SD2.0/SDIO2.0/MMC4.2 host interface The Secure Digital Input and Output Card Interface (SDIO) provides access to external SD memory cards specifications version 2.0, SDIO card specification version 2.0 and multi-media card system specification version 4.2 with DMA supported. In addition, this interface is also compliant with CE-ATA digital protocol rev1.1. 33 / 52 GD32F303xx 3.19 External memory controller (EXMC)  Supported external memory: SRAM, PSRAM, ROM and NOR-Flash, NAND Flash and CF card  Provide ECC calculating hardware module for NAND Flash memory block  Up to 16-bit data bus  Support to interface with Motorola 6800 and Intel 8080 type LCD directly External memory controller (EXMC) is an abbreviation of external memory controller. It is divided in to several sub-banks for external device support, each sub-bank has its own chip selection signal but at one time, only one bank can be accessed. The EXMC support code execution from external memory except NAND Flash and CF card. The EXMC also can be configured to interface with the most common LCD module of Motorola 6800 and Intel 8080 series and reduce the system cost and complexity. 3.20 Debug mode  Serial wire JTAG debug port (SWJ-DP) The ARM® SWJ-DP Interface is embedded and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. 3.21 Package and operation temperature  LQFP144 (GD32F303Zx), LQFP100 (GD32F303Vx), LQFP64 (GD32F303Rx) and  Operation temperature range: -40°C to +85°C (industrial level) LQFP48 (GD32F303Cx) 34 / 52 GD32F303xx 4 Electrical characteristics 4.1 Absolute maximum ratings The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly at the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute maximum ratings Symbol Min Max Unit VDD External voltage range VSS - 0.3 VSS + 3.6 V VDDA External analog supply voltage VSSA - 0.3 VSSA + 3.6 V VBAT External battery supply voltage VSS - 0.3 VSS + 3.6 V Input voltage on 5V tolerant pin VSS - 0.3 VDD + 4.0 V Input voltage on other I/O VSS - 0.3 4.0 V Variations between different VDD power pins — 50 mV Variations between different ground pins — 50 mV IIO Maximum current for GPIO pins — 25 mA TA Operating temperature range -40 +85 °C Storage temperature range -55 +150 °C Maximum junction temperature — 125 °C VIN |ΔVDDx| |VSSX −VSS| TSTG TJ 4.2 Parameter Recommended DC characteristics Table 4. DC operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD Supply voltage — 2.6 3.3 3.6 V VDDA Analog supply voltage Same as VDD 2.6 3.3 3.6 V VBAT Battery supply voltage — 1.8 — 3.6 V 35 / 52 GD32F303xx 4.3 Power consumption The power measurements specified in the tables represent that code with data executing from on-chip Flash with the following specifications. Table 5. Power consumption characteristics Symbol Parameter Conditions VDD=VDDA=3.3V, HXTAL=25MHz, System Min Typ Max Unit — 45.6 — mA — 25.0 — mA -— 42.5 — mA — 22.5 — mA — 44.9 — mA — 13.86 — mA — 208 — μA — 180 — μA — 5.10 — μA — 4.90 — μA — 4.30 — μA — 1.78 — μA — 1.48 — μA — 1.16 — μA — 1.11 — μA clock=120MHz, All peripherals enabled VDD=VDDA=3.3V, HXTAL =25MHz, System Supply current clock =120MHz, All peripherals disabled (Run mode) VDD=VDDA=3.3V, HXTAL =25MHz, System clock =108MHz, All peripherals enabled VDD=VDDA=3.3V, HXTAL =25MHz, System Clock =108MHz, All peripherals disabled VDD=VDDA=3.3V, HXTAL =25MHz, CPU clock off, System clock=120MHz, All Supply current peripherals enabled (Sleep mode) VDD=VDDA=3.3V, HXTAL =25MHz, CPU clock off, System clock=120MHz, All IDD peripherals disabled VDD=VDDA=3.3V, Regulator in run mode, Supply current (Deep-Sleep mode) IRC32K on, RTC on, All GPIOs analog mode VDD=VDDA=3.3V, Regulator in low power mode, IRC32K on, RTC on, All GPIOs analog mode VDD=VDDA=3.3V, LXTAL off, IRC32K on, RTC on Supply current VDD=VDDA=3.3V, LXTAL off, IRC32K on, (Standby mode) RTC off VDD=VDDA=3.3V, LXTAL off, IRC32K off, RTC off VDD not available, VBAT=3.6 V, LXTAL on with external crystal, RTC on, Higher driving VDD not available, VBAT=3.3 V, LXTAL on with external crystal, RTC on, Higher IBAT Battery supply current driving VDD not available, VBAT=2.6 V, LXTAL on with external crystal, RTC on, Higher driving VDD not available, VBAT=3.6 V, LXTAL on with external crystal, RTC on, Lower driving 36 / 52 GD32F303xx Symbol Parameter Conditions Min Typ — 0.83 — μA — 0.51 — μA VDD not available, VBAT=3.3 V, LXTAL on with external crystal, RTC on, Lower driving VDD not available, VBAT=2.6 V, LXTAL on with external crystal, RTC on, Lower driving 4.4 Max Unit EMC characteristics EMS (electromagnetic susceptibility) includes ESD (Electrostatic discharge, positive and negative) and FTB (Burst of Fast Transient voltage, positive and negative) testing result is given in the following table, based on the EMS levels and classes compliant with IEC 61000 series standard. Table 6. EMS characteristics Symbol VESD Parameter Conditions Voltage applied to all device pins to VDD = 3.3 V, TA = +25 °C induce a functional disturbance conforms to IEC 61000-4-2 Fast transient voltage burst applied to VFTB induce a functional disturbance through 100 pF on VDD and VSS pins Level/Class 3B VDD = 3.3 V, TA = +25 °C 4A conforms to IEC 61000-4-4 EMI (Electromagnetic Interference) emission testing result is given in the following table, compliant with IEC 61967-2 standard which specifies the test board and the pin loading. Table 7. EMI characteristics Symbol Parameter Conditions VDD = 5.0 V, SEMI Peak level TA = +25 °C, compliant with IEC 61967-2 Tested frequency band Conditions Unit 24M 48M 0.1 to 2 MHz