MSB10B THRU MSB10M
1A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
FEATURES:
PINNING
• Glass Passivated Chip Junction
PIN
• Reverse Voltage - 100 to 1000 V
DESCRIPTION
1
Output Anode(+)
2
Output Cathode(-)
• High Surge Current Capability
3
Input Pin(~)
• Designed for Surface Mount Application
4
Input Pin(~)
• Forward Current - 1.0 A
1
(1)
(2)
-
MECHANICAL DATA
• Case: UMSB
• Terminals: Solderable per MIL-STD-750, Method 2026
+
2
4
• A pprox. Weight: 0.234g / 0.00825oz
~
~
(4)
(3)
3
UMSB Package
Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %.
Symbols MSB10B
Parameter
MSB10D MSB10G
MSB10J
MSB10K MSB10M
Units
Maximum Repetitive Peak Reverse Voltage
V RRM
100
200
400
600
800
1000
V
Maximum RMS voltage
V RMS
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
V DC
100
200
400
600
800
1000
V
Average Rectified Output Current
IO
1.0
A
Peak Forward Surge Current 8.3 ms Single Half
Sine Wave Superimposed on Rated Load
(JEDEC Method)
I FSM
35
A
Maximum Forward Voltage at 1.0 A
VF
1.1
V
IR
5
100
μA
Cj
18
pF
RθJA
RθJC
RθJL
70
15
40
°C/W
T j , T stg
-55 ~ +150
°C
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@ T A =25 °C
@ T A =125 °C
Typical Junction Capacitance(Note1)
Typical Thermal Resistance(Note2)
Operating and Storage Temperature Range
Note: 1. Measured at 1MHz and applied reverse voltage of 4 V D.C.
2. Mounted on glass epoxy PC board with 4×1.5"×1.5"(3.81×3.81 cm)copper pad.
2018.01
UMSB-A-MSB10B~MSB10M-1A1KV
Page 1 of 3
MSB10B THRU MSB10M
Fig.2 Typical Reverse Characteristics
1.25
1.00
0.75
0.50
0.25
Resistive or Inductive Load
0.00
25
50
75
100
125
150
175
Instaneous Reverse Current(μ A)
Average Rectified Output Current (A)
Fig.1 Average Rectified Output Current
Derating Curve
100
T J =125°C
10
1.0
T J =25°C
0.1
00
Case Temperature (°C)
T J =25°C
1.0
0.1
pulse with 300μs
1% duty cycle
0.01
0.0
1.0
1.5
2.0
120
140
T J =25°C
0.1
49
42
35
28
21
14
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
10
1.0
10
100
Reverse Voltage (V)
100
Transient Thermal Impedance( °C /W)
Peak Forward Surage Current (A)
100
10
Fig.6- Typical Transient Thermal Impedance
100
10
Number of Cycles
2018.01
80
1
0.5
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
1
60
100
Instaneous Forward Voltage (V)
07
40
Fig.4 Typical Junction Capacitance
Junction Capacitance ( pF)
Instaneous Forward Current (A)
Fig.3 Typical Instaneous Forward
Characteristics
10
20
percent of Rated Peak Reverse Voltage (%)
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
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Page 2 of 3
MSB10B THRU MSB10M
PACKAGE OUTLINE
Plastic surface mounted package; 4 leads
UMSB
E
C
A
e
D
b
L
∠ALL ROUND
E1
VM
A
UMSB mechanical data
A
C
D
E
E1
L
e
b
max
1.5
0.29
7.0
7.6
8.9
1.6
5.3
1.15
min
1.3
0.17
6.2
7.1
8.4
1.0
4.9
0.95
max
59
12
276
299
350
55
209
45
min
51
7
244
280
331
31.5
193
37
UNIT
∠
mm
10°
mil
The recommended mounting pad size
Marking
5.1
201
1.3×1. 8
51×71
Unit: mm
(mil)
2018.01
JD802255B0
Type number
Marking code
MSB10B
MB10B
MSB10D
MB10D
MSB10G
MB10G
MSB10J
MB10J
MSB10K
MB10K
MSB10M
MB10M
Page 3 of 3
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