VS3618AE
30V/50A N-Channel Advanced Power MOSFET
Features
V DS
30
V
R DS(on),TYP@ VGS=10 V
6
mΩ
R DS(on),TYP@ VGS=4.5 V
9
mΩ
ID
50
A
N-Channel,5V Logic Level Control
Enhancement mode
Very low on-resistance RDS(on) @ VGS=4.5 V
PDFN3333
Fast Switching
100% Avalanche test
Pb-free lead plating; RoHS compliant
Part ID
Package Type
Marking
VS3618AE
PDFN3333
3618AE
Tape and reel
information
5000PCS/Reel
Maximum ratings, at TA =25°C, unless otherwise specified
Symbol
Parameter
Rating
Unit
V(BR)DSS
Drain-Source breakdown voltage
30
V
VGS
Gate-Source voltage
±20
V
IS
Diode continuous forward current
TC =25°C
50
A
TC =25°C
50
A
ID
Continuous drain current @VGS=10V
TC =100°C
31
A
TC =25°C
200
A
TA=25°C
17
A
TA=70°C
14
A
25
mJ
IDM
Pulse drain current tested ①
IDSM
Continuous drain current @VGS=10V
EAS
Avalanche energy, single pulsed ②
PD
Maximum power dissipation
TC =25°C
30
W
PDSM
Maximum power dissipation ③
TA=25°C
3.6
W
TSTG , TJ
Storage and junction temperature range
-55 to 150
°C
Typical
Unit
Thermal Characteristics
Symbol
Parameter
R JC
Thermal Resistance, Junction-to-Case
4.1
°C/W
R JA
Thermal Resistance, Junction-to-Ambient
35
°C/W
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
www.vgsemi.com
VS3618AE
30V/50A N-Channel Advanced Power MOSFET
Electrical Characteristics
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Static Electrical Characteristics @ Tj=25°C (unless otherwise stated)
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
30
--
--
V
Zero Gate Voltage Drain Current
VDS=30V,VGS=0V
--
--
0.1
μA
Zero Gate Voltage Drain Current( Tj =125℃)
VDS=30V,VGS=0V
--
--
100
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(TH)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1.0
1.8
2.5
V
RDS(ON)
Drain-Source On-State Resistance ④
VGS=10V, ID=15A
--
6
7
mΩ
RDS(ON)
Drain-Source On-State Resistance ④
VGS=4.5V, ID=10A
--
9
11
mΩ
--
1110
--
pF
--
180
--
pF
--
130
--
pF
--
1.9
--
Ω
--
23
--
nC
--
6.2
--
nC
--
8.9
--
nC
--
14
--
ns
V(BR)DSS
IDSS
Dynamic Electrical Characteristics @ Tj = 25°C (unless otherwise stated)
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=15V,VGS=0V,
f=1MHz
f=1MHz
VDS=15V,ID=15A,
VGS=10V
Switching Characteristics
t d(on)
Turn-on Delay Time
tr
Turn-on Rise Time
ID=15A,
--
27
--
ns
t d(off)
Turn-Off Delay Time
RG=6.8Ω,
--
65
--
ns
tf
Turn-Off Fall Time
--
19
--
ns
VDD=15V,
VGS=10V
Source- Drain Diode Characteristics@ Tj = 25°C (unless otherwise stated)
VSD
Forward on voltage
ISD=15A,VGS=0V
--
0.84
1.2
V
t rr
Reverse Recovery Time
Tj=25℃,Isd=15A,
--
31
--
ns
Qrr
Reverse Recovery Charge
--
95
--
nC
VGS=0V
di/dt=100A/μs
NOTE:
① Repetitive rating; pulse width limited by max junction temperature.
② Limited by TJmax, starting TJ = 25°C, L = 0.5mH, RG = 25Ω, IAS = 10A, VGS =10V. Part not recommended for use above this value
③The power dissipation PDSM is based on RθJA and the maximum allowed junction temperature of 150°C.
④ Pulse width ≤ 300μs; duty cycle≤ 2%.
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
www.vgsemi.com
VS3618AE
30V/50A N-Channel Advanced Power MOSFET
ID, Drain-Source Current (A)
VGS(TH), Gate -Source Voltage (V)
Typical Characteristics
VDS, Drain -Source Voltage (V)
Fig1. Typical Output Characteristics
Tj - Junction Temperature (°C)
Fig2. VGS(TH) Gate -Source Voltage Vs.Tj
Normalized On Resistance
ID, Drain-Source Current (A)
Tc, Case Temperature (°C)
Fig3. Typical Transfer Characteristics
Fig4. Normalized On-Resistance Vs. Tj
ID - Drain Current (A)
Tj - Junction Temperature (°C)
ISD, Reverse Drain Current (A)
VGS, Gate -Source Voltage (V)
VSD, Source-Drain Voltage (V)
Fig5. Typical Source-Drain Diode Forward Voltage
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
VDS, Drain -Source Voltage (V)
Fig6. Maximum Safe Operating Area
www.vgsemi.com
VS3618AE
30V/50A N-Channel Advanced Power MOSFET
C, Capacitance (pF)
VGS, Gate-Source Voltage (V)
Typical Characteristics
VDS , Drain-Source Voltage (V)
Fig8. Typical Gate Charge Vs.Gate-Source Voltage
Thermal Resistance
ZqJA Normalized Transient
Fig7. Typical Capacitance Vs.Drain-Source Voltage
Qg -Total Gate Charge (nC)
Pulse Width (s)
Fig9. Normalized Maximum Transient Thermal Impedance
Fig10. Unclamped Inductive Test Circuit and waveforms
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
Fig11. Switching Time Test Circuit and waveforms
www.vgsemi.com
VS3618AE
30V/50A N-Channel Advanced Power MOSFET
Marking Information
Vs
3618AE
XXXYWW
1st line: Vanguard Code(Vs)
2nd line:Part Number(3618AE)
3rd line:Date code (XXXYWW)
XXX:Wafer Lot Number
Y:Year Code,e.g. E means 2017
WW:Week Code
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
www.vgsemi.com
VS3618AE
30V/50A N-Channel Advanced Power MOSFET
PDFN3333 Package Outline Data
Symbol
DIMENSIONS ( unit : mm )
Min
Typ
Max
A
0.7
0.75
0.8
Notes:
b
0.25
0.3
0.35
1. Follow JEDEC MO-240 variation CA.
C
0.1
0.15
0.25
2. Dimensions "D1" and "E1" do NOT include mold flash
D
3.25
3.35
3.45
protrusions or gate burrs.
D1
3
3.1
3.2
3. Dimensions "D1" and "E1" include interterminal flash or
D2
1.78
1.88
1.98
protrusion. Interterminal flash or protrusion shall not exceed
D3
--
0.13
--
E
3.2
3.3
3.4
E1
3
3.15
3.2
E2
2.39
2.49
2.59
0.65 BSC
e
H
0.3
0.39
0.5
L
0.3
0.4
0.5
L1
--
0.13
--
θ
--
10°
12°
M
*
*
0.15
* Not specified
Copyright Vanguard Semiconductor Co., Ltd
Rev C – SEP, 2018
0.25mm per side.
Customer Service
Sales and Service:
sales@vgsemi.com
Vanguard Semiconductor CO., LTD
TEL: (86-755) -26902410
FAX: (86-755) -26907027
WEB: www.vgsemi.com
www.vgsemi.com