U263-241N-4BQC16

1.Contact Resistance:40mOHM Max.; 2.Dielectric Withstanding Voltage:100V AC For 1 Minute 3.Insulation Resistance:100M OHM Min.; 4.Mating And Unmating Force: Mating Force:5~20N Unmating Force:8~20N; 6~20N AFTER TEST: 5.Durability:10000 Cycles; 0.10 10.00 [0.394] coversize WITHOUT COVER WITH COVER 5.50 [0.216] 0.50 [0.020] 8.34 [0.328] 0.20 [0.008] 3 1 2 5.50 [0.216] A12 6.00 [0.236] 6.14 [0.242] 13.00 [0.512] (Size with cover) 12.00 [0.472] B12 11.00 [0.433] 0.30 [0.012]TYPE 4-1.30 [0.051] A1 4-0.80 [0.031] 1.40 [0.055] B12 B1 8.20 [0.323] 1.70 [0.067] RECOMMEND P.C.B LAYOUT(COMPONENT SIDE) 0.90 [0.036] Item Title Material Dispose Q'TY 1 Shell SUS304 Ni:30u" Min. 1PCS 2 GND Plate SUS301 3 Mid Plate SUS301 2PCS 1PCS Mating Area:See P/N Solder Tails:Matt Tin 2PCS 4 Contact C7025 5 InsertMolding LCP E6808 UL 94V-0 Black 1PCS 6 COVER LCP E6808 UL 94V-0 Black 1PCS TOLERANCE FOR PCB LAYOUT IS ± 0.05 KEEP OUT AREA 8.20 [0.323] X X X DATE DESCRIPTION REVISIONS www.xk-dg.cn Mating Area plating 01:Au 1u"Min. 03:Au 3u"Min. 05:Au 5u"Min. 10:Au 10u"Min. 15:Au 15u"Min. 30:Au 30u"Min. 5 0.50 [0.020] MARK U263-24XN-4BQC16 7.00 [0.275] B1 4 6 9.45 [0.372] A1 6.14 [0.242] 2.56 [0.101] 4.00 [0.157] (coversize) A12 www.helloxkb.com REVISED APPROVED ANGLAR L≤4 4