A71-05H3-111N1

2 3 16.10 [0.634] XKB CONNECITITY 2.23 [0.088] 9*1=9.00 [0.354] 2.00 [0.079] 1.95 [0.077] 1.20 [0.047] 4.60 [0.181] 10.80 [0.425] FLANGE 0.10 0.62 [0.025] 14.00 [0.551] SPECIFICATIONS 1.OPERATINGCURRENT:0.5A MAX. 2.OPERATION TEMPERATURE:-25℃ TO +85℃ 3.DIELECTRICWITHSTANDING VOLTAGE: 500Volts AC BETWEEN ADIACENT TERMINAL(UNMATE) 300Volts AC BETWEEN ADIACENT TERMINAL(MATE) 4.INSULATION RESISTANCE: 100Mohm MIN(UNMATED);10Mohm MIN.(MATED) 5.HDMISPECIFICATION COMPLIANCE 6.17 [0.243] 12.14 [0.478] PICK UP AREA Ø6.00 [0.236] 0.10 [0.004] 5.96 [0.235] M3X0.5 2.70 [0.106](X2) 3.40 [0.134] 8*1=8.00 [0.315] (LAND) 3.30 [0.130](X2) Pin 2 (THROUGH HOLE) 0.90 [0.035](X4) (THROUGH HOLE) (LAND) 2.70 [0.106](X2) 0.50 [0.020] 1.50 [0.059](4X) (LAND) 14.50 [0.571] 11.06 [0.436] A71-05H3-1X1N1 0.90 [0.035] Pin 18 XKB CONNECITITY 2.06 [0.081] 5.96 [0.235] 4.55 [0.179] 1 (THROUGH HOLE) 2.10 [0.083](X2) Pin 19 DIM H=9.97 [0.393] Pin 1 14.50 [0.571] 2.60 [0.103] 0.50 [0.020]PITCH 0.28 [0.011] 1:Au 1U" 5:Au 15U" 6:Au 30U" PCB EDGE 14.50 [0.571] RECOMMENDED PCB LAYOUT (THICKNESS=1.6±0.15mm) RECOMMENDED P.C.B LAYOUT (T:1.20mm) TOLERANCE UNSPECIFIED ±0.05mm 15.70 [0.618] R0.30MAX.(X8) COPPER ALLOY,GOLD PLATED OVER NICKEL ON CONTACT AREA AND 100u" MIN.TIN PLATED OVER NICKEL ON SOLDER TAILS 4.50 [0.177] 6.20 [0.244] X 3 CONTACTS 19 2 HOUSING 1 THERMOPLASTIC UL94V-0 1 SHELL 1 COPPER ALLOY, NICKEL PLATED 1.20 [0.047] 1.00 [0.039] 0.20 [0.008] 10.80 [0.425] 0.50 [0.020] 0.1 X 13.25 [0.522] 0.1 X REFERENCE PANEL CUT OUT DIMENSION XKB CONNECITITY X X X MARK DATE DESCRIPTION REVISIONS www.xk-dg.cn www.helloxkb.com REVISED APPROVED ANGLAR L≤4 4