MS45SF1
Specification V1.0
MS88SF2
Bluetooth Low Energy module
Specification V1.0
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Copyright© Shenzhen Minewsemi Co., Ltd.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
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MS88SF2
Specification V1.0
Small-sized nRF52840
Module MS88SF2
Specification
MS88SF2 is advanced, compact (23.2mm×17.4mm×2mm), highly flexible, ultra-low
power wireless BLE 5.0 Module based on nRF52840 SoCs. Its powerful 32-bit ARM
CortexTM M4F CPU, a 1 MB flash memory, a 256KB RAM and integrating a 2.4 GH
transceiver offers the perfect solution for Bluetooth connectivity.
Features
Application
1. ARM ® Cortex ® -M4 32-bit processor
1. Medical devices
with FPU, 64 MHz
2. Heart rate monitor
2. BLE 5 data rate: 2Mbps,1Mbps, 500
3. Blood pressure monitor
kbps,125kbps. IEEE 802.15.4 Thread and
4. Blood glucose meter
Zigbee data rate: 250kbps, Proprietary 2.4
5. Thermometer
GHz: 2 Mbps, 1 Mbps
6. Sport facilities
3. Flash/RAM: 1MB/256KB
7. Weighing machine
4. GPIO:20
8. Sports and fitness sensors
5. 2×UART/4×SPI masters/3×SPI slaves
9. Accessories
6. SoC TX power: -40dB to +8dB
10. 3D glasses and gaming controller
7. Operating temperature: -40℃ to +85℃
11. Mobile accessories
8. Antenna: PCB,u.FL/IPEX connector
12. Remote controllers / Toys
9. Module size: 23.2mm×17.4mm×2mm
13. Electronic devices
10. Range: 125kbps: up to 250 meters in
14. Cycle computer
open space.
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
INDEX
1 Product Introduction .................................................................................................................................................................... - 4 1.1 Ordering information ...................................................................................................................................................... - 4 2 Pin Description .............................................................................................................................................................................. - 5 2.1 Pin assignment ................................................................................................................................................................. - 5 2.1.1 MS88SF2 PCB Antenna .................................................................................................................................... - 5 2.1.2 MS88SF2 u.FL/IPEX connector ....................................................................................................................... - 5 2.2 Pin definition ...................................................................................................................................................................... - 6 2.3 Block diagram ................................................................................................................................................................... - 8 2.4 Mechanical Drawing ....................................................................................................................................................... - 8 2.4.1 MS88SF2 PCB Antenna .................................................................................................................................... - 8 2.4.2 MS88SF2 u.FL/IPEX connector ....................................................................................................................... - 9 3 Electrical Specification............................................................................................................................................................. - 10 3.1 Absolute maximum ratings ....................................................................................................................................... - 10 3.2 Recommended operating conditions..................................................................................................................... - 11 3.3 Electronic characteristic.............................................................................................................................................. - 11 3.3.1 General radio characteristics ....................................................................................................................... - 11 3.3.2 Radio current consumption (Transmitter) ............................................................................................... - 12 3.3.3 Radio current consumption (Receiver) ..................................................................................................... - 14 3.3.4 Transmitter specification ............................................................................................................................... - 14 3.3.5 Receiver operation ........................................................................................................................................... - 15 3.3.6 RX selectivity ...................................................................................................................................................... - 16 3.3.7 RX intermodulation .......................................................................................................................................... - 17 3.3.8 Radio timing ....................................................................................................................................................... - 18 3.3.9 Received signal strength indicator (RSSI) specifications .................................................................. - 19 4 Electrical Schematic ................................................................................................................................................................. - 20 5 Package Information ................................................................................................................................................................ - 21 5.1 Package dimension ...................................................................................................................................................... - 21 5.2 Mark on metal shield ................................................................................................................................................... - 22 6 Reflow and Soldering .............................................................................................................................................................. - 23 7 Certification ................................................................................................................................................................................. - 24 7.1 CE Certification .............................................................................................................................................................. - 24 7.2 FCC Certification ........................................................................................................................................................... - 24 7.3 Full Bluetooth Declaration ID .................................................................................................................................... - 25 7.4 Canada (IC) ..................................................................................................................................................................... - 25 7.5 India(WPC) ...................................................................................................................................................................... - 25 7.6 RCM.................................................................................................................................................................................... - 26 7.7 Japan (TELEC) ................................................................................................................................................................ - 26 7.8 Environmental ................................................................................................................................................................ - 26 7.8.1 RoHs ...................................................................................................................................................................... - 26 7.8.2 Reach .................................................................................................................................................................... - 26 8 Notes & Cautions ....................................................................................................................................................................... - 27 8.1 Design notes ................................................................................................................................................................... - 27 8.2 Layout notes ................................................................................................................................................................... - 27 8.3 Installation and soldering .......................................................................................................................................... - 28 8.4 Handling and storage ................................................................................................................................................. - 28 8.5 Life support applications............................................................................................................................................ - 29 9 Disclaimer..................................................................................................................................................................................... - 30 Revision History ............................................................................................................................................................................. - 30 COPYRIGHT STATEMENT .......................................................................................................................................................... - 31 -
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
1 Product Introduction
MS88SF2 series are advanced, compact (23.2mm×17.4mm×2mm), highly flexible, ultra-low
power wireless BLE 5.0 Module based on nRF52840 SoCs. Its powerful 32-bit ARM CortexTM
M4F CPU, a 1 MB flash memory, a 256KB RAM and integrating a 2.4 GH transceiver can offers
the perfect solution for Bluetooth connectivity.
Fully qualified BLE stacks for nRF52840 are implemented in the S140 SoftDevices which can be
freely downloaded. In the meantime, ANT, ZIGBEE and THREAD applications can be supported
by nRF52840 with extensive software.
MS88SF2 can meet the most demanding applications, it allow faster time to market with high
performance,low power management and reduced development cost. Also, its range is
estimated up to 250 meters in open space for 1Mbps data rate; up to 120 meters in open space
for 2 Mbps data rate.
1.1 Ordering information
Ordering number
Description
MS88SF2-1Y40AIR
nRF52840-QIAA BT 5.0 Module, PCB Antenna, reel pack
MS88SF2-3Y40AIR
nRF52840-QIAA BT 5.0 Module, U.FL connector, reel pack
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
2 Pin Description
2.1 Pin assignment
2.1.1 MS88SF2 PCB Antenna
2.1.2 MS88SF2 u.FL/IPEX connector
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
2.2 Pin definition
Symbol
Type
Description
VDD
Power
Power supply
VDDH
Power
Power supply, 2.5V-5.5V
GND
Power
Ground
SWDIO
Digital I/O
Hardware debug and flash/programming
I/O/programming I/O.
SWCLK
Digital input
(debug)
Hardware debug and flash programming I/O
Digital I/O
General purpose I/O
Analog input
Analog input
Digital I/O
General purpose I/O
Analog input
Analog input
P 1.15
Digital I/O
General purpose I/O
P1.13
Digital I/O
General purpose I/O
Digital I/O
General purpose I/O
Analog input
Analog input
Digital I/O
General purpose I/O
Analog input
Analog input
Digital I/O
General purpose I/O
Trace data
Trace buffer TRACEDATA[3]
Digital I/O
General purpose I/O
Trace data
Trace buffer TRACEDATA[1]
Digital I/O
General purpose I/O
NFC input
NFC antenna connection
Digital I/O
General purpose I/O
NFC input
NFC antenna connection
P 0.29
AIN5
P 0.02
AIN0
P 0.31
AIN7
P 0.04
AIN2
P 1.09
TRACEDATA33
P 0.12
TRACEDATA1
P 0.10
NFC2
P 0.09
NFC1
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
P 1.00
TRACEDATA0
P 0.18
nRESET
Digital I/O
General purpose I/O
Trace data
Trace buffer TRACEDATA[0]
Digital I/O
General purpose I/O
Configurable as system RESET
P 0.26
Digital I/O
General purpose I/O
P 0.06
Digital I/O
General purpose I/O
P 0.08
Digital I/O
General purpose I/O
P 0.24
Digital I/O
General purpose I/O
P 0.22
Digital I/O
General purpose I/O
P 0.20
Digital I/O
General purpose I/O
P 0.15
Digital I/O
General purpose I/O
P 0.13
Digital I/O
General purpose I/O
D+
Digital I/O
USB D+
D-
Digital I/O
USB D-
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
2.3 Block diagram
2.4 Mechanical Drawing
2.4.1 MS88SF2 PCB Antenna
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Copyright© Shenzhen Minewsemi Co., Ltd.
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
2.4.2 MS88SF2 u.FL/IPEX connector
Important:
Unit: mm
Tolerance: +/- 0.1, default
Recommend solder pad size: 1.8*0.8mm, solder pad is suggested to extend 0.7mm
distance.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
3 Electrical Specification
The electrical specifications of the module are directly related to the Nordic semiconductor
Specifications for the nRF52840 chipset. The below information is only the extract from
nRF52840 specification. For more detailed information, please refer to the up-to-date
specification of the chipset available on the Nordic semiconductor website.
3.1 Absolute maximum ratings
Note
Min.
Max
Unit
VDD
-0.3
+3.9
V
VDDH
-0.3
+5.8
V
VBUS
-0.3
+5.8
V
0
V
Supply voltages
VSS
I/O Pin voltage
VI/0,VDD3.6V
-0.3
3.9V
V
80
mA
10
dBm
+125
°C
NFC antenna pin current
INFC1/2
Radio
RF input level
Environmental (AQFN package)
Storage temperature
-40
MSL
Moisture Sensitivity Level
2
ESD HBM
Human Body Model
4
KV
ESD CDMQF
Charged Device Model
(AQFN73,7×7mm package)
750
V
Important: Maximum ratings are the extreme limits to which the chip can be exposed
for a limited amount of time without permanently damaging it. Exposure to absolute
maximum ratings for prolonged periods of time may affect the reliability of the device.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
3.2 Recommended operating conditions
The operating conditions are the physical parameters that the chip can operate within.
Symbol
Parameter
Min.
Nom.
Max.
Units
1.7
3.0
3.6
V
VDD supply voltage, independent of DCDC
enable
VDD supply voltage needed during power-on
reset
VDDH supply voltage,independent of DCDC
enable
1.75
2.5
3.7
5.5
V
VBUS
VBUS USB supply voltage
4.35
5
5.5
V
tR_VDD
Supply rise time (0 V to 1.7 V)
60
ms
tR_VDDH
Supply rise time (0 V to 3.7 V)
100
ms
TA
Operating temperature
85
°C
VDD
VDDPOR
VDDH
-40
V
25
Important: The on-chip power-on reset circuitry may not function properly for rise times
longer than the specified maximum.
3.3 Electronic characteristic
3.3.1 General radio characteristics
Symbol
Description
Min.
fOP
Operating frequencies
2360
fPLL,CH,SP
PLL channel spacing
1
MHz
fDELTA,1M
Frequency deviation@1 Mbps
±170
kHz
fDELTA,BLE,1M
Frequency deviation @ BLE 1Mbps
±250
kHz
fDELTA,2M
Frequency deviation @ 2Mbps
±320
kHz
fskBPS
On-the-air data rate
fchip,IEEE 802.15.4
Chip rate in IEEE 802.15.4 mode
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Nom.
125
- 11 -
Max.
Units
2500
MHz
2000
2000
kbps
kchipAs
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Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
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MS88SF2
Specification V1.0
3.3.2 Radio current consumption (Transmitter)
Symbol
Description
I TX,PLUS8dBM,DCDC
TX only run current(DCDC,3V)PRF=+ 8 dBm
14.1
mA
I TX,PLUS8dBM
TX only run current PRF =+ 8 dBm
30.4
mA
I TX,PLUS4dBM,DCDC
TX only run current(DCDC,3V)PRF =+ 4 dBm
9.3
mA
I TX,PLUS4dBM
TX only run current PRF =+ 4 dBm
18.9
mA
6.0
mA
5.2
mA
I TX,0dBM,DCDC,5V,REG0
I TX,0dBM,DCDC,5V,REG0LO
TX only run current (DCDC,5V,REGO
out=3.3V)PRF =0 dBm
TX only run current(DCDC,5V,REGO
out=1.8V)PRF =0 dBm
Min.
Typ.
Max.
Units
I TX,0dBM,DCDC
TX only run current(DCDC,3V)PRF =0 dBm
4.9
mA
I TX,0dBM
TX only run current PRF = 0 dBm
10.2
mA
I TX,MINUS4dBM,DCDC
TX only run current DCDC,3V PRF =-4 dBm
3.4
mA
I TX,MINUS4dBM
TX only run current PRF =-4 dBm
7.3
mA
I TX,MINUS8dBM,DCDC
TX only run current DCDC,3V PRF =-8 dBm
3.0
mA
I TX,MINUS8dBM
TX only run current PRF =-8 dBm
6.4
mA
I TX,MINUS12dBM,DCDC
TX only run current DCDC,3V PRF =-12 dBm
2.7
mA
I TX,MINUS12dBM
TX only run current PRF =-12 dBm
5.7
mA
I TX,MINUS16dBM,DCDC
TX only run current DCDC,3V PRF =-16 dBm
2.5
mA
I TX,MINUS16dBM
TX only run current PRF =-16 dBm
5.3
mA
I TX,MINUS20dBM,DCDC
TX only run current DCDC,3V PRF =-20 dBm
2.3
mA
I TX,MINUS20dBM
TX only run current PRF =-20 dBm
5.0
mA
I TX,MINUS40dBM,DCDC
TX only run current DCDC,3V PRF =-40 dBm
2.0
mA
I TX,MINUS40dBM,
TX only run current PRF =-40 dBm
4.0
mA
I START,TX,DCDC
TX start-up current DCDC,3V PRF =4 dBm
5.2
mA
I START,TX
TX start-up current PRF =4 dBm
11.0
mA
I 0dBm(DCDC,3V)
TX current(DCDC,3V)1Mbps BLE measured
from VBAT with PRF =0 dBm
6.4
mA
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
I 2dBm(DCDC,3V)
I 4dBm(DCDC,3V)
I 9dBm(DCDC,3V)
I 0dBm(3V)
I 9dBm(3V)
TX current(DCDC,3V)1Mbps BLE measured
from VBAT with PRF =2 dBm
TX current(DCDC,3V)1Mbps BLE measured
from VBAT with PRF =4 dBm
TX current(DCDC,3V)1Mbps BLE measured
from VBAT with PRF =9 dBm
TX current(3V)1Mbps BLE measured from
VBAT with PRF =0 dBm
TX current(3V)1Mbps BLE measured from
VBAT with PRF =9 dBm
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8.9
mA
10.6
mA
15.5
mA
11.2
mA
30.7
mA
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
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MS88SF2
Specification V1.0
3.3.3 Radio current consumption (Receiver)
Symbol
Description
Min
Typ.
Max.
Units
I RX,1M,DCDC
RX only run current(DCDC,3V)1Mbps/1Mbps BLE
4.8
mA
I RX,1M
RX only run current(LDO,3V)1Mbps/1Mbps BLE
10.3
mA
I RX,2M,DCDC
RX only run current(DCDC,3V)2Mbps/2Mbps BLE
5.4
mA
I RX,2M,
RX only run current(LDO,3V)2Mbps/2Mbps BLE
11.6
mA
I START,RX,1M,DCDC
RX start-up current(DCDC,3V)1Mbps/1Mbps
BLE
3.7
mA
I START,RX,1M
RX start-up current 1Mbps/1Mbps BLE
6.7
mA
3.3.4 Transmitter specification
Symbol
Description
PRF
Maximum output power
8
dBm
PRFC
RF power control range
28
dB
PRFCR
RF power accuracy
PRF1,1
PRF2,1
PRF1,2
PRF2,2
1st adjacent channel transmit power 1 MHz(1
Mbps)
2nd adjacent channel transmit power 2 MHz(1
Mbps)
1st adjacent channel transmit power 2 MHz(2
Mbps)
2nd adjacent channel transmit power 4 MHz(2
Mbps)
Min
Typ.
Max
±4
Units
dB
-23
dBc
-50
dBc
-24
dBc
-50
dBc
Evm
Error Vector Magnitude IEEE 802.15.4
%rms
Pharm2nd,IEEE 802.15.4
2nd Harmonics in IEEE 802.15.4 mode
dBm
Pharm3rd,IEEE 802.15.4
3rd Harmonics in IEEE 802.15.4
dBm
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This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
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MS88SF2
Specification V1.0
3.3.5 Receiver operation
Symbol
Description
PRX,MAX
Maximum received signal strength at 3MHz
125 kbps BLE LR mode, Co-Channel interference
dB
125 kbps BLE LR mode, Adjacent (-1 MHz)
interference
125 kbps BLE LR mode, Adjacent (+1 MHz)
interference
125 kbps BLE LR mode, Adjacent (-2 MHz)
interference
125 kbps BLE LR mode, Adjacent (+2 MHz)
interference
125 kbps BLE LR mode, Adjacent (≥3 MHz)
interference
dB
dB
dB
dB
dB
C/I125k BLE LR,image
Image frequency Interference
dB
C/I500k BLE LR,cochannel
500 kbps BLE LR mode, Co-Channel interference
dB
C/I500k BLE LR,-1MHz
C/I500k BLE LR,+1MHz
C/I500 k BLE LR,-2MHz
C/I500k BLE LR,+2MHz
C/I500k BLE LR,>3MHz
C/I500k BLE LR,image
500 kbps BLE LR mode, Adjacent (-1 MHz)
interference
500 kbps BLE LR mode, Adjacent (+1 MHz)
interference
500 kbps BLE LR mode, Adjacent (-2 MHz)
interference
500 kbps BLE LR mode, Adjacent (+2 MHz)
interference
500 kbps BLE LR mode, Adjacent (≥3 MHz)
interference
dB
dB
dB
dB
dB
Image frequency Interference
dB
3.3.7 RX intermodulation
Symbol
PIMD,1M
PIMD,1M,BLE
PIMD,2M
Description
Min
IMD performance, 1 Mbps, 3rd, 4th, and 5th offset
channel
IMD performance, BLE 1 Mbps, 3rd, 4th, and 5th offset
channel
IMD performance, 2 Mbps, 3rd, 4th, and 5th offset
channel
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Typ.
Max.
Units
-29
dBm
-30
dBm
-30
dBm
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
3.3.8 Radio timing
Symbol
Description
tTXEN
Time between TXEN task and READY event after
channel FREQUENCY configured
140
us
tTXEN,FAST
Time between TXEN task and READY event after
channel FREQUENCY configured (Fast Mode)
40
us
6
us
tTXDISABLE
tTXDISABLE,2M
tRXEN
Min
Time between DISABLE task and DISABLED event
when the radio was in TX and mode is set to
1Mbps
Time between DISABLE task and DISABLED event
when the radio was in TX and mode is set to
2Mbps
Time between the RXEN task and READY event
after channel FREQUENCY configured in default
mode
Typ.
Max.
Units
us
140
us
tRXEN,FAST
Time between the RXEN task and READY event
after channel FREQUENCY configured in fast mode
40
us
tRXDISABLE
Time between DISABLE task and DISABLED event
when the radio was in RX
0
us
tTXCHAIN
TX chain delay
0.6
us
tRXCHAIN
RX chain delay
9.4
us
tRXCHAIN,2M
RX chain delay in 2Mbps mode
5
us
tRXCHAIN,LR 125k
RX chain delay in BLE LR125kbps mode
us
tRXCHAIN,LR 500k
RX chain delay in BLE LR500kbps mode
us
tRX-to-TX turnaround
Maximum TX-to-RX or RX-to-TX turnaround time
in IEEE 802.15.4 mode
us
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
3.3.9 Received signal strength indicator (RSSI) specifications
Symbol
Description
RSSIACC
RSSI Accuracy Valid range -90 to -20 dBm
-2
dB
RSSIRESOLUTION
RSSI resolution
1
dB
RSSIPERIOD
Sample period
8
us
RSSImin,IEEE 802.15.4
Minimum RSSI sensitivity in 802.15.4 mode
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Min
Typ.
Max.
Units
dBm
Copyright© Shenzhen Minewsemi Co., Ltd.
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copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
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MS88SF2
Specification V1.0
4 Electrical Schematic
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
5 Package Information
5.1 Package dimension
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
Details of Package Dimension:
Details
Reel-MS88SF2
Quantity(module)
650PCS
Tape Weight
460g
Single module Weight
1.1g
Gross Weight
1200g
Dimension
W:44mm T:0.35mm
5.2 Mark on metal shield
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
6 Reflow and Soldering
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100°C
150°C
Preheat Temperature max (Tsmax)
150°C
200°C
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate (Tsmax to Tp)
3°C/second max
3°C/second max
Liquidous Temperature (TL)
183°C
217°C
Time (tL)Maintained Above (TL)
60-90 sec
30-90 sec
Peak Temperature (Tp)
220-235°C
230-250°C
Average ramp-down rate (Tp to Tsmax)
6°C/second max
6°C/second max
Time 25°C to peak temperature
6 minutes max
8 minutes max
Important:
➢ When SMT involves double-sided patch, it is recommended that the module surface
be reflowed only once.
➢ For module SMT, it is recommended to make a partial stepped stencil with a
thickness of 0.2mm, and the stencil hole should be extended by 0.8mm size.
➢ After opening the package, it should be stored in vacuum environment. Module
should not be exposed to the air for a long time to prevent moisture and pad
oxidation. If there is an interval of 7 to 30 days during SMT process, it is
recommended to bake it with reel at 65-70 degrees for 24 hours before using for
SMT again.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
7 Certification
FCC ID: 2ABU6-MS88SF2
BQB QDID:131802
TELEC: 208-190045
IC:20896-MS88SF2
CE,RCM,WPC,RoHS & Reach certified
7.1 CE Certification
MS88SF2 module is being tested and is expected to be compliant against the EU-Radio
Equipment standards. OEM integrator should consult with qualified test house to verify all
regulatory requirements have been met for their complete device.
7.2 FCC Certification
MS88SF2 module is being tested and is expected to be compliant against the Federal
Communications Commission standards.
As for the OEM integration:
Only OEM integrator have right to intend this device under the following conditions:
Any other transmitter or antenna must not be co-located with the antenna and transmitter. The
module shall be only used with the integral antenna(s)that has been originally tested and
certified with this module.
As long as the two conditions below are met,further transmitter testing will not be required.
(1)This device may not cause harmful interference.
(2)This device must accept any interference received, including interference that may cause
undesired operation.
However, the OEM integrator shall test their end-product for any additional compliance
requirements with this module installed (for example,digital device emission, PC peripheral
requirements, etc. ).
If these conditions cannot be met (for example certain laptop configuration or co-location with
another transmitter), then the FCC authorization for this module in combination with the host
equipment is no longer considered valid and the final product shall not use the FCC ID of the
module. In these circumstances, the OEM integrator shall be re-evaluating the end
product(including the transmitter) and obtaining a separate FCC authorization.
The OEM shall be verifying end product compliance with FCC Part 15, sub-part B limits for
unintentional radiators through an accredited test facility.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
7.3 Full Bluetooth Declaration ID
Minewsemi technologies meet the Bluetooth specification maintained by Bluetooth SIG, and all
the product produced by Minewsemi is properly tested and comply with the Bluetooth license
agreements.
Minewsemi is one of the associate member of Bluetooth SIG. The requirement of listing
products by companies is become the members of the SIG and also pay the listed fees for each
product required.
Please Kindly check the below Link to know more info:
https://www.bluetooth.com/develop-with-bluetooth/qualification-listing.
The Minewsemi Bluetooth Low Energy modules based on Nordic Semiconductor SoCs are
listed as a “End product”.
7.4 Canada (IC)
Minew’s modules have been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the
installation of a module in a host device without the need to rectify the device.
As for the labeling & user Information Requirements, MS88SF2 is assigned the IC ID number:
20896-MS88SF2.
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December
2010): The host device shall be properly labeled to identify the module within the host device.
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue
3, December 2010): User manuals for license-exempt radio apparatus shall contain the
following or equivalent notice in a conspicuous location in the user manual or alternatively on
the device or both:This device complies with Industry Canada license exempt RSS standard(s).
Operation is subject to the following two conditions:
this device may not cause interference, and (2) this device must accept any interference,
including interference that may cause undesired operation of the device.
Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for
transmitters shall display the following notice in a conspicuous location:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
7.5 India(WPC)
The MS88SF2has been tested to comply with the wireless planning & coordination (WPC)
Wing of the Ministry of Communications standard. WPC created in 1952, is the National Radio
Regulatory Authority responsible for Frequency Spectrum Management, including licensing
and caters for the needs of all wireless users (Government and Private) in the country.
It exercises the statutory functions of the Central Government and issues licenses to establish,
maintain and operate wireless stations. WPC is divided into major sections like Licensing and
Regulation (LR), New Technology Group (NTG) and Standing Advisory Committee on Radio
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
Frequency Allocation (SACFA). SACFA makes the recommendations on major frequency
allocation issues, formulation of the frequency allocation plan, making recommendations on
the various issues related to International Telecom Union (ITU), to sort out problems referred to
the committee by various wireless users, Siting clearance of all wireless installations in the
country etc.
7.6 RCM
The MS88SF2has been tested to comply with the AS/NZS 4268:2017, Radio equipment and
systems –Short range devices – Limits and methods of measurement. It may be used as
evidence in obtaining permission to use the Regulatory Compliance Mark (RCM).
Information on registration as a Responsible Party, license and labeling requirements may be
found at the following websites:
Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devicesstandard-2004.
New Zealand: http://www.rsm.govt.nz/compliance.
Only Australian-based and New Zealand-based companies who are registered may be
granted permission to use the RCM. An Australian-based or New Zealand-based agent or
importer may also register as a Responsible Party to use the RCM on behalf of a company not
in Australia or New Zealand.
7.7 Japan (TELEC)
The MS88SF2 is approved for use in the Japanese market.
7.8 Environmental
7.8.1 RoHs
MS88SF2 modules are in compliance with Directive 2011/65/EU, 2015/863/EU of the European
Parliament and the Council on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
7.8.2 Reach
MS88SF2 modules listed below do not contain the 191 SVHC (Substance of Very High
Concern), as defined by Directive EC/1907/2006 Article according to REACHAnnex XVII.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
8 Notes & Cautions
We cannot assure that the specification has no errors and omission even though this
specification is under collate and check strictly.
This specification is under the protection of laws and regulations of copyright, please do not
copy and duplicate at any form, or do not transmit part or full of this specification in any wire
and wireless network in any form, or do not edit or translate to any other format, word, code,
etc.
8.1 Design notes
➢ It is critical to following the recommendations of this document to ensure the module meets
the specifications.
➢ The module should be placed at the edge of the circuit board as far as possible to keep away
from other circuits.
➢ Antenna should be kept away from other circuits. It can prevent low radiation efficiency and
the normal use of other circuits from being affected.
➢ The landing of components should be appropriate and that is better for reducing the
parasitic inductance.
➢ Please refuse to supply voltage that is not within the range of specification.
➢ Please make sure the module or its surface may not suffer from the physical shock or
extreme stress.
8.2 Layout notes
To make sure wireless performance is at its best condition, please layout the MS88SF2 module
on the carrier board as below instructions and picture.
a) Placement of the antenna
The antenna area of module shall lay clearance completely and should not be blocked by the
metal. Otherwise it will have effect on antenna performance (As the picture indicated below).
b) Placement of top-layer
The placement of top-layer in carrier board shall be lay copper completely to reduce the signal
line in carrier board or other interference.
c) Clearance
The upper and below area of antenna (including the case) shall have 4mm or more than 4mm
clearance to reduce the influences for antenna.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
*The Grey area above is Carrier board.
8.3 Installation and soldering
Please do not lay copper under the module antenna. It can prevent the influence of signal
radiation and the transmission distance from being affected.
8.4 Handling and storage
a)
Due to the fact that CMOS components are included in the module, it is better to eliminate
static electricity at any methods when transporting or working with the module. Moreover,
it is strongly recommended adding anti-ESD components to circuit design to hinder damage
from real-life ESD events. Anti-ESD methods can be also used in mechanical design.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
b) Please store the modules within -40℃ to +125℃ before and after installation and make sure
the modules is away from the direct sunlight exposure for a long duration. Modules should
be far away from humid and salty air conditions, and any corrosive gasses or substances.
c) Please not to wash the module. No-Clean Paste is used in production. The metal shield may
be oxidized by the washing process and may lead to chemistry reaction with No-Clean Paste.
If modules goes through the washing process, functions of the module may not guaranteed.
d) After opening the package, it should be stored in vacuum environment. Module should not
be exposed to the air for a long time to prevent moisture and pad oxidation. If there is an in
terval of 7 to 30 days during SMT process,
8.5 Life support applications
a) The module is not design for life support device or system and not allowed to be used in
destructive devices or system in any direct, or indirect ways. Minewsemi is not responsible
for compensation of any losses when applying modules under such application as described
above.
b) MinewSemi shall not responsible for the customer’s products or application.
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
9 Disclaimer
The factory has passed the ISO9001 quality management system, ISO14001 environmental
management system and OAHS18001 occupational health and safety assessment . Each
product has been rigorously tested (transmission power test, sensitivity test, power
consumption test, stability test, aging test, etc.).
* NOTICES:
➢
➢
➢
➢
➢
The Bluetooth trade mark is owned by the Bluetooth SIG Inc. USA.
All other trademarks listed herein are owned by their respective owners.
All specifications are subject to change without notice.
Please do not use this specification for produce, sell or illegal purpose without
MinewSemi’s authorization.
MinewSemi have right to interpret all the items above.
Revision History
Version
Date
Notes
Contributor
(s)
Person of
Approve
1.0
2022-03-01
First edition
Eddie
Coral
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.
MS88SF2
Specification V1.0
COPYRIGHT STATEMENT
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by
Chinese laws and applicable international conventions related to copyright laws.
The company has the right to change the content of this manual according to the technological development, and
the revised version will not be notified otherwise. Without the written permission and authorization of the company,
any individual, company, or organization shall not modify the contents of this manual or use part or all of the
contents of this manual in other ways. Violators will be held accountable in accordance with the law.
Tel: 0086-755-2103 8160
Email: minewsemi@minew.com
URL: https://www.minew.com/
Address: 3rd Floor, Building I, Gangzhilong Science Park, Qinglong RoadLonghua District, Shenzhen
518109, China
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Copyright© Shenzhen Minewsemi Co., Ltd.
This manual and all the contents contained in it are owned by Shenzhen Minewsemi Co., Ltd. and are protected by Chinese laws and applicable international conventions related to
copyright laws.The company has the right to change the content of this manual according to the technological development, and the revised version will not be notified otherwise.
Without the written permission and authorization of the company, any individual, company, or organization shall not modify the contents of this manual or use part or all of
the contents of this manual in other ways. Violators will be held accountable in accordance with the law.