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2Z19200001

2Z19200001

  • 厂商:

    YL(惠伦晶体)

  • 封装:

    SMD2520_4P

  • 描述:

    无源晶振 70Ω 7pF 19.2MHz ±10ppm -30℃~+105℃ SMD2520_4P

  • 数据手册
  • 价格&库存
2Z19200001 数据手册
PRODUCT SPECIFICATION SHEET Customer Customer P/N Product Type Temperature Sensing Crystal Part Number 2Z19200001 Part Description Nominal Frequency Prepared Li Xiang Reviewed Kuro Peng Approved Xing Yue Date 2022-6-2 Version S1 SMD TSX 2.5 x 2.0 (TH + Xtal) 19.200000MHz 广东惠伦晶体科技股份有限公司 中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号 68 Donghuan Road, Jitigang Village, Huangjiang, Dongguan, Guangdong Province, P. R. China WEB : http://www.dgylec.com/ TEL : +86 ( 0 ) 769 - 38879888 FAX : +86 ( 0 ) 769 - 38879889 EMAIL : yl@dgylec.com FAITH LONG CRYSTAL Proprietary and Confidential Information Customer's Approval & Date: RoHS COMPLIANT Pb Lead-Free Moisture Sensitivity Level 1 Page 1 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 CONTENTS # Item 1 History of Specification Revision 3 2 Electrical Specifications 4 3 4 5 6 Page 2.1 Specifications for operation condition and electrical characteristics 4 2.2 Specifications for crystal drive level dependency (DLD) 5 2.3 Specifications for GPS quality 6 2.4 NTC thermistor specification table 7 Product Design 8 3.1 Package dimensions and pad functions 8 3.2 Recommended land pattern 8 3.3 Recommended reflow profile 8 3.4 Marking definition 9 3.5 Recommended reflow profile 9 3.6 Structure illustration 10 Reliability Assurance 11 4.1 Mechanical endurance 11 4.2 Environmental endurance 11 Taping and Packing 12 5.1 Tape and reel 12 5.2 Packing standard 13 Specification of the Environment-related Substances FAITH LONG CRYSTAL Proprietary and Confidential Information 14 Page 2 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 1. History of Specification Revision Ver. Content Date Reviser S0 Initial released 2021-7-1 Chen XuanRu S1 Change marking information 2022-6-2 Li xiang FAITH LONG CRYSTAL Proprietary and Confidential Information Remark Page 3 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 2. Electrical Specifications 2.1 Specifications for operation condition and electrical characteristics # Parameter Min. Typ. 1 Nominal frequency 19.200000 2 Crystal cut type AT-cut 3 Mode of vibration Fundamental Load capacitance (C ) 4 7.0 L 5 Drive level 10 6 Operating temperature range -30 7 Storage temperature range -40 8 Initial frequency tolerance -10 - Max. Remark 100 +105 +105 Unit MHz pF mW °C °C +10 ppm At 30±3° Note 1. 9 Frequency drift after reflow -2.0 - +2.0 ppm After two times of reflow (0.5Hr freq. driftsubstruct 168Hr freq.) 10 Tolerance over temperature (reference 30°C) -12 - 12 ppm Within -30°C to +85°C. Above +85°C see Note 2. 11 12 13 14 15 16 17 Frequency aging Equivalent series resistance (ESR) Insulation resistance Quality factor (Q) Spurious mode series resistance Shunt Capaitance (C0) Motional Capacitance (C1) -0.7 500 75,000 1100 0.3 1.8 - +0.7 70 1.3 3.1 ppm/yr Ω MΩ Ω pF fF 18 First-order curve fitting parameter(C1) -0.4 0 -0.1 ppm/°C Note 5. 19 Second-order curve fitting parameter (C2) -4.5 0 +4.5 x10-4 ppm/°C2 Note 5. 20 Third-order curve fitting parameter (C4) 8.5 10 11.5 x10-5 ppm/°C3 Note 5. Note 3. at DC 100V Note 4. Within ±500 KHz offset. Note 1 Note 2 Note 3 The load capacitance is measured according to IEC Standard #60444-7. Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range. The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the minimum Q. Note 4 Note 5 The minimum Q value calculated from ESR and L is smaller than this specification. The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the temperatureinflection point t0 = 30°C. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 4 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 2. Electrical Specifications (Cont.) 2.2 Specifications for crystal drive level dependency (DLD) # Parameter Min. Typ. Max. Unit Remarks 0.01 - 100 mW Drive level from 0.01 μW to 100 μW to 0.01 μW 1 Drive level measurement condition 2 DLD Frequency (Maximum - Minimum) - - 3.0 ppm Define as FDLD. Note 6. 3 DLD Frequency (Repeatability) - - 0.7 ppm Define as FDLDH. Note 7. 4 DLD ESR (Maximum - Minimum) - - 20.0 % Define as DLD2. Note 6. 5 DLD ESR (Repeatability) - - 10.0 % Define as DLDH2. Note 7~9. Note 6 Note 7 Note 8 Note 9 Maximum - minimum: Difference between the maximum and minimum in a two-way measurement. Repeatability of the two-way measurement is defined in the above Drive level measurement condition. ESR1: This is the first measurement on each drive level. ESR2: This is the second measurement on each drive level. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 5 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 2. Electrical Specifications (Cont.) 2.3 Specifications for GPS quality # Parameter Min. Typ. Max. Unit Remarks Note 11. 1 Full Cycle Frequency stability slope -50 - +50 ppb/°C 2 5℃ Small Cycle Frequency stability slope 1 -50 - +50 ppb/°C 3 5℃ Small Cycle Frequency stability slope 2 100 (magnitude) ppb pk-pk 4 5 ESD MSL HBM>2000V Level 1 - Note 10 Note 11 Average measured peakto-peak frequency difference. JESD22-A114-B IPC/JEDEC J-STD-033C Temp. range:-30 to 85℃ for each 1℃, Temp. rate: ~1.0°C/min Test flow: 25℃(1)->-30℃->85℃->25℃(2), (25℃(1) freq. drift subtract 25℃(2) freq. drift) Test condition: Continuous temperature rate change of~ 1.0°C/min Measure FT points every 1℃, heating up from -30 to 85℃, subtract a fifth-order polynomial best fit, and then calculate the slope of the residual. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 6 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 2. Electrical Specifications (Cont.) 2.4 NTC thermistor specification table # Parameter 1 Operating temperature range 2 Storage temperature range 3 Resistance 4 B-constant 5 Tolerance Min. -30 -40 - Typ. 100 4,250 - Max. +105 +105 1 Unit °C °C kΩ K % Remarks At 25°C* At 25°C - 50°C *In order to get the precise resistance value of the thermistor, the temperature control will be very important during testing since the resistance value will change ~4% per 1℃ temperature difference. Please check the following Murata website for detail explanation. https://www.murata.com/en-us/support/faqs/products/thermistor/ntc/pct/0001 FAITH LONG CRYSTAL Proprietary and Confidential Information Page 7 of 14 PN: 2Z19200001 SMD TSX 2.5 x 2.0 (TH + Xtal) Ver. S1 3. Product Design 3.1 Package dimensions and pad functions (Unit : mm) Top view 3.2 Pad connection diagram and function Bottom view #1 #2 #4 #3 YL 1 9 2 Lateral view Pad 1 2 3 4 Bottom view 3.3 Recommended land pattern Function Xtal in Thermistor out, connecting to ground Xtal out Thermistor in (Unit : mm) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 8 of 14 PN: 2Z19200001 SMD TSX 2.5 x 2.0 (TH + Xtal) Ver. S1 3. Product Design (Cont.) 3.4 Marking definition Frequency EX: 19.200MHz = 192 YL lot (2 digits) year month code Administrative Symbo Table of Year and Month code Month JAN FEB Year 2021 2022 2023 2024 2025 2026 2027 2028 A N a n B P b p MAR APR MAY JUN JUL AUG SEP OCT NOV DEC C Q c q D R d r E S e s F T f t G U g u H V h v J W j w K X k x L Y l y M Z m z 3.5 Recommended reflow profile Temp. (℃) 10 sec. Max. 265 260  5 (1) Total time : 360 sec. Max. (2) Solder melting point : 225℃ 220 60 sec. Max. 180 150 120 sec. Max. Time (sec.) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 9 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 3. Product Design (Cont.) 3.6 Structure illustration # 1 Components Cap (Lid) 2 Base (Package) 3 4 5 6 Pad (Package) Crystal blank Electrode Conductive adhesive 7 Thermistor 8 Solder Materials Kovar (Fe + Co + Ni) Ceramic (AI2O3) + Kovar (Fe + Co + Ni) Ni + Au SiO2 Cr + Nobel material Ag Alumina Ceramics (Al2O3), Ni + Ag+ Sn QTY 1 Finish/Specifications Ni plating 1 Alumina ceramics 4 1 2 2 Tungsten metalization + Ni plating + Au plating - 1 - Sn + Ag + Cu 2 - FAITH LONG CRYSTAL Proprietary and Confidential Information Silicone resin Page 10 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 4. Reliability Assurance 4.1 Mechanical endurance # Item Test Condition Reference 1 Drop test 150 cm height, fall freely onto stainless plate, 3 times. JIS C6701 2 Shock test 150 g weight, 150 cm height onto concrete floor. Each direction (±x, ±y, ±z) for 3 cycles. IEC-68-02-27 3 Mechanical shock Half sine wave 1000 G. Three mutually perpendicular axes, each axis for 3 times. Duration time 1.0ms. MIL-STD-202F 4 Vibration Frequency range : 10 ~ 55 Hz Amplitude : 1.52 mm Pendicular axes each test time : 2 hours(x,y,z Axis) Total test time 6 hours MIL-STD-883E 5 Gross Leak Standard sample for automatic gross leak detector. Test pressure: 2kg /cm2. MIL-STD-883E 6 Fine Leak Helium bombing 4.5 kgf/cm2 for 2 hours. MIL-STD-883E Solderability Temperature : 260°C ± 5°C Immersing depth : 0.5 mm minimum Immersion time : 5 ±1 seconds Flux : Rosin resin methyl alcohol solvent (1:4) GB/T 2424.172008 / IEC 60068-244:1995; GB/T 2423.282005 / IEC 60068-220:1979 Resistance To Soldering Heat Pre-heat temperature 125℃ Pre-heat time 60 ~ 120 sec. Test temperature 260 ±5℃ Test time 5 ±1 sec. MIL-STD-202F 7 8 4.2 Environmental endurance # Item 1 High temperature storage 2 Low temperature storage Test Condition Temperature : +125°C ± 3°C Duration : 500 ± 12 hours Reference MIL-STD-883E Temperature : -40°C ± 3°C Duration : 500 ± 12 hours MIL-STD-883E Total 100 cycles of the following temperature cycle 1 cycle 3 Thermal shock (Air to Air) 125 ± 3 oC MIL-STD-883E 25 oC -40 ± 3 oC 10 min. 10 min. 10 min. max. 4 High temperature & humidity Temperature : 85°C ± 3°C Humidity : RH 85% Duration : 500 hours FAITH LONG CRYSTAL Proprietary and Confidential Information JIS C5023 Page 11 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 5. Taping and Packing 5.1 Tape and reel (EIA-481-2) Direction of feed Index mark Direction of products Carrier tape Reel Cover tape YL2 6 0 ■Y□□□ Reel label (Model, Qty, Lot, ...) Package Type Dimension (Unit : mm) A0 B0 2.25±0.1 2.70±0.1 2520 TSX (8mm) P1 P2 4.00±0.1 2.00±0.1 Standard Reel Quantity is 3000 pcs per reel. The inspection standard of tape tension Item K0 1.45±0.1 D1 1.00±0.1 T 0.25±0.05 D0 1.55±0.05 W 8.00±0.3 P0 4.00±0.1 E 1.75±0.2 Defect Method F 3.50±0.1 Appearance All 1. The tape is not coincidence 2. The bubble Visual inspection Tape tension 2520 - 8mm Overstep 55±6g (49 to 61g) Pull test FAITH LONG CRYSTAL Proprietary and Confidential Information Page 12 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 5. Taping and Packing (Cont.) 5.2 Packing standard Out-going packing instruction Reel packing Name:Reel Standard:Diameter 18cm Material:Plastics Name:Anti-static shielding bag Standard:205250mm Material:APET/CPP Inner packing Name:Bubble wrap Standard:430330(t)20mm Material:HDPE Quantity : Max.15 reels Carton Name:Carton Standard:400400(H)280mm Material:AB corrugated paper Quantity:4 bags L1 L2 The label information Label Label Drawing L1 L2 Name of Article 条码标签 Bar Code Label 条码标签 Bar Code Label Spec. 1.Customer P/N 2.Manufacturer P/N 3.Q'ty 4.Vendor Code 5.Lot No 6.Date Code 7.Manufacturer 8.Country of Origin 1.PO NO 2.Customer P/N 3.Manufacturer P/N 4.Q'ty 5.Vendor Code 6.Lot No 7.Date Code 8.Manufacturer 9.Country of Origin Label size Printing 7050mm White 10075mm White 10075mm White 1.Date Code 2.Q'ty L2 Remark: 条码标签 Bar Code Label Specifications on the label is for default templates purpose and may change with different product. If any specified requirements for labels packaging is needed, please provide the instruction information. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 13 of 14 SMD TSX 2.5 x 2.0 (TH + Xtal) PN: 2Z19200001 Ver. S1 6. Specification of the Environment-related Substances # Range Banned Substances Max. concentration (ppm; mg/kg) Product Packing 1 镉及镉化合物 Cadmium and cadmium compounds 100 100 2 铅及铅化合物 Lead and lead compounds 1000 100 3 汞及汞化合物 Mercury and mercury compounds 1000 100 4 六价铬化合物 +6 Hexavalent-Chromium VI (Cr ) 1000 100 5 聚溴联苯 PBB Polybrominated biphenyls 1000 N/A 6 聚溴二苯醚 PBDE Polybrominated diphenyl ethers 1000 N/A 7 邻苯二甲酸二(2-乙基己基)酯 DEHP Di (2-ethylhexyl) phthalate 1000 N/A 8 邻苯二甲酸丁苄酯 BBP Butyl Benzyl Phthalate 1000 N/A 9 邻苯二甲酸二丁酯 DBP Dibutyl Phthalate 1000 N/A 10 邻苯二甲酸二异丁酯 DIBP Diisobutyl Phthalate 1000 N/A 11 氟(F)、氯(Cl)、溴(Br)、碘(I) Fluorine, Chlorine, Bromine, Iodine 900、900、900、900 注:Br + Cl<1000 N/A 12 包装材料中重金属(汞、镉、六价铬、 铅、PBB、PBDE)之总量 Heavy metals (mercury, cadmium, lead, Cr+6,PBB and PBDE) in packing materials N/A 100 铅(Pb) + 镉(Cd) + 汞(Hg) + 六价 铬(Cr+6)
2Z19200001 价格&库存

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2Z19200001
  •  国内价格
  • 1+0.93240
  • 30+0.90090
  • 100+0.86940
  • 500+0.80640
  • 1000+0.77490
  • 2000+0.75600

库存:0