PRODUCT SPECIFICATION SHEET
Customer
Customer P/N
Product Type
Temperature Sensing Crystal
Part Number
2Z19200001
Part Description
Nominal Frequency
Prepared
Li Xiang
Reviewed
Kuro Peng
Approved
Xing Yue
Date
2022-6-2
Version
S1
SMD TSX 2.5 x 2.0 (TH + Xtal)
19.200000MHz
广东惠伦晶体科技股份有限公司
中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号
68 Donghuan Road, Jitigang Village, Huangjiang,
Dongguan, Guangdong Province, P. R. China
WEB : http://www.dgylec.com/
TEL : +86 ( 0 ) 769 - 38879888
FAX : +86 ( 0 ) 769 - 38879889
EMAIL : yl@dgylec.com
FAITH LONG CRYSTAL Proprietary and Confidential Information
Customer's Approval & Date:
RoHS
COMPLIANT
Pb
Lead-Free
Moisture Sensitivity Level 1
Page 1 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
CONTENTS
#
Item
1
History of Specification Revision
3
2
Electrical Specifications
4
3
4
5
6
Page
2.1 Specifications for operation condition and electrical characteristics
4
2.2 Specifications for crystal drive level dependency (DLD)
5
2.3 Specifications for GPS quality
6
2.4 NTC thermistor specification table
7
Product Design
8
3.1 Package dimensions and pad functions
8
3.2 Recommended land pattern
8
3.3 Recommended reflow profile
8
3.4 Marking definition
9
3.5 Recommended reflow profile
9
3.6 Structure illustration
10
Reliability Assurance
11
4.1 Mechanical endurance
11
4.2 Environmental endurance
11
Taping and Packing
12
5.1 Tape and reel
12
5.2 Packing standard
13
Specification of the Environment-related Substances
FAITH LONG CRYSTAL Proprietary and Confidential Information
14
Page 2 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
1. History of Specification Revision
Ver.
Content
Date
Reviser
S0
Initial released
2021-7-1
Chen XuanRu
S1
Change marking information
2022-6-2
Li xiang
FAITH LONG CRYSTAL Proprietary and Confidential Information
Remark
Page 3 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
2. Electrical Specifications
2.1 Specifications for operation condition and electrical characteristics
#
Parameter
Min.
Typ.
1
Nominal frequency
19.200000
2
Crystal cut type
AT-cut
3
Mode of vibration
Fundamental
Load
capacitance
(C
)
4
7.0
L
5
Drive level
10
6
Operating temperature range
-30
7
Storage temperature range
-40
8
Initial frequency tolerance
-10
-
Max.
Remark
100
+105
+105
Unit
MHz
pF
mW
°C
°C
+10
ppm
At 30±3°
Note 1.
9
Frequency drift after reflow
-2.0
-
+2.0
ppm
After two times of reflow
(0.5Hr freq. driftsubstruct
168Hr freq.)
10
Tolerance over temperature
(reference 30°C)
-12
-
12
ppm
Within -30°C to +85°C.
Above +85°C see Note 2.
11
12
13
14
15
16
17
Frequency aging
Equivalent series resistance (ESR)
Insulation resistance
Quality factor (Q)
Spurious mode series resistance
Shunt Capaitance (C0)
Motional Capacitance (C1)
-0.7
500
75,000
1100
0.3
1.8
-
+0.7
70
1.3
3.1
ppm/yr
Ω
MΩ
Ω
pF
fF
18
First-order curve fitting parameter(C1)
-0.4
0
-0.1
ppm/°C
Note 5.
19
Second-order curve fitting parameter
(C2)
-4.5
0
+4.5
x10-4
ppm/°C2
Note 5.
20
Third-order curve fitting parameter (C4)
8.5
10
11.5
x10-5
ppm/°C3
Note 5.
Note 3.
at DC 100V
Note 4.
Within ±500 KHz offset.
Note 1
Note 2
Note 3
The load capacitance is measured according to IEC Standard #60444-7.
Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range.
The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the
minimum Q.
Note 4
Note 5
The minimum Q value calculated from ESR and L is smaller than this specification.
The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the
temperatureinflection point t0 = 30°C.
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Page 4 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
2. Electrical Specifications (Cont.)
2.2 Specifications for crystal drive level dependency (DLD)
#
Parameter
Min.
Typ.
Max.
Unit
Remarks
0.01
-
100
mW
Drive level from 0.01 μW
to 100 μW to 0.01 μW
1
Drive level measurement condition
2
DLD Frequency (Maximum - Minimum)
-
-
3.0
ppm
Define as FDLD.
Note 6.
3
DLD Frequency (Repeatability)
-
-
0.7
ppm
Define as FDLDH.
Note 7.
4
DLD ESR (Maximum - Minimum)
-
-
20.0
%
Define as DLD2.
Note 6.
5
DLD ESR (Repeatability)
-
-
10.0
%
Define as DLDH2.
Note 7~9.
Note 6
Note 7
Note 8
Note 9
Maximum - minimum: Difference between the maximum and minimum in a two-way measurement.
Repeatability of the two-way measurement is defined in the above Drive level measurement condition.
ESR1: This is the first measurement on each drive level.
ESR2: This is the second measurement on each drive level.
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 5 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
2. Electrical Specifications (Cont.)
2.3 Specifications for GPS quality
#
Parameter
Min.
Typ.
Max.
Unit
Remarks
Note 11.
1
Full Cycle Frequency stability slope
-50
-
+50
ppb/°C
2
5℃ Small Cycle
Frequency stability slope 1
-50
-
+50
ppb/°C
3
5℃ Small Cycle
Frequency stability slope 2
100 (magnitude)
ppb pk-pk
4
5
ESD
MSL
HBM>2000V
Level 1
-
Note 10
Note 11
Average measured peakto-peak frequency
difference.
JESD22-A114-B
IPC/JEDEC J-STD-033C
Temp. range:-30 to 85℃ for each 1℃, Temp. rate: ~1.0°C/min
Test flow: 25℃(1)->-30℃->85℃->25℃(2), (25℃(1) freq. drift subtract 25℃(2) freq. drift)
Test condition: Continuous temperature rate change of~ 1.0°C/min
Measure FT points every 1℃, heating up from -30 to 85℃, subtract a fifth-order polynomial best fit, and then
calculate the slope of the residual.
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Page 6 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
2. Electrical Specifications (Cont.)
2.4 NTC thermistor specification table
#
Parameter
1
Operating temperature range
2
Storage temperature range
3
Resistance
4
B-constant
5
Tolerance
Min.
-30
-40
-
Typ.
100
4,250
-
Max.
+105
+105
1
Unit
°C
°C
kΩ
K
%
Remarks
At 25°C*
At 25°C - 50°C
*In order to get the precise resistance value of the thermistor, the temperature control will be very important
during testing since the resistance value will change ~4% per 1℃ temperature difference.
Please check the following Murata website for detail explanation.
https://www.murata.com/en-us/support/faqs/products/thermistor/ntc/pct/0001
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 7 of 14
PN: 2Z19200001
SMD TSX 2.5 x 2.0 (TH + Xtal)
Ver.
S1
3. Product Design
3.1 Package dimensions and pad functions
(Unit : mm)
Top view
3.2 Pad connection diagram and function
Bottom view
#1
#2
#4
#3
YL 1 9 2
Lateral view
Pad
1
2
3
4
Bottom view
3.3 Recommended land pattern
Function
Xtal in
Thermistor out, connecting to ground
Xtal out
Thermistor in
(Unit : mm)
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 8 of 14
PN: 2Z19200001
SMD TSX 2.5 x 2.0 (TH + Xtal)
Ver.
S1
3. Product Design (Cont.)
3.4 Marking definition
Frequency
EX: 19.200MHz = 192
YL
lot (2 digits)
year month code
Administrative Symbo
Table of Year and Month code
Month
JAN FEB
Year
2021
2022
2023
2024
2025
2026
2027
2028
A
N
a
n
B
P
b
p
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
C
Q
c
q
D
R
d
r
E
S
e
s
F
T
f
t
G
U
g
u
H
V
h
v
J
W
j
w
K
X
k
x
L
Y
l
y
M
Z
m
z
3.5 Recommended reflow profile
Temp. (℃)
10 sec. Max.
265
260
5
(1) Total time : 360 sec. Max.
(2) Solder melting point : 225℃
220
60 sec. Max.
180
150
120 sec. Max.
Time (sec.)
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 9 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
3. Product Design (Cont.)
3.6 Structure illustration
#
1
Components
Cap (Lid)
2
Base (Package)
3
4
5
6
Pad (Package)
Crystal blank
Electrode
Conductive adhesive
7
Thermistor
8
Solder
Materials
Kovar (Fe + Co + Ni)
Ceramic (AI2O3) +
Kovar (Fe + Co + Ni)
Ni + Au
SiO2
Cr + Nobel material
Ag
Alumina Ceramics
(Al2O3), Ni + Ag+ Sn
QTY
1
Finish/Specifications
Ni plating
1
Alumina ceramics
4
1
2
2
Tungsten metalization + Ni plating + Au plating
-
1
-
Sn + Ag + Cu
2
-
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Silicone resin
Page 10 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
4. Reliability Assurance
4.1 Mechanical endurance
#
Item
Test Condition
Reference
1
Drop test
150 cm height, fall freely onto stainless plate, 3 times.
JIS C6701
2
Shock test
150 g weight, 150 cm height onto concrete floor.
Each direction (±x, ±y, ±z) for 3 cycles.
IEC-68-02-27
3
Mechanical shock
Half sine wave 1000 G. Three mutually perpendicular
axes, each axis for 3 times. Duration time 1.0ms.
MIL-STD-202F
4
Vibration
Frequency range : 10 ~ 55 Hz
Amplitude : 1.52 mm
Pendicular axes each test time : 2 hours(x,y,z Axis)
Total test time 6 hours
MIL-STD-883E
5
Gross Leak
Standard sample for automatic gross leak detector.
Test pressure: 2kg /cm2.
MIL-STD-883E
6
Fine Leak
Helium bombing 4.5 kgf/cm2 for 2 hours.
MIL-STD-883E
Solderability
Temperature : 260°C ± 5°C
Immersing depth : 0.5 mm minimum
Immersion time : 5 ±1 seconds
Flux : Rosin resin methyl alcohol solvent (1:4)
GB/T 2424.172008 / IEC
60068-244:1995;
GB/T 2423.282005 / IEC
60068-220:1979
Resistance To Soldering Heat
Pre-heat temperature 125℃
Pre-heat time 60 ~ 120 sec.
Test temperature 260 ±5℃
Test time 5 ±1 sec.
MIL-STD-202F
7
8
4.2 Environmental endurance
#
Item
1
High temperature storage
2
Low temperature storage
Test Condition
Temperature : +125°C ± 3°C
Duration : 500 ± 12 hours
Reference
MIL-STD-883E
Temperature : -40°C ± 3°C
Duration : 500 ± 12 hours
MIL-STD-883E
Total 100 cycles of the following temperature cycle
1 cycle
3
Thermal shock
(Air to Air)
125 ± 3 oC
MIL-STD-883E
25 oC
-40 ± 3 oC
10 min.
10 min.
10 min. max.
4
High temperature &
humidity
Temperature : 85°C ± 3°C
Humidity : RH 85%
Duration : 500 hours
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JIS C5023
Page 11 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
5. Taping and Packing
5.1 Tape and reel (EIA-481-2)
Direction of feed
Index mark
Direction of products
Carrier tape
Reel
Cover tape
YL2 6 0
■Y□□□
Reel label (Model, Qty, Lot, ...)
Package Type
Dimension (Unit : mm)
A0
B0
2.25±0.1
2.70±0.1
2520 TSX (8mm)
P1
P2
4.00±0.1
2.00±0.1
Standard Reel Quantity is 3000 pcs per reel.
The inspection standard of tape tension
Item
K0
1.45±0.1
D1
1.00±0.1
T
0.25±0.05
D0
1.55±0.05
W
8.00±0.3
P0
4.00±0.1
E
1.75±0.2
Defect
Method
F
3.50±0.1
Appearance
All
1. The tape is not coincidence
2. The bubble
Visual inspection
Tape tension
2520 - 8mm
Overstep 55±6g (49 to 61g)
Pull test
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Page 12 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
5. Taping and Packing (Cont.)
5.2 Packing standard
Out-going packing instruction
Reel packing
Name:Reel
Standard:Diameter 18cm
Material:Plastics
Name:Anti-static shielding bag
Standard:205250mm
Material:APET/CPP
Inner packing
Name:Bubble wrap
Standard:430330(t)20mm
Material:HDPE
Quantity : Max.15 reels
Carton
Name:Carton
Standard:400400(H)280mm
Material:AB corrugated paper
Quantity:4 bags
L1
L2
The label information
Label
Label Drawing
L1
L2
Name of Article
条码标签
Bar Code Label
条码标签
Bar Code Label
Spec.
1.Customer P/N
2.Manufacturer P/N
3.Q'ty
4.Vendor Code
5.Lot No
6.Date Code
7.Manufacturer
8.Country of Origin
1.PO NO
2.Customer P/N
3.Manufacturer P/N
4.Q'ty
5.Vendor Code
6.Lot No
7.Date Code
8.Manufacturer
9.Country of Origin
Label size
Printing
7050mm
White
10075mm
White
10075mm
White
1.Date Code
2.Q'ty
L2
Remark:
条码标签
Bar Code Label
Specifications on the label is for default templates purpose and may change with different product.
If any specified requirements for labels packaging is needed, please provide the instruction information.
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Page 13 of 14
SMD TSX 2.5 x 2.0 (TH + Xtal)
PN: 2Z19200001
Ver.
S1
6. Specification of the Environment-related Substances
#
Range
Banned Substances
Max. concentration (ppm; mg/kg)
Product
Packing
1
镉及镉化合物
Cadmium and cadmium compounds
100
100
2
铅及铅化合物
Lead and lead compounds
1000
100
3
汞及汞化合物
Mercury and mercury compounds
1000
100
4
六价铬化合物
+6
Hexavalent-Chromium VI (Cr )
1000
100
5
聚溴联苯 PBB
Polybrominated biphenyls
1000
N/A
6
聚溴二苯醚 PBDE
Polybrominated diphenyl ethers
1000
N/A
7
邻苯二甲酸二(2-乙基己基)酯 DEHP
Di (2-ethylhexyl) phthalate
1000
N/A
8
邻苯二甲酸丁苄酯 BBP
Butyl Benzyl Phthalate
1000
N/A
9
邻苯二甲酸二丁酯 DBP
Dibutyl Phthalate
1000
N/A
10
邻苯二甲酸二异丁酯 DIBP
Diisobutyl Phthalate
1000
N/A
11
氟(F)、氯(Cl)、溴(Br)、碘(I)
Fluorine, Chlorine, Bromine, Iodine
900、900、900、900
注:Br + Cl<1000
N/A
12
包装材料中重金属(汞、镉、六价铬、
铅、PBB、PBDE)之总量
Heavy metals (mercury, cadmium, lead,
Cr+6,PBB and PBDE) in packing materials
N/A
100
铅(Pb) + 镉(Cd) + 汞(Hg) + 六价
铬(Cr+6)
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