NUC029xGE
Arm® Cortex® -M
32-bit Microcontroller
NuMicro® Family
NUC029xGE Series
Datasheet
Nuvoton is providing this document only for reference purposes of NuMicro® microcontroller based
system design. Nuvoton assumes no responsibility for errors or omissions.
All data and specifications are subject to change without notice.
For additional information or questions, please contact: Nuvoton Technology Corporation.
www.nuvoton.com
Oct 18, 2019
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NUC029XGE SERIES DATASHEET
The information described in this document is the exclusive intellectual property of
Nuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.
NUC029xGE
TABLE OF CONTENTS
1 GENERAL DESCRIPTION .............................................................................. 8
1.1 Key Feature and Application ........................................................................................ 8
2 FEATURES.....................................................................................................10
3 ABBREVIATIONS ..........................................................................................17
3.1 Abbriviations ................................................................................................................. 17
4 PARTS INFORMATION LIST AND PIN CONFIGURATION ..........................19
4.1 NuMicro® NUC029 Series Naming Rule .................................................................. 19
4.2 NuMicro® NUC029 Series Selection Guide ............................................................. 20
4.3 Pin Configuration.......................................................................................................... 21
®
4.3.1 NuMicro NUC029xGE Pin Diagram .......................................................................... 21
4.4 Pin Description ............................................................................................................. 24
4.4.1 NUC029xGE Pin Description ....................................................................................... 24
4.4.2 GPIO Multi-function Pin Summary .............................................................................. 43
5 BLOCK DIAGRAM .........................................................................................60
5.1 NuMicro® NUC029xGE Block Diagram .................................................................... 60
6 FUNCTIONAL DESCRIPTION .......................................................................61
6.1 Arm® Cortex®-M0 Core ................................................................................................ 61
6.2 System Manager .......................................................................................................... 63
NUC029XGE SERIES DATASHEET
6.2.1 Overview ......................................................................................................................... 63
6.2.2 System Reset ................................................................................................................. 63
6.2.3 Power Modes and Wake-up Sources.......................................................................... 70
6.2.4 System Power Distribution ........................................................................................... 73
6.2.5 System Memory Map..................................................................................................... 75
6.2.6 SRAM Memory Orginization ......................................................................................... 77
6.2.7 Register Lock .................................................................................................................. 79
6.2.8 Auto Trim ......................................................................................................................... 86
6.2.9 UART1_TXD modulation with PWM ........................................................................... 86
6.2.10 Voltage Detector (VDET) .............................................................................................. 87
6.2.11 System Timer (SysTick) ................................................................................................ 88
6.2.12 Nested Vectored Interrupt Controller (NVIC) ............................................................. 89
6.2.13 System Control ............................................................................................................... 92
6.3 Clock Controller ............................................................................................................ 93
6.3.1 Overview ......................................................................................................................... 93
6.3.2 System Clock and SysTick Clock ................................................................................ 96
6.3.3 Peripherals Clock ........................................................................................................... 97
6.3.4 Power-down Mode Clock .............................................................................................. 98
6.3.5 Clock Output ................................................................................................................... 98
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6.4 Flash Memeory Controller (FMC) ............................................................................ 100
6.4.1 Overview ....................................................................................................................... 100
6.4.2 Features ........................................................................................................................ 100
6.5 Analog Comparator Controller (ACMP) .................................................................. 101
6.5.1 Overview ....................................................................................................................... 101
6.5.2 Features ........................................................................................................................ 101
6.6 Analog-to-Digital Converter (ADC) .......................................................................... 102
6.6.1 Overview ....................................................................................................................... 102
6.6.2 Features ........................................................................................................................ 102
6.7 CRC Controller (CRC) ............................................................................................... 103
6.7.1 Overview ....................................................................................................................... 103
6.7.2 Features ........................................................................................................................ 103
6.8 External Bus Interface (EBI) ..................................................................................... 104
6.8.1 Overview ....................................................................................................................... 104
6.8.2 Features ........................................................................................................................ 104
6.9 General Purpose I/O (GPIO) .................................................................................... 105
6.9.1 Overview ....................................................................................................................... 105
6.9.2 Features ........................................................................................................................ 105
6.10
Hardware Divider (HDIV) .................................................................................... 106
6.10.1 Overview ....................................................................................................................... 106
6.10.2 Features ........................................................................................................................ 106
6.11
I2C Serial Interface Controller (I2C) ................................................................... 107
6.11.2 Features ........................................................................................................................ 107
6.12
PDMA Controller (PDMA) ................................................................................... 108
6.12.1 Overview ....................................................................................................................... 108
6.12.2 Features ........................................................................................................................ 108
6.13
PWM Generator and Capture Timer (PWM) .................................................... 109
6.13.1 Overview ....................................................................................................................... 109
6.13.2 Features ........................................................................................................................ 109
6.14
Real Time Clock (RTC) ....................................................................................... 111
6.14.1 Overview ....................................................................................................................... 111
6.14.2 Features ........................................................................................................................ 111
6.15
Smart Card Host Interface (SC) ......................................................................... 112
6.15.1 Overview ....................................................................................................................... 112
6.15.2 Features ........................................................................................................................ 112
6.16
Serial Peripheral Interface (SPI) ........................................................................ 113
6.16.1 Overview ....................................................................................................................... 113
6.16.2 Features ........................................................................................................................ 113
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6.11.1 Overview ....................................................................................................................... 107
NUC029xGE
6.17
Timer Controller (TMR) ....................................................................................... 114
6.17.1 Overview ....................................................................................................................... 114
6.17.2 Features ........................................................................................................................ 114
6.18
USB Device Controller (USBD).......................................................................... 116
6.18.1 Overview ....................................................................................................................... 116
6.18.2 Features ........................................................................................................................ 116
6.19
USCI - Universal Serial Control Interface Controller ...................................... 117
6.19.1 Overview ....................................................................................................................... 117
6.19.2 Features ........................................................................................................................ 117
6.20
USCI – UART Mode............................................................................................. 118
6.20.1 Overview ....................................................................................................................... 118
6.20.2 Features ........................................................................................................................ 118
6.21
USCI - SPI Mode .................................................................................................. 119
6.21.1 Overview ....................................................................................................................... 119
6.21.2 Features ........................................................................................................................ 119
6.22
USCI - I2C Mode ................................................................................................... 121
6.22.1 Overview ....................................................................................................................... 121
6.22.2 Features ........................................................................................................................ 121
6.23
UART Interface Controller (UART) .................................................................... 122
6.23.1 Overview ....................................................................................................................... 122
6.23.2 Features ........................................................................................................................ 122
6.24
Window Watchdog Timer (WWDT) ................................................................... 123
NUC029XGE SERIES DATASHEET
6.24.1 Overview ....................................................................................................................... 123
6.24.2 Features ........................................................................................................................ 123
6.25
Window Watchdog Timer (WWDT) ................................................................... 124
6.25.1 Overview ....................................................................................................................... 124
6.25.2 Features ........................................................................................................................ 124
7 APPLICATION CIRCUIT ..............................................................................125
8 ELECTRICAL CHARACTERISTICS ............................................................126
8.1 Absolute Maximum Ratings...................................................................................... 126
8.1.1 Absolute Maximum Ratings Characteristics ............................................................ 126
8.1.2 Thermal Characteristics .............................................................................................. 127
8.1.3 EMC Characteristics .................................................................................................... 128
8.1.4 Package Moisture Sensitivity(MSL) .......................................................................... 129
8.1.5 Soldering Profile ........................................................................................................... 130
8.2 DC Electrical Characteristics.................................................................................... 131
8.3 AC Electrical Characteristics .................................................................................... 139
8.3.1 External 4~20 MHz High Speed Crystal (HXT) Input Clock .................................. 139
8.3.2 External 4~20 MHz High Speed Crystal (HXT) Oscillator...................................... 140
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8.3.3 External 32.768 kHz Low Speed Crystal (LXT) Input Clock .................................. 141
8.3.4 External 32.768 kHz Low Speed Crystal (LXT) Input Clock .................................. 142
8.3.5 Internal 48 MHz High Speed RC Oscillator (HIRC48) ............................................ 143
8.3.6 Internal 22.1184 MHz High Speed RC Oscillator (HIRC) ....................................... 143
8.3.7 Internal 10 kHz Low Speed RC Oscillator (LIRC) ................................................... 144
8.4 Analog Characteristics .............................................................................................. 145
8.4.1 LDO ................................................................................................................................ 145
8.4.2 Temperature Sensor .................................................................................................... 145
8.4.3 Internal Voltage Reference (Int_VREF) ....................................................................... 145
8.4.4 Power-on Reset............................................................................................................ 146
8.4.5 Low-Voltage Reset ....................................................................................................... 146
8.4.6 Brown-out Detector ...................................................................................................... 146
8.4.7 12-bit ADC ..................................................................................................................... 147
8.4.8 Analog Comparator ...................................................................................................... 149
8.4.9 USB PHY....................................................................................................................... 150
8.5 Flash DC Electrical Characteris ............................................................................... 151
8.6 I2C Dynamic Characteristics ..................................................................................... 152
8.7 SPI Dynamic Characteristics .................................................................................... 153
8.7.1 Dynamic Characteristics of Data Input and Output Pin .......................................... 153
9 PACKAGE DIMENSIONS ............................................................................155
9.1 LQFP 128L (14x14x1.4 mm2 footprint 2.0 mm) ..................................................... 155
9.2 LQFP 64L (7x7x1.4 mm2 footprint 2.0 mm) ........................................................... 156
10 REVISION HISTORY ....................................................................................158
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9.3 LQFP 48L (7x7x1.4 mm2 footprint 2.0mm) ............................................................ 157
NUC029xGE
LIST OF FIGURES
®
Figure 4.1-1 NuMicro NUC029 Series Selection Code ................................................................ 19
®
Figure 4.3-1 NuMicro NUC029LGE LQFP 48-pin Diagram .......................................................... 21
®
Figure 4.3-2 NuMicro NUC029SGE LQFP 64-pin Diagram ......................................................... 22
®
Figure 4.3-3 NuMicro NUC029KGE LQFP 128-pin Diagram ....................................................... 23
®
Figure 5.1-1 NuMicro NUC029xGE Block Diagram ...................................................................... 60
Figure 6.1-1 Functional Block Diagram .......................................................................................... 61
Figure 6.2-1 System Reset Sources ............................................................................................... 64
Figure 6.2-2 nRESET Reset Waveform ......................................................................................... 67
Figure 6.2-3 Power-on Reset (POR) Waveform ............................................................................. 67
Figure 6.2-4 Low Voltage Reset (LVR) Waveform ......................................................................... 68
Figure 6.2-5 Brown-out Detector (BOD) Waveform ....................................................................... 69
®
Figure 6.2-6 NuMicro NUC029xGE Power Mode State Machine ................................................. 71
®
Figure 6.2-7 NuMicro NUC029xGE Power Distribution Diagram ................................................. 74
Figure 6.2-8 SRAM Block Diagram ................................................................................................ 77
Figure 6.2-9 SRAM Memory Organization ..................................................................................... 78
Figure 6.2-10 UART1_TXD Modulated with PWM Channel........................................................... 87
Figure 6.2-11 VDET Block Diagram ............................................................................................... 87
Figure 6.3-1 Clock Generator Block Diagram................................................................................. 94
Figure 6.3-2 Clock Generator Global View Diagram ...................................................................... 95
Figure 6.3-3 System Clock Block Diagram ..................................................................................... 96
NUC029XGE SERIES DATASHEET
Figure 6.3-4 HXT Stop Protect Procedure...................................................................................... 97
Figure 6.3-5 SysTick Clock Control Block Diagram ....................................................................... 97
Figure 6.3-6 Clock Source of Clock Output .................................................................................... 98
Figure 6.3-7 Clock Output Block Diagram ...................................................................................... 99
Figure 6.21-1 SPI Master Mode Application Block Diagram ........................................................ 119
Figure 6.21-2 SPI Slave Mode Application Block Diagram .......................................................... 119
2
Figure 6.22-1 I C Bus Timing ....................................................................................................... 121
Figure 8.1-1 Soldering Profile from J-STD-020C ......................................................................... 130
Figure 8.3-1 Typical Crystal Application Circuit ............................................................................ 140
Figure 8.3-2 Typical Crystal Application Circuit ............................................................................ 142
2
Figure 8.6-1 I C Timing Diagram .................................................................................................. 152
Figure 8.7-1 SPI Master Mode Timing Diagram ........................................................................... 153
Figure 8.7-2 SPI Slave Mode Timing Diagram ............................................................................. 154
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List of Tables
Table 1.1-1 Key Features Support Table ......................................................................................... 8
Table 3.1-1 List of Abbreviations .................................................................................................... 18
Table 4.4-1 NUC029xGE GPIO Multi-function Table ..................................................................... 59
Table 6.2-1 Reset Value of Registers ............................................................................................. 66
Table 6.2-2 Power Mode Difference Table ..................................................................................... 70
Table 6.2-3 Clocks in Power Modes ............................................................................................... 72
Table 6.2-4 Condition of Entering Power-down Mode Again ......................................................... 73
Table 6.2-5 Address Space Assignments for On-Chip Controllers ................................................ 76
Table 6.2-6 Protected Registers List .............................................................................................. 86
Table 6.2-7 Exception Model .......................................................................................................... 90
Table 6.2-8 Interrupt Number Table ............................................................................................... 91
Table 6.3-1 Clock Stable Count Value Table ................................................................................. 93
Table 8.1-1 Absolute Maximum Ratings Characteristics.............................................................. 126
Table 8.1-2 Thermal Characteristics ............................................................................................ 127
Table 8.1-3 EMC Characteristics .................................................................................................. 128
Table 8.1-4 Package Moisture Sensitivity (MSL) ......................................................................... 129
Table 8.1-5 Soldering Profile ........................................................................................................ 130
NUC029XGE SERIES DATASHEET
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1
GENERAL DESCRIPTION
®
®
®
The NuMicro NUC029xGE of NUC029 series microcontroller based on the Arm Cortex -M0 core
operates at up to 72 MHz. With its crystal-less USB 2.0 FS interface, it is able to generate precise
frequency required by USB protocol without the need of external crystal. It features adjustable V DDIO
pins for specific I/O pins with a wide range of voltage from 1.8 V to 5.5 V for various operating voltages
of external components, a unique high-speed PWM with clock frequency up to 144 MHz for precision
control, and an integrated hardware divider to speed up the calculation for the control algorithms. Apart
from that, the NUC029xGE also integrates SPROM (Security Protection ROM) which provides a
®
secure code execution area to protect the intelligent property of developers. The NuMicro
NUC029xGE of NUC029 series is ideal for industrial control, motor control and metering applications.
®
The NuMicro NUC029xGE of NUC029 series supports the wide voltage range from 2.5 V to 5.5 V and
temperature ranging from -40℃ to 105℃, up to 256 Kbytes of Flash memory, 20 Kbytes of SRAM, 4
Kbytes of ISP (In-System Programming) ROM as well as ICP (In-Circuit Programming) ROM and IAP
(In-Application Programming) ROM in 48-, 64-, 128-pin packages. It is also equipped with plenty of
peripherals such as USB interface, Timers, Watchdog Timers, RTC, PDMA, EBI, UART, Smart Card
Interface, SPI, I²S, I²C, GPIO, up to 12 channels of 16-bit PWM, up to 20 channels of 12-bit ADC,
analog comparator, temperature sensor, low voltage reset, brown-out detector, 96-bit UID (Unique
Identification), and 128-bit UCID (Unique Customer Identification).
1.1
Key Feature and Application
USCI UART
ISO
NUC029XGE SERIES DATASHEET
PWM
EBI
PDMA
ADC
ACMP
RTC
VBAT
VDDIO
0
10
√
5
9
2
√
√
2
0
12
√
5
15
2
√
√
2
2
12
√
5
20
2
√
√
I2C SPI/I2S
Product Line
USB
NUC029LGE
2.0 FS
Device
3
3
2
2
NUC029SGE
2.0 FS
Device
3
3
2
NUC029KGE
2.0 FS
Device
3
3
2
7816
Table 1.1-1 Key Features Support Table
®
The NuMicro NUC029xGE of NUC029 series is suitable for a wide range of applications such as:
Industrial Automation
PLCs
Inverters
Home Automation
Security Alarm System
Power Metering
Portable Data Collector
Portable RFID Reader
System Supervisors
Smart Card Reader
Printer
Bar Code Scanner
Motor Control
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Digital Power
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2
FEATURES
NUC029XGE SERIES DATASHEET
Core
®
®
– Arm Cortex -M0 core running up to 72 MHz
– One 24-bit system timer
– Supports low power sleep mode
– Single-cycle 32-bit hardware multiplier
– NVIC for the 32 interrupt inputs, each with 4-levels of priority
– Supports programmable mask-able interrupts
– Serial Wire Debug supports with 2 watch-points / 4 breakpoints
Built-in LDO for wide operating voltage ranged from 2.5 V to 5.5 V
Flash Memory
– Supports 256/128 KB application ROM (APROM)
– Supports 4 KB Flash for loader (LDROM)
– Supports 2 KB Security Protection Rom (SPROM)
– Supports 12 bytes User Configuration block to control system initiation
– Supports Data Flash with configurable memory size
– Supports 2 KB page erase for all embedded flash
– Supports In-System-Programming (ISP), In-Application-Programming (IAP) update
embedded flash memory
– Supports CRC-32 checksum calculation function
– Supports flash all one verification function
– Hardware external read protection of whole flash memory by Security Lock Bit
– Supports 2-wired ICP update through SWD/ICE interface
SRAM Memory
– 20 KB embedded SRAM
– Supports byte-, half-word- and word-access
– Supports PDMA mode
Hardware Divider
– Signed (two’s complement) integer calculation
– 32-bit dividend with 16-bit divisor calculation capacity
– 32-bit quotient and 32-bit remainder outputs (16-bit remainder with sign extends to 32-bit)
– Divided by zero warning flag
– 6 HCLK clocks taken for one cycle calculation
– Write divisor to trigger calculation
– Waiting for calculation ready automatically when reading quotient and remainder
PDMA (Peripheral DMA)
– Supports 5 independent configurable channels for automatic data transfer between
memories and peripherals
– Supports single and burst transfer type
– Supports Normal and Scatter-Gather Transfer modes
– Supports two types of priorities modes: Fixed-priority and Round-robin modes
– Supports byte-, half-word- and word-access
– Supports incrementing mode for the source and destination address for each channel
– Supports time-out function for channel 0 and channel 1
– Supports software and SPI/I2S, UART, USCI, USB, ADC, PWM and TIMER request
Clock Control
– Built-in 22.1184 MHz high speed RC oscillator for system operation (Frequency variation <
2% at -40℃ ~ +105℃)
– Built-in 48 MHz internal high speed RC oscillator for USB device operation
– Built-in 10 kHz low speed RC oscillator for Watchdog Timer and Wake-up operation
– Built-in 4~20 MHz high speed crystal oscillator for precise timing operation
– Built-in 32.768 kHz low speed crystal oscillator for Real Time Clock
– Supports PLL up to 144 MHz for high resolution PWM operation
– Supports dynamically calibrating the HIRC48 to 48 MHz ±0.25% by external 32.768 kHz
crystal oscillator (LXT)
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– Supports dynamically calibrating the HIRC to 22.1184Mhz by external 32.768 kHz crystal
oscillator (LXT)
– Supports clock on-the-fly switch
– Supports clock failure detection for system clock
– Supports auto clock switch once clock failure detected
– Supports exception (NMI) generated once a clock failure detected
– Supports divided clock output
GPIO
– Four I/O modes
– TTL/Schmitt trigger input selectable
– I/O pin configured as interrupt source with edge/level trigger setting
– Supports high driver and high sink current I/O (up to 20 mA at 5 V)
– Supports software selectable slew rate control
– Supports up to 86/49/35 GPIOs for LQFP128/64/48 respectively
– Supports 5V-tolerance function for following pins
PA.0~PA.15, PB.12, PC.0~PC.7 PC.9~PC.14, PD.4~PD.7, PD.10~PD.15, PE.0~PE.1,
PE.3~PE.13, PF.2, PF.7
Timer/PWM
– Supports 4 sets of Timers/PWM
Timer Mode
PWM Mode
TM_CNT_OUT
PWM_CH0
TM_EXT
PWM_CH1 (Complementary)
– Timer Mode
Supports 4 sets of 32-bit timers with 24-bit up-timer and one 8-bit pre-scale
counter
Independent clock source for each timer
Provides one-shot, periodic, toggle and continuous counting operation modes
Supports event counting function to count the event from external pin
Supports input capture function to capture or reset counter value
Supports chip wake-up from Idle/Power-down mode if a timer interrupt signal is
generated
Support Timer0 ~ Timer3 time-out interrupt signal or capture interrupt signal to
trigger PWM, EADC and PDMA function
Supports Inter-Timer trigger mode
– PWM Mode
Supports maximum clock frequency up to 72 MHz
Oct 18, 2019
Supports independent mode for 4 sets of independent PWM output channel
Supports complementary mode for 4 sets of complementary paired PWM output
channel with 12-bit Dead-time generator
Supports 12-bit pre-scalar from 1 to 4096
Supports 16-bit resolution PWM counter, each timer provides 1 PWM counter
Supports up, down and up/down counter operation type
Supports one-shot or Auto-reload counter operation mode
Supports mask function and tri-state enable for each PWM pin
Supports brake function
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NUC029xGE
Supports interrupt when PWM counter match zero, period value or compared
value, and brake condition happened
Supports trigger ADC when PWM counter match zero, period value or compared
value
NUC029XGE SERIES DATASHEET
Watchdog Timer
– Supports multiple clock sources from LIRC(default selection), HCLK/2048 and LXT
– 8 selectable time-out period from 1.6 ms ~ 26.0 sec (depending on clock source)
– Able to wake up from Power-down or Idle mode
– Interrupt or reset selectable on watchdog time-out
Window Watchdog Timer
– Supports multiple clock sources from HCLK/2048 (default selection) and LIRC
– Window set by 6-bit counter with 11-bit prescale
– Interrupt or reset selectable on time-out
RTC
– Supports separate battery power pin VBAT
– Supports software compensation by setting frequency compensate register (FCR)
– Supports RTC counter (second, minute, hour) and calendar counter (day, month, year)
– Supports Alarm registers (second, minute, hour, day, month, year)
– Supports Alarm mask registers
– Selectable 12-hour or 24-hour mode
– Automatic leap year recognition
– Supports periodic time tick interrupt with 8 period options 1/128, 1/64, 1/32, 1/16, 1/8, 1/4,
1/2 and 1 second
– Supports wake-up function
PWM
– Supports maximum clock frequency up to144 MHz
– Supports up to two PWM modules, each module provides 6 output channels.
– Supports independent mode for PWM output/Capture input channel
– Supports complementary mode for 2 complementary paired PWM output channel
Dead-time insertion with 12-bit resolution
Two compared values during one period
– Supports 12-bit pre-scalar from 1 to 4096
– Supports 16-bit resolution PWM counter
Up, down and up/down counter operation type
– Supports mask function and tri-state enable for each PWM pin
– Supports brake function
Brake source from pin and system safety events: clock failed, Brown-out detection and
CPU lockup.
Noise filter for brake source from pin
Edge detect brake source to control brake state until brake interrupt cleared
Level detect brake source to auto recover function after brake condition removed
– Supports interrupt on the following events:
PWM counter match zero, period value or compared value
Brake condition happened
– Supports trigger ADC on the following events:
PWM counter match zero, period value or compared value
– Supports up to 12 capture input channels with 16-bit resolution
– Supports rising or falling capture condition
– Supports input rising/falling capture interrupt
– Supports rising/falling capture with counter reload option
USCI
– Supports up to 3 sets of USCI
Oct 18, 2019
USCI
UART Mode
SPI Mode
I2C Mode
USCI_CLK
-
SPI_CLK
SCL
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USCI_CTL0
nCTS
SPI_SS
-
USCI_CTL1
nRTS
-
-
USCI_DAT0
Rx
SPI_MOSI
SDA
USCI_DAT1
Tx
SPI_MISO
-
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NUC029XGE SERIES DATASHEET
– UART Mode
Supports one transmit buffer and two receive buffer for data payload
Supports hardware auto flow control function
Supports programmable baud-rate generator
Support 9-Bit Data Transfer (Support 9-Bit RS-485)
Baud rate detection possible by built-in capture event of baud rate generator
Supports Wake-up function (Data and nCTS Wakeup Only)
– SPI Mode
Supports Master or Slave mode operation (the maximum frequency -- Master = fPCLK
/ 2, Slave = fPCLK / 5)
Supports one transmit buffer and two receive buffers for data payload
Configurable bit length of a transfer word from 4 to 16-bit
Supports MSB first or LSB first transfer sequence
Supports Word Suspend function
Supports 3-wire, no slave select signal, bi-direction interface
Supports wake-up function by slave select signal in Slave mode
Supports one data channel half-duplex transfer
2
– I C Mode
Full master and slave device capability
Supports of 7-bit addressing, as well as 10-bit addressing
Communication in standard mode (100 kBit/s) or in fast mode (up to 400 kBit/s)
Supports multi-master bus
Supports one transmit buffer and two receive buffer for data payload
Supports 10-bit bus time-out capability
Supports bus monitor mode.
Supports Power down wake-up by data toggle or address match
Supports setup/hold time programmable
Supports multiple address recognition (two slave address with mask option)
UART
– Supports up to 3 sets of UART
– Full-duplex asynchronous communications
– Separates receive and transmit 16/16 bytes entry FIFO for data payloads
– Supports hardware auto-flow control (RX, TX, CTS and RTS)
– Programmable receiver buffer trigger level
– Supports programmable baud rate generator for each channel individually
– Supports 8-bit receiver buffer time-out detection function
– Programmable transmitting data delay time between the last stop and the next start bit by
setting DLY (UART_TOUT [15:8])
– Supports Auto-Baud Rate measurement and baud rate compensation function
– Supports break error, frame error, parity error and receive/transmit buffer overflow detection
function
– Fully programmable serial-interface characteristics
Programmable number of data bit, 5-, 6-, 7-, 8- bit character
Programmable parity bit, even, odd, no parity or stick parity bit generation and
detection
Programmable stop bit, 1, 1.5, or 2 stop bit generation
– Supports IrDA SIR function mode
Supports for 3/16 bit duration for normal mode
– Supports LIN function mode
Supports LIN master/slave mode
NUC029xGE
Supports programmable break generation function for transmitter
Supports break detection function for receiver
– Supports RS-485 mode
Supports RS-485 9-bit mode
Supports hardware or software enables to program nRTS pin to control RS-485
transmission direction
– Supports nCTS, incoming data, Received Data FIFO reached threshold and RS-485 Address
Match (AAD mode) wake-up function
– Supports PDMA transfer
SPI/I2S
– Supports up to two SPI/I2S controllers
SPI Mode
I2S Mode
SPI_CLK
I2S_BCLK
SPI_SS
I2S_LRCLK
SPI_MOSI
I2S_DO
SPI_MISO
I2S_DI
-
I2S_MCLK
NUC029XGE SERIES DATASHEET
– SPI Mode
Supports Master or Slave mode operation
Configurable bit length of a transfer word from 8 to 32-bit
Provides separate 4-/8-level depth transmit and receive FIFO buffers
Supports MSB first or LSB first transfer sequence
Supports Byte Reorder function
Supports PDMA transfer
– I2S Mode
Supports Master or Slave mode operation
Capable of handling 8-, 16-, 24- and 32-bit word sizes in I2S mode
Provides separate 4-level depth transmit and receive FIFO buffers in I2S mode
Supports monaural and stereo audio data in I2S mode
Supports PCM mode A, PCM mode B, I2S and MSB justified data format in I2S mode
Supports PDMA transfer
2
IC
2
– Supports up to two sets of I C device
– Supports Master/Slave mode
– Supports bidirectional data transfer between masters and slaves
– Supports multi-master bus (no central master)
– Arbitration between simultaneously transmitting masters without corruption of serial data on
the bus
– Serial clock synchronization allows devices with different bit rates to communicate via one
serial bus
– Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer
2
2
– Supports 14-bit time-out counter requesting the I C interrupt if the I C bus hangs up and
timer-out counter overflows
– Programmable clocks allow versatile rate control
– Supports multiple address recognition, four slave address with mask option
– Supports two-level buffer function
– Supports setup/hold time programmable
– Supports wake-up function
USB 2.0 FS Device Controller
– Crystal-less USB 2.0 FS Device
– Compliant to USB specification version 2.0
– On-chip USB Transceiver
Oct 18, 2019
Page 14 of 159
Rev 1.02
NUC029xGE
Oct 18, 2019
Page 15 of 159
Rev 1.02
NUC029XGE SERIES DATASHEET
– Supports Control, Bulk In/Out, Interrupt and Isochronous transfers
– Auto suspend function when no bus signaling for 3 ms
– Supports USB 2.0 Link Power Management (LPM)
– Provides 8 programmable endpoints
– Supports 512 Bytes internal SRAM as USB buffer
– Provides remote wake-up capability
– On-chip 5V to 3.3V LDO for USB PHY
ADC
– Supports 12-bit SAR ADC
– 12-bit resolution and 10-bit accuracy is guaranteed
– Analog input voltage range: 0~ AVDD
– Supports external VREF pin
– Up to 20 single-end analog input channels
– Maximum ADC peripheral clock frequency is 16 MHz
– Conversion rate up to 800 ksps at 5 V
– Configurable ADC internal sampling time
– Supports single-scan, single-cycle-scan, and continuous scan and scan on enabled channels
– Supports individual conversion result register with valid and overrun indicators for each
channel
– Supports digital comparator to monitor conversion result and user can select whether to
generate an interrupt when conversion result matches the compare register setting
– An A/D conversion can be triggered by:
Software enable
External pin (STADC)
Timer 0~3 overflow pulse trigger
PWM triggers with optional start delay period
– Supports 4 internal channels for
Operational amplifier output
Band-gap VBG input
Temperature sensor input
VBAT voltage measure
– Supports internal reference voltage: 2.048 V, 2.560 V, 3.072 V and 4.096 V
– Supports PDMA transfer
Analog Comparator
– Supports up to 2 rail-to-rail analog comparators
– Supports 4 multiplexed I/O pins at positive node.
– Supports I/O pin and internal voltages at negative node
– Support selectable internal voltage reference from:
Band-gap VBG
Voltage divider source from AVDD and internal reference voltage.
– Supports programmable hysteresis
– Supports programmable speed and power consumption
– Interrupts generated when compare results change, interrupt event condition is
programmable.
– Supports power-down wake-up
– Supports triggers for break events and cycle-by-cycle control for PWM
Cyclic Redundancy Calculation Unit
– Supports four common polynomials CRC-CCITT, CRC-8, CRC-16, and CRC-32
– Programmable initial value
– Supports programmable order reverse setting for input data and CRC checksum
– Supports programmable 1’s complement setting for input data and CRC checksum.
– Supports 8/16/32-bit of data width
– Interrupt generated once checksum error occurs
User Configurable VDDIO=1.8 ~ 5.5 V I/O Interface
2
– Supports UART, SPI and I C at VDDIO power domain
Supports 96-bit Unique ID (UID)
NUC029xGE
Supports 128-bit Unique Customer ID (UCID)
One built-in temperature sensor with 1℃ resolution
Brown-out detector
– With 4 levels: 4.3 V/ 3.7V/ 2.7V/ 2.2V
– Supports Brown-out Interrupt and Reset option
Low Voltage Reset
– Threshold voltage levels: 2.0 V
Power consumption
– Chip power down current < 10 uA with RAM data retention.
– VBAT power domain operating current 30 sec.
Time with 5°C of actual peak temperature
Peak temperature range
260°C
Ramp-down rate
6°C/sec ax.
Time 25°C to peak temperature
8 min. max
Note:
1. Determined according to J-STD-020C
Table 8.1-5 Soldering Profile
Oct 18, 2019
Page 130 of 159
Rev 1.02
NUC029xGE
8.2 DC Electrical Characteristics
(VDD-VSS = 2.5 ~ 5.5V, TA = 25°C, FOSC = 72 MHz unless otherwise specified.)
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD –
VSS
2.5
-
5.5
V
Power supply for PE.8 ~
PE.13
VDDIO –
VSS
1.8
-
5.5
V
Power supply for PF.0,
PF.1 and PF.2
VBAT –
VSS
2.5
-
5.5
V
Power Ground
VSS –
AVSS
-0.05
-
+0.05
V
VLDO
1.62
1.8
1.98
V
MCU operating in Run, Idle or Power-down mode
uF
Connect to LDO_CAP pin
Operation Voltage
VDD = 2.5 ~ 5.5V up to 72 MHz
LDO Output Voltage
CLDO
Band-gap Voltage
Allowed voltage
difference for VDD and
AVDD
1
-
1.21
-
V
VDD –
AVDD
-0.3
-
+0.3
V
IDD1
-
57
-
mA
Operating Current
Normal Run Mode
VDD
HXT
HIRC
HIRC48
PLL
All digital
module
5.5 V
12 MHz
X
X
V
V
HCLK =72 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD2
-
22
-
mA
5.5 V
12 MHz
X
X
V
X
IDD3
-
57
-
mA
3.3 V
12 MHz
X
X
V
V
IDD4
-
22
-
mA
3.3 V
12 MHz
X
X
V
X
VDD
HXT
HIRC
HIRC48
PLL
IDD5
-
TBD
-
mA
All digital
module
5.5 V
X
X
V
V
V
Operating Current
Normal Run Mode
HCLK =72 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD6
-
TBD
-
mA
5.5 V
X
X
V
V
X
IDD7
-
TBD
-
mA
3.3 V
X
X
V
V
V
IDD8
-
TBD
-
mA
3.3 V
X
X
V
V
X
VDD
HXT
HIRC
HIRC48
PLL
IDD9
-
33
-
mA
All digital
module
5.5 V
12 MHz
X
X
V
V
Operating Current
Normal Run Mode
HCLK =48 MHz
while(1){}executed from
flash
VLDO=1.8 V
Oct 18, 2019
IDD10
-
14
-
mA
5.5 V
12 MHz
X
X
V
X
IDD11
-
33
-
mA
3.3 V
12 MHz
X
X
V
V
IDD12
-
14
-
mA
3.3 V
12 MHz
X
X
V
X
Page 131 of 159
Rev 1.02
NUC029XGE SERIES DATASHEET
VBG
NUC029xGE
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
TBD
-
mA
Operating Current
Normal Run Mode
IDD13
VDD
HXT
HIRC
HIRC48
PLL
All digital
module
5.5 V
X
X
V
X
V
HCLK =48 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD14
-
TBD
-
mA
5.5 V
X
X
V
X
X
IDD15
-
TBD
-
mA
3.3 V
X
X
V
X
V
IDD16
-
TBD
-
mA
3.3 V
X
X
V
X
X
VDD
HXT
HIRC
HIRC48
PLL
IDD21
-
TBD
-
mA
All digital
module
5.5 V
X
X
HIRC48/2
X
V
Operating Current
Normal Run Mode
HCLK =24 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD22
-
TBD
-
mA
5.5 V
X
X
HIRC48/2
X
X
IDD23
-
TBD
-
mA
3.3 V
X
X
HIRC48/2
X
V
IDD24
-
TBD
-
mA
3.3 V
X
X
HIRC48/2
X
X
VDD
HXT
HIRC
HIRC48
PLL
IDD25
-
16.6
-
mA
All digital
module
5.5 V
X
V
X
X
V
Operating Current
Normal Run Mode
HCLK =22.1184 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD26
-
6.2
-
mA
5.5 V
X
V
X
X
X
IDD27
-
16.6
-
mA
3.3 V
X
V
X
X
V
IDD28
-
6.2
-
mA
3.3 V
X
V
X
X
X
VDD
HXT
HIRC
HIRC48
PLL
IDD29
-
7.8
-
mA
All digital
module
5.5 V
12 MHz
X
X
X
V
Operating Current
Normal Run Mode
NUC029XGE SERIES DATASHEET
HCLK =12 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD30
-
3.1
-
mA
5.5 V
12 MHz
X
X
X
X
IDD31
-
7.8
-
mA
3.3 V
12 MHz
X
X
X
V
IDD32
-
3.1
-
mA
3.3 V
12 MHz
X
X
X
X
VDD
HXT
HIRC
HIRC48
PLL
IDD33
-
2.74
-
mA
All digital
module
5.5 V
4 MHz
X
X
X
V
Operating Current
Normal Run Mode
HCLK =4 MHz
while(1){}executed from
flash
VLDO=1.8 V
IDD34
-
1.23
-
mA
5.5 V
4 MHz
X
X
X
X
IDD35
-
2.72
-
mA
3.3 V
4 MHz
X
X
X
V
IDD36
-
1.20
-
mA
3.3 V
4 MHz
X
X
X
X
IDD37
-
136
-
uA
Operating Current
Normal Run Mode
VDD
LXT
LIRC
PLL
All digital
module
5.5 V
32.768 kHz
X
X
V
HCLK =32.768 kHz
while(1){}executed from
flash
VLDO=1.8 V
Operating Current
Oct 18, 2019
IDD38
-
123
-
uA
5.5 V
32.768 kHz
X
X
X
IDD39
-
123
-
uA
3.3 V
32.768 kHz
X
X
V
IDD40
-
109
-
uA
3.3 V
32.768 kHz
X
X
X
IDD41
-
121
-
uA
VDD
LXT
LIRC
PLL
All digital
module
Page 132 of 159
Rev 1.02
NUC029xGE
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Normal Run Mode
HCLK =10 kHz
5.5 V
X
10 kHz
X
V
IDD42
-
117
-
uA
5.5 V
X
10 kHz
X
X
while(1){}executed from
flash
IDD43
-
107
-
uA
3.3 V
X
10 kHz
X
V
VLDO=1.8 V
IDD44
-
102
-
uA
3.3 V
X
10 kHz
X
X
IIDLE1
-
47
-
mA
Operating Current
Idle Mode
VDD
HXT
HIRC
HIRC48
PLL
All digital
module
5.5 V
12 MHz
X
X
V
V
HCLK =72 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE2
-
9
-
mA
5.5 V
12 MHz
X
X
V
X
IIDLE3
-
47
-
mA
3.3 V
12 MHz
X
X
V
V
IIDLE4
-
9
-
mA
3.3 V
12 MHz
X
X
V
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE5
-
TBD
-
mA
All digital
module
5.5 V
X
X
V
V
V
Operating Current
Idle Mode
HCLK =72 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE6
-
TBD
-
mA
5.5 V
X
X
V
V
X
IIDLE7
-
TBD
-
mA
3.3 V
X
X
V
V
V
IIDLE8
-
TBD
-
mA
3.3 V
X
X
V
V
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE9
-
27
-
mA
All digital
module
5.5 V
12 MHz
X
X
V
V
Operating Current
Idle Mode
HCLK =48 MHz
VLDO=1.8 V
IIDLE10
-
5.5
-
mA
5.5 V
12 MHz
X
X
V
X
IIDLE11
-
27
-
mA
3.3 V
12 MHz
X
X
V
V
IIDLE12
-
5.5
-
mA
3.3 V
12 MHz
X
X
V
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE13
-
TBD
-
mA
All digital
module
5.5 V
X
X
V
X
V
Operating Current
Idle Mode
HCLK =48 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE14
-
TBD
-
mA
5.5 V
X
X
V
X
X
IIDLE15
-
TBD
-
mA
3.3 V
X
X
V
X
V
IIDLE16
-
TBD
-
mA
3.3 V
X
X
V
X
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE21
-
TBD
-
mA
All digital
module
5.5 V
X
X
HIRC48/2
X
V
Operating Current
Idle Mode
HCLK =24 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE22
-
TBD
-
mA
5.5 V
X
X
HIRC48/2
X
X
IIDLE23
-
TBD
-
mA
3.3 V
X
X
HIRC48/2
X
V
IIDLE24
-
TBD
-
mA
3.3 V
X
X
HIRC48/2
X
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE25
-
12.3
-
mA
All digital
module
5.5 V
X
V
X
X
V
5.5 V
X
V
X
X
X
Operating Current
Idle Mode
HCLK =22.1184 MHz
while(1){}executed from
Oct 18, 2019
IIDLE26
-
1.9
-
mA
Page 133 of 159
Rev 1.02
NUC029XGE SERIES DATASHEET
while(1){}executed from
flash
NUC029xGE
SPECIFICATIONS
PARAMETER
flash
VLDO=1.8 V
SYM.
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
IIDLE27
-
12.3
-
mA
3.3 V
X
V
X
X
V
IIDLE28
-
1.9
-
mA
3.3 V
X
V
X
X
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE29
-
6.3
-
mA
All digital
module
5.5 V
12 MHz
X
X
X
V
Operating Current
Idle Mode
HCLK =12 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE30
-
1.25
-
mA
5.5 V
12 MHz
X
X
X
X
IIDLE31
-
6.3
-
mA
3.3 V
12 MHz
X
X
X
V
IIDLE32
-
1.2
-
mA
3.3 V
12 MHz
X
X
X
X
VDD
HXT
HIRC
HIRC48
PLL
IIDLE33
-
2.2
-
mA
All digital
module
5.5 V
4 MHz
X
X
X
V
Operating Current
Idle Mode
HCLK =4 MHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE34
-
0.51
-
mA
5.5 V
4 MHz
X
X
X
X
IIDLE35
-
2.2
-
mA
3.3 V
4 MHz
X
X
X
V
IIDLE36
-
0.46
-
mA
3.3 V
4 MHz
X
X
X
X
IIDLE37
-
129
-
uA
Operating Current
Idle Mode
VDD
LXT
LIRC
PLL
All digital
module
5.5 V
32.768 kHz
X
X
V
HCLK =32.768 kHz
while(1){}executed from
flash
VLDO=1.8 V
NUC029XGE SERIES DATASHEET
IIDLE38
-
115
-
uA
5.5 V
32.768 kHz
X
X
X
IIDLE39
-
115
-
uA
3.3 V
32.768 kHz
X
X
V
IIDLE40
-
101
-
uA
3.3 V
32.768 kHz
X
X
X
VDD
LXT
LIRC
PLL
IIDLE41
-
119
-
uA
All digital
module
5.5 V
X
10 kHz
X
V
Operating Current
Idle Mode
HCLK =10 kHz
while(1){}executed from
flash
VLDO=1.8 V
IIDLE42
-
114
-
uA
5.5 V
X
10 kHz
X
X
IIDLE43
-
104
-
uA
3.3 V
X
10 kHz
X
V
IIDLE44
-
100
-
uA
3.3 V
X
10 kHz
X
X
VDD
HXT/HIRC
LXT/LIRC
PLL
IPWD1
-
TBD
-
uA
RAM
retention
5.5 V
X
LXT
X
V
IPWD2
-
TBD
-
uA
5.5 V
X
LIRC
X
V
Standby Current
IPWD3
-
TBD
-
uA
5.5 V
X
LXT & LIRC
X
V
Power-down Mode
IPWD4
-
20
uA
5.5 V
X
X
X
V
IPWD5
-
16.5
-
uA
3.3 V
X
LXT
X
V
IPWD6
-
16
-
uA
3.3 V
X
LIRC
X
V
IPWD7
-
17.5
-
uA
3.3 V
X
LXT & LIRC
X
V
IPWD8
-
15
-
uA
3.3 V
X
X
X
V
VLDO=1.8 V
Oct 18, 2019
Page 134 of 159
Rev 1.02
NUC029xGE
SPECIFICATIONS
PARAMETER
Logic 0 Input Current
(Quasi-bidirectional
mode)
Input Pull Up Resistor
SYM.
IIL
RIN
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
-70
-
uA
VDD = VBAT = VDDIO = 5.5V, VIN = 0V
-
TBD
-
kΩ
VDD = VBAT = VDDIO = 5.5V
-
TBD
-
kΩ
VDD = VBAT = VDDIO = 3.3V
-
TBD
-
kΩ
VDD = VBAT = 2.5 ~ 5.5 V
VDDIO = 1.8 V
Input Leakage Current
ILK
Input Low Voltage (TTL
input)
VIL1
Input Low Voltage (TTL
input for VDDIO domain)
VIL2
Input High Voltage (TTL
input)
-
0
-
A
VDD = VBAT = VDDIO = 5.5V, 0 < VIN < VDD
Open-drain or input only mode
-0.3
-
0.8
V
VDD = VBAT = VDDIO = 4.5 V
-0.3
-
0.6
V
VDD = VBAT = VDDIO = 2.5 V
-0.3
-
TBD
V
VDD = VBAT = 2.5 ~ 5.5 V
VDDIO = 1.8 V
2.0
-
VDD +
0.3
V
VDD = VBAT = VDDIO = 5.5V
1.5
-
VDD +
0.3
V
VDD = VBAT = VDDIO = 2.5V
-
VDD +
0.3
V
VIH1
VDD = VBAT = 2.5 ~ 5.5 V
Input High Voltage (TTL
input for VDDIO domain)
VIH2
TBD
Input Low Voltage
(Schmitt input)
VIL3
-0.3
-
0.3VDD
V
VDD = VBAT = VDDIO = 2.5 ~ 5.5 V
VIL4
-0.3
-
0.3VDD
V
VDDIO = 1.8 ~ 5.5V
VIH3
0.7VDD
-
VDD +
0.3
V
VDD = VBAT = VDDIO = 2.5 ~ 5.5V
-
VDDIO +
0.3
V
VDDIO = 1.8 ~ 5.5V
VDDIO = 1.8 V
NUC029XGE SERIES DATASHEET
Input Low Voltage
(Schmitt input for VDDIO
domain)
Input High Voltage
(Schmitt input)
Input High Voltage
(Schmitt input for VDDIO
domain)
Hysteresis voltage of
PA~PF (Schmitt input)
VIH4
0.7VDDI
O
VHY
-
0.2VDD
-
V
VIL5
-0.3
-
0.2VDD
V
VIH5
0.8VDD
-
VDD +
0.3
V
RRST
-
45
-
kΩ
Negative going threshold
(Schmitt input), nRESET
Positive going threshold
(Schmitt Input), nRESET
Internal nRESET pin pull
up resistor
VDD = 5.5V
(NUC029SGE/LGE only)
Oct 18, 2019
Page 135 of 159
Rev 1.02
NUC029xGE
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITIONS
MIN.
Internal nRESET pin pull
up resistor
RRST
TYP.
MAX.
16
UNIT
kΩ
VDD = 5.5V
(NUC029KGE only)
Source Current
(Quasi-bidirectional
Mode)
ISR1
-
-400
-
uA
VDD = VBAT = VDDIO = 4.5V, VS = 2.4V
ISR2
-
-80
-
uA
VDD = VBAT = VDDIO = 2.7V, VS = 2.2V
ISR3
-
-73
-
uA
VDD = VBAT = VDDIO = 2.5V, VS = 2.0V
ISR4
-
-42
-
uA
Source Current
(Quasi-bidirectional Mode
for VDDIO domain)
VDD = VBAT = 2.5 ~ 5.5V
VDDIO = 1.8V, VS = 1.6V
ISR5
-27
mA
VDD = VBAT = VDDIO = 4.5V, VS = 2.4V
Source Current
ISR6
-
-5.8
-
mA
VDD = VBAT = VDDIO = 2.7V, VS = 2.2V
ISR7
-
-5.2
-
mA
VDD = VBAT = VDDIO = 2.5V, VS = 2.0V
(Push-pull Mode for VDDIO
domain)
ISR8
-
-1.5
-
mA
Sink Current
ISK1
(Quasi-bidirectional,
Open-Drain and Pushpull Mode)
ISK2
ISK3
(Push-pull Mode)
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V
Source Current
VS = 1.3 V for NUC029SGE/LGE
VS = 1.6 V for NUC029KGE
16
-
mA
VDD = VBAT = VDDIO = 4.5V, VS = 0.45V
-
11
-
mA
VDD = VBAT = VDDIO = 2.7V, VS = 0.45V
-
9
-
mA
VDD = VBAT = VDDIO = 2.5V, VS = 0.45V
2.2
-
mA
Sink Current
NUC029XGE SERIES DATASHEET
(Quasi-bidirectional,
Open-Drain and Pushpull Mode for VDDIO
domain)
ISK4
VDD = VBAT = 2.5 ~ 5.5V
VDDIO = 1.8V, VS = 1.6V
(NUC029SGE/LGE only)
Sink Current
(Quasi-bidirectional,
Open-Drain and Pushpull Mode for VDDIO
domain)
ISK4
-
HIORR1
-
6
-
mA
VDD = VBAT = 2.5 ~ 5.5V
VDDIO = 1.8V, VS = 0.45V
(NUC029KGE only)
3.2
-
ns
VDD = VBAT = VDDIO = 5.5V,
without capacitor
4
HIORR2
ns
VDD = VBAT = VDDIO = 5.5V,
with 10pF capacitor
Higher GPIO Rising Rate
HIORR3
-
3.8
-
ns
VDD = VBAT = VDDIO = 3.3V,
without capacitor
HIORR4
-
5.4
-
ns
VDD = VBAT = VDDIO = 3.0V,
with 10pF capacitor
Oct 18, 2019
Page 136 of 159
Rev 1.02
NUC029xGE
SPECIFICATIONS
PARAMETER
SYM.
HIORR5
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
without capacitor (for VDDIO domain)
HIORR6
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
with 10pF capacitor (for VDDIO domain)
BIORR1
-
4.6
-
ns
VDD = VBAT = VDDIO = 5.5V,
without capacitor
BIORR2
-
5.3
-
ns
VDD = VBAT = VDDIO = 5.5V,
with 10pF capacitor
BIORR3
-
5.8
-
ns
VDD = VBAT = VDDIO = 3.0V,
without capacitor
Basic GPIO Rising Rate
BIORR4
-
7.6
-
ns
VDD = VBAT = VDDIO = 3.0V,
with 10pF capacitor
BIORR5
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
without capacitor (for VDDIO domain)
BIORR6
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
with 10pF capacitor (for VDDIO domain)
HIOFR1
-
2.10
-
ns
VDD = VBAT = VDDIO = 5.5V,
without capacitor
HIOFR2
-
2.9
-
ns
VDD = VBAT = VDDIO = 5.5V,
with 10pF capacitor
-
3.12
-
ns
NUC029XGE SERIES DATASHEET
HIOFR3
VDD = VBAT = VDDIO = 3.3V,
without capacitor
Higher GPIO Falling Rate
HIOFR4
-
4.4
-
ns
VDD = VBAT = VDDIO = 3.3V,
with 10pF capacitor
HIOFR5
-
HIOFR6
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
without capacitor (for VDDIO domain)
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
with 10pF capacitor (for VDDIO domain)
BIOFR1
-
BIOFR2
-
3.8
-
ns
VDD = VBAT = VDDIO = 5.5V,
without capacitor
4.9
-
ns
VDD = VBAT = VDDIO = 5.5V,
with 10pF capacitor
Basic GPIO Falling Rate
BIOFR3
-
6.4
-
ns
VDD = VBAT = VDDIO = 3.3V,
without capacitor
BIOFR4
-
7.87
-
ns
VDD = VBAT = VDDIO = 3.3V,
with 10pF capacitor
Oct 18, 2019
Page 137 of 159
Rev 1.02
NUC029xGE
SPECIFICATIONS
PARAMETER
SYM.
BIOFR5
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
without capacitor (for VDDIO domain)
BIOFR6
-
TBD
-
ns
VDD = VBAT = 2.5 ~ 5.5V, VDDIO = 1.8V,
with 10pF capacitor (for VDDIO domain)
NUC029XGE SERIES DATASHEET
Oct 18, 2019
Page 138 of 159
Rev 1.02
NUC029xGE
8.3 AC Electrical Characteristics
8.3.1
External 4~20 MHz High Speed Crystal (HXT) Input Clock
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Clock High Time
tCHCX
10
-
-
ns
Clock Low Time
tCLCX
10
-
-
ns
Clock Rise Time
tCLCH
2
-
15
ns
Clock Fall Time
tCHCL
2
-
15
ns
Input High Voltage
VIH
0.7VDD
-
VDD
V
Input Low Voltage
VIL
0
-
0.3VDD
V
tCLCL
tCLCH
VIH
90%
tCLCX
10%
VIL
tCHCL
tCHCX
Note: Duty cycle is 50%.
NUC029XGE SERIES DATASHEET
Oct 18, 2019
Page 139 of 159
Rev 1.02
NUC029xGE
8.3.2
External 4~20 MHz High Speed Crystal (HXT) Oscillator
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Oscillator frequency
fHXT
4
-
20
Temperature
THXT
-40
-
+105
°C
-
TBD
-
mA
VDD = 5.5V @ 12 MHz
Operating current
IHXT
-
TBD
-
mA
VDD = 3.3V @ 12 MHz
8.3.2.1
MHz VDD = 2.5 ~ 5.5 V
Typical Crystal Application Circuits
CRYSTAL
C1
C2
R1
4 MHz ~ 20 MHz
20 pF
20 pF
without
XT_OUT
NUC029XGE SERIES DATASHEET
C2
XT_IN
R1
C1
Figure 8.3-1 Typical Crystal Application Circuit
Oct 18, 2019
Page 140 of 159
Rev 1.02
NUC029xGE
8.3.3
External 32.768 kHz Low Speed Crystal (LXT) Input Clock
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Clock High Time
tCHCX
TBD
-
-
ns
Clock Low Time
tCLCX
TBD
-
-
ns
Clock Rise Time
tCLCH
TBD
-
TBD
ns
Clock Fall Time
tCHCL
TBD
-
TBD
ns
LXT Input Pin Input High
Voltage
Xin_VIH
0.7VLDO
-
VLDO
V
LXT Input Pin Input Low
Voltage
Xin_VIL
0
-
0.3VLDO
V
tCLCL
tCLCH
90%
Xin_VIH
tCLCX
Xin_VIL
10%
tCHCL
tCHCX
Note: Duty cycle is 50%.
NUC029XGE SERIES DATASHEET
Oct 18, 2019
Page 141 of 159
Rev 1.02
NUC029xGE
8.3.4
External 32.768 kHz Low Speed Crystal (LXT) Input Clock
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Oscillator frequency
fLXT
-
32.768
-
kHz
Temperature
TLXT
-40
-
+105
°C
Operating current
ILXT
8.3.4.1
1
uA
VDD = VBAT = 2.5 ~ 5.5 V
VDD = VBAT = 2.5 ~ 5.5 V
Typical Crystal Application Circuits
CRYSTAL
C3
C4
R2
32.768 kHz
20 pF
20 pF
without
XT_OUT
C4
XT_IN
R2
C3
NUC029XGE SERIES DATASHEET
Figure 8.3-2 Typical Crystal Application Circuit
Oct 18, 2019
Page 142 of 159
Rev 1.02
NUC029xGE
8.3.5
Internal 48 MHz High Speed RC Oscillator (HIRC48)
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
-
48
-
MHz
-1
-
+1
%
-2
-
+2
%
Center Frequency
Calibrated Internal
Oscillator Frequency
fHRC
TA = 25°C, VDD = 3.3V
TA = 25°C,
VDD = 2.5 ~ 5.5V
TA = -40°C ~ +105°C,
VDD = 2.5 ~ 5.5V
TA = -40°C ~ +105°C,
-0.25
-
+0.25
%
VDD = 2.5 ~ 5.5V
Auto trimmed by LXT
Operating current
8.3.6
IHRC
-
440
-
uA
Internal 22.1184 MHz High Speed RC Oscillator (HIRC)
SPECIFICATIONS
PARAMETER
SYM.
Center Frequency
fHRC
TYP.
MAX.
UNIT
-
22.1184
-
MHz
-1
-
+1
%
-2
-
+2
%
TA = 25°C, VDD = 3.3V
TA = 25°C,
VDD = 2.5 ~ 5.5V
NUC029XGE SERIES DATASHEET
Calibrated Internal
Oscillator Frequency
TEST CONDITION
MIN.
-40°C ~ +105°C,
VDD = 2.5 ~ 5.5V
-40°C ~ +105°C,
-0.25
-
+0.25
%
VDD = 2.5 ~ 5.5V
Auto trimmed by LXT
Operating current
Oct 18, 2019
IHRC
-
470
-
Page 143 of 159
uA
Rev 1.02
NUC029xGE
8.3.7
Internal 10 kHz Low Speed RC Oscillator (LIRC)
SPECIFICATIONS
PARAMETER
SYM.
Center Frequency
Calibrated Internal
Oscillator Frequency
Operating current
fLRC
ILRC
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
-
10
-
kHz
-30
-
+30
%
-50
-
+50
%
0.9
TA = 25°C, VDD = 3.3V
TA = 25°C,
VDD = 2.5 ~ 5.5V
-40°C ~+105°C,
VDD = 2.5 ~ 5.5V
uA
NUC029XGE SERIES DATASHEET
Oct 18, 2019
Page 144 of 159
Rev 1.02
NUC029xGE
8.4 Analog Characteristics
8.4.1
LDO
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Temperature
TA
-40
-
+105
°C
DC Power Supply
VDD
2.5
-
5.5
V
Output Voltage
VLDO
1.62
1.8
1.98
V
Note 1: It is recommended a 0.1uF bypass capacitor is connected between VDD and the closest VSS
pin of the device.
Note 2: For ensuring power stability, a 1uF Capacitor must be connected between LDO_CAP pin
and the closest VSS pin of the device.
8.4.2
Temperature Sensor
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
TDET
-40
-
+105
°C
Gain
VTG
-1.76
-1.70
-1.64
mV/°C
Offset
VTO
-
747
-
mV
Operating current
ITEMP
-
16
-
uA
Temperature at 0°C
Note: The temperature sensor formula for the output voltage (Vtemp) is as below equation.
Vtemp (mV) = Gain (mV/ °C ) x Temperature (°C) + Offset (mV)
8.4.3
Internal Voltage Reference (Int_VREF)
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
VREF (2.048V)
VREF1
1.986
-
2.151
V
VREFCTL = 3, AVDD ≥ 2.5 V
VREF (2.56V)
VREF2
2.483
-
2.637
V
VREFCTL = 3, AVDD ≥ 2.9 V
VREF (3.072V)
VREF3
2.98
-
3.164
V
VREFCTL = 3, AVDD ≥ 3.4 V
VREF (4.096V)
VREF4
3.973
-
4.219
V
VREFCTL = 3, AVDD ≥ 4.5 V
Start-up Time
TVREF_Start
-
700
2000
us
CVREF = 4.7 uF
Operating current
Oct 18, 2019
IVREF
100
Page 145 of 159
uA
Rev 1.02
NUC029XGE SERIES DATASHEET
Detection Temperature
NUC029xGE
8.4.4
Power-on Reset
SPECIFICATIONS
PARAMETER
Temperature
Threshold Voltage
8.4.5
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
TA
-40
-
+105
°C
VPOR
-
2
-
V
Low-Voltage Reset
SPECIFICATIONS
PARAMETER
Temperature
Threshold Voltage
Start-up Time
Quiescent Current
8.4.6
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
-40
-
+105
°C
2.0
2.2
2.45
V
TA = +105°C
1.8
2.0
2.2
V
TA = +25°C
1.75
1.95
2.2
V
TA = -40°C
TLVR_Start
-
130
-
us
TA = +25°C
ILVR
-
1.1
-
uA
AVDD = 5.5V
TA
VLVR
Brown-out Detector
SPECIFICATIONS
PARAMETER
NUC029XGE SERIES DATASHEET
Temperature
Brown-out Voltage
(Falling edge)
Brown-out Voltage
(Rising edge)
Start-up Time
Quiescent Current
SYM.
TA
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
-40
-
+105
°C
4.2
4.4
4.6
V
BODVL [1:0] = 11
3.5
3.7
3.9
V
BODVL [1:0] = 10
2.55
2.7
2.85
V
BODVL [1:0] = 01
2.05
2.2
2.35
V
BODVL [1:0] = 00
4.3
4.5
4.7
V
BODVL [1:0] = 11
3.6
3.8
4.0
V
BODVL [1:0] = 10
2.6
2.75
2.9
V
BODVL [1:0] = 01
2.1
2.25
2.4
V
BODVL [1:0] = 00
-
1030
-
us
TA = +25°C
83
-
uA
VBODF
VBODR
TBOD_Start
BODLPM = 0
IBOD
0.7
Oct 18, 2019
TA = +25°C, AVDD = 5.5V
Page 146 of 159
uA
TA = +25°C, AVDD = 5.5V
BODLPM = 1
Rev 1.02
NUC029xGE
8.4.7
12-bit ADC
SPECIFICATIONS
PARAMETER
SYM.
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
TA
-40
-
+105
°C
Operating voltage
AVDD
3.0
-
5.5
V
Reference voltage
VREF
3.0
AVDD
V
ADC input voltage
VIN
0
AVREF
V
Temperature
-
Resolution
RADC
Integral Non-Linearity
Error
INL
-2
+1.5
+2
LSB
Differential Non-Linearity
DNL
-1
+1.5
+2
LSB
Gain error
EG
-4
-1.5
+4
LSB
Offset error
EOFFSET
-4
+1.5
+4
LSB
EABS
-4
-
+4
LSB
Absolute error
Monotonic
12
-
AVDD = VDD
Bit
Guaranteed
-
ADC Clock frequency
FADC
1
Acquisition Time
(Sample Stage)
TACQ
2
7
21
1/FADC Default: 7 (1/FADC)
Conversion time
TCONV
15
20
34
1/FADC
FSPS
-
-
800
KSPS
CIN
-
TBD
-
pF
RIN
-
TBD
-
kΩ
IADC1
-
4
-
mA
(FADC/TCONV)
Internal Capacitance
[1]
Input Load
Operating current
[1]
MHz
TCONV = TACQ + 13
Default: 20 (1/FADC)
TCONV = 20 clock
FADC = 16 MHz
AVDD = VDD = 5V
ADC Clock Rate = 16 MHz
Note: Design by guarantee, no test in production.
Oct 18, 2019
Page 147 of 159
Rev 1.02
NUC029XGE SERIES DATASHEET
Conversion Rate
16
NUC029xGE
EF (Full scale error) = EO + EG
Gain Error Offset Error
EG
EO
4095
4094
4093
4092
Ideal transfer curve
7
6
ADC
output
code
5
Actual transfer curve
4
3
2
DNL
1
1 LSB
4095
Analog input voltage
(LSB)
Offset Error
EO
NUC029XGE SERIES DATASHEET
Note: The INL is the peak difference between the transition point of the steps of the calibrated transfer
curve and the ideal transfer curve. A calibrated transfer curve means it has calibrated the offset and
gain error from the actual transfer curve.
Typical connection diagram using the ADC
VDD
(1)
AINx
RIN
12-bit
Converter
(1)
CIN
Note: GND < AINX “Power supply for PE.8~PE.13”.
2019.10.18
1.02
1. Added the sections of thermal characteristics, EMC characteristics, package moisture
sensitivity, and soldering profile in section 8.1.
NUC029XGE SERIES DATASHEET
Oct 18, 2019
Page 158 of 159
Rev 1.02
NUC029xGE
Nuvoton Products are neither intended nor warranted for usage in systems or equipment, any
malfunction or failure of which may cause loss of human life, bodily injury or severe property
damage. Such applications are deemed, “Insecure Usage”.
Insecure usage includes, but is not limited to: equipment for surgical implementation, atomic
energy control instruments, airplane or spaceship instruments, the control or operation of
dynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all
types of safety devices, and other applications intended to support or sustain life.
All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay
claims to Nuvoton as a result of customer’s Insecure Usage, customer shall indemnify the
damages and liabilities thus incurred by Nuvoton.
Oct 18, 2019
Page 159 of 159
Rev 1.02
NUC029XGE SERIES DATASHEET
Important Notice
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