TVS Diodes
SMF Series
Description
The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by
lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA
package and deliverying one of the low height profiles (1.2mm) in the industry.
Features
IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)
SOD-123FL surface mount package
Protects one I/O line
Peak power dissipation of 1000W under 8/20μs waveform
Low leakage current
Solid-state silicon avalanche technology
RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meet MSL level1, per J-STD-020
Applications
SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular
phones, portable devices, business machines, power supplies and other consumer applications.
Maximum Ratings and Characteristics (TA=25℃)
Rating
Symbol
Value
Peak pulse power dissipation at 10/1000μs waveform
(Note1, Note2, Fig.1)
PPPM
200W
Peak pulse power (tp=8/20μs waveform)
PPPM
1000W
Peak pulse current of at 10/1000μs waveform (Note 1, Fig.3)
IPPM
See Table(A)
PM(AV)
1.0W
VF
3.5V
IFSM
20A
TJ,TSTG
-55℃ to +150℃
Typical thermal resistance junction to lead
RθJL
100℃/W
Typical thermal resistance junction to ambient
RθJA
220℃/W
Steady state power dissipation at TL=75℃ (Fig.5)
Maximum Instantaneous Forward Voltage at 12A for Unidirectional Only
Peak forward surge current, 8.3ms single half sine-wave superimposed on
rated load, (JEDEC Method) (Note3, Fig.6)
Operating junction and Storage Temperature Ranges
Notes:1. Non-repetitive current pulse, per Fig.3 and derating above TA=25℃ per Fig.2.
2. Each terminal is surface Mounted on the 5.0mm×5.0mm (0.03mm thick) copper pads.
3. 8.3ms single half sine-wave or equivalent square wave, duty cycle=4 pulses per minutes maximum.
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掌握芯技术Core Technology
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TVS Diodes
SMF Series
Electrical Characteristics (TA=25℃)
Device
Marking
Code
Part Number
Reverse
Stand-Off
Voltage
Breakdown
Voltage
@IT
Test
Current
Maximum
Clamping
Voltage
@IPP
Peak
Pulse
Current
Reverse
Leakage
@VR
Uni.
Bi.
Uni.
Bi.
VR(V)
VB MIn.(V)
VB Max.(V)
IT(mA)
VC(V)
IPP(A)
IR(μA)
SMF5.0A
SMF5.0CA
KE
AE
5
6.4
7
10
9.2
21.8
500
SMF6.0A
SMF6.0CA
KG
AG
6
6.67
7.37
10
10.3
19.4
400
SMF6.5A
SMF6.5CA
KK
AK
6.5
7.22
7.98
10
11.2
17.9
350
SMF7.0A
SMF7.0CA
KM
AM
7
7.78
8.6
10
12.0
16.7
200
SMF7.5A
SMF7.5CA
KP
AP
7.5
8.33
9.21
1
12.9
15.5
100
SMF8.0A
SMF8.0CA
KR
AR
8
8.89
9.83
1
13.6
14.7
50
SMF8.5A
SMF8.5CA
KT
AT
8.5
9.44
10.4
1
14.4
13.9
20
SMF9.0A
SMF9.0CA
KV
AV
9
10
11.1
1
15.4
13.0
10
SMF10A
SMF10CA
KX
AX
10
11.1
12.3
1
17.0
11.8
5
SMF11A
SMF11CA
KZ
AZ
11
12.2
13.5
1
18.2
11.0
3
SMF12A
SMF12CA
LE
BE
12
13.3
14.7
1
19.9
10.1
1
SMF13A
SMF13CA
LG
BG
13
14.4
15.9
1
21.5
9.3
1
SMF14A
SMF14CA
LK
BK
14
15.6
17.2
1
23.2
8.6
1
SMF15A
SMF15CA
LM
BM
15
16.7
18.5
1
24.4
8.2
1
SMF16A
SMF16CA
LP
BP
16
17.8
19.7
1
26.0
7.7
1
SMF17A
SMF17CA
LR
BR
17
18.9
20.9
1
27.6
7.3
1
SMF18A
SMF18CA
LT
BT
18
20
22.1
1
29.2
6.9
1
SMF20A
SMF20CA
LV
BV
20
22.2
24.5
1
32.4
6.2
1
SMF22A
SMF22CA
LX
BX
22
24.4
26.9
1
35.5
5.7
1
SMF24A
SMF24CA
LZ
BZ
24
26.7
29.5
1
38.9
5.2
1
SMF26A
SMF26CA
ME
CE
26
28.9
31.9
1
42.1
4.8
1
SMF28A
SMF28CA
MG
CG
28
31.1
34.4
1
45.4
4.4
1
SMF30A
SMF30CA
MK
CK
30
33.3
36.8
1
48.4
4.2
1
SMF33A
SMF33CA
MM
CM
33
36.7
40.6
1
53.3
3.8
1
SMF36A
SMF36CA
MP
CP
36
40
44.2
1
58.1
3.5
1
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掌握芯技术Core Technology
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TVS Diodes
SMF Series
Electrical Characteristics (TA=25℃)
Device
Marking
Code
Part Number
Reverse
Stand-Off
Voltage
Breakdown
Voltage
@IT
Test
Current
Maximum
Clamping
Voltage
@IPP
Peak
Pulse
Current
Reverse
Leakage
@VR
Uni.
Bi.
Uni.
Bi.
VR(V)
VB MIn.(V)
VB Max.(V)
IT(mA)
VC(V)
IPP(A)
IR(μA)
SMF40A
SMF40CA
MR
CR
40
44.4
49.1
1
64.5
3.1
1
SMF43A
SMF43CA
MT
CT
43
47.8
52.8
1
69.4
2.9
1
SMF45A
SMF45CA
MV
CV
45
50
55.3
1
72.7
2.8
1
SMF48A
SMF48CA
MX
CX
48
53.3
58.9
1
77.4
2.6
1
SMF51A
SMF51CA
MZ
CZ
51
56.7
62.7
1
82.4
2.5
1
SMF54A
SMF54CA
NE
DE
54
60
66.3
1
87.1
2.3
1
SMF58A
SMF58CA
NG
DG
58
64.4
71.2
1
93.6
2.2
1
SMF60A
SMF60CA
NK
DK
60
66.7
73.7
1
96.8
2.1
1
SMF64A
SMF64CA
NM
DM
64
71.1
78.6
1
103.0
2.0
1
SMF70A
SMF70CA
NP
DP
70
77.8
86
1
113.0
1.8
1
SMF75A
SMF75CA
NR
DR
75
83.3
92.1
1
121.0
1.7
1
SMF78A
SMF78CA
NT
DT
78
86.7
95.8
1
126.0
1.6
1
SMF85A
SMF85CA
NV
DV
85
94.4
104
1
137.0
1.5
1
SMF90A
SMF90CA
NX
DX
90
100
111
1
146.0
1.4
1
SMF100A
SMF100CA
NZ
DZ
100
111
123
1
162.0
1.3
1
SMF110A
SMF110CA
PE
EE
110
122
135
1
177.0
1.2
1
SMF120A
SMF120CA
PG
EG
120
133
147
1
193.0
1.1
1
SMF130A
SMF130CA
PK
EK
130
144
159
1
209.0
1.0
1
SMF150A
SMF150CA
PM
EM
150
167
185
1
243.0
0.8
1
SMF160A
SMF160CA
PP
EP
160
178
197
1
259.0
0.8
1
SMF170A
SMF170CA
PR
ER
170
189
209
1
275.0
0.8
1
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掌握芯技术Core Technology
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TVS Diodes
SMF Series
Ratings and Characteristic Curves (TA=25℃)
Figure 1. Peak Pulse Power Rating Curve
Figure 2. Pulse Derating Curve
Figure 3. Pulse Waveform
Figure 4. Typical Junction Capacitance
150
tr=10µs
1000
Peak Value IPPM
Uni-directional V=0V
Cj (pF)
100
Half Value IPPM (IPPM/2)
50
0
10000
TJ=25℃
Pulse Width(td) is defined as
the point where the peak
current decays to 50% of IPPM
10/1000µs Waveform
as defined by R.E.A
1
1.0
2.0
3.0
Bi-directional V=0V
10
td
0
100
4.0
TJ=25℃
f=1.0MHz
Vsig=50mVp-p
1
Time (ms)
Figure 5. Steady State Power Dissipation Derating
Curve
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10
100
VBR-Reverse Breakdown Voltage (V)
1000
Figure 6. Maximum Non-Repetitive Forward Surge
Current Uni-Directional Only
掌握芯技术Core Technology
(V3)
TVS Diodes
SMF Series
Soldering Parameters
Reflow Soldering
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) ( tS)
150℃
200℃
60-180 seconds
TS max to TL
-Ramp-up Rate
3℃/second max.
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
6℃/second max.
Time 25℃ to Peak Temperature
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20-40 seconds
8 minutes max.
掌握芯技术Core Technology
(V3)
TVS Diodes
SMF Series
Part Number Code and Marking Code
Dimensions (SOD-123FL)
Symbol
Cathode Band
E
1.00
Max.
Min.
Max.
A
3.50
3.90
0.138
0.154
B
2.60
3.00
0.102
0.118
C
0.75
1.10
0.030
0.043
D
1.60
2.00
0.063
0.079
E
h
0.80Typ.
0.031Typ.
2.00
Recommended Soldering Pad Layout
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Inches
Min.
(for uni-directional products only)
B
A
Millimeters
H
0.90
1.35
0.035
0.053
h
0.12
0.22
0.005
0.009
掌握芯技术Core Technology
(V3)
TVS Diodes
SMF Series
Packaging Specification
Tape
For Uni-Devices
7 Inches Reel
Quantity:3000pcs/reel
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