ESP32WROOM32D &
ESP32WROOM32U
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Datasheet
Version 2.3
Espressif Systems
Copyright © 2022
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32D and ESP32-WROOM-32U
modules.
Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.
Not Recommended For New Designs (NRND)
Contents
1
Overview
6
2
Pin Definitions
8
2.1
Pin Layout
8
2.2
Pin Description
8
2.3
Strapping Pins
10
3
Functional Description
12
3.1
CPU and Internal Memory
12
3.2
External Flash and SRAM
12
3.3
Crystal Oscillators
12
3.4
RTC and Low-Power Management
13
4
Peripherals and Sensors
14
5
Electrical Characteristics
15
5.1
Absolute Maximum Ratings
15
5.2
Recommended Operating Conditions
15
5.3
DC Characteristics (3.3 V, 25 °C)
15
5.4
Wi-Fi Radio
16
5.5
Bluetooth LE Radio
17
5.5.1
Receiver
17
5.5.2
Transmitter
17
5.6
Reflow Profile
18
6
Schematics
19
7
Peripheral Schematics
21
8
Physical Dimensions
23
9
Recommended PCB Land Pattern
25
10 Dimensions of External Antenna Connector
27
11 Related Documentation and Resources
28
Revision History
29
Not Recommended For New Designs (NRND)
List of Tables
1
ESP32-WROOM-32D vs. ESP32-WROOM-32U
6
2
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications
7
3
Pin Definitions
8
4
Strapping Pins
10
5
Absolute Maximum Ratings
15
6
Recommended Operating Conditions
15
7
DC Characteristics (3.3 V, 25 °C)
15
8
Wi-Fi Radio Characteristics
16
9
Receiver Characteristics – Bluetooth LE
17
10
Transmitter Characteristics – Bluetooth LE
17
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List of Figures
1
ESP32-WROOM-32D Pin Layout (Top View)
8
2
Reflow Profile
18
3
ESP32-WROOM-32D Schematics
19
4
ESP32-WROOM-32U Schematics
20
5
ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics
21
6
Physical Dimensions of ESP32-WROOM-32D
23
7
Physical Dimensions of ESP32-WROOM-32U
24
8
Recommended PCB Land Pattern of ESP32-WROOM-32D
25
9
Recommended PCB Land Pattern of ESP32-WROOM-32U
26
10
Dimensions of External Antenna Connector of ESP32-WROOM-32U
27
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1 Overview
1 Overview
ESP32-WROOM-32D and ESP32-WROOM-32U are powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU
modules that target a wide variety of applications, ranging from low-power sensor networks to the most
demanding tasks, such as voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a connector
to connect an external antenna. For detailed information of the connector please see Chapter 10. Note that the
information in this data sheet is applicable to both modules. Any differences between them will be clearly
specified in the course of this document. Table 1 lists the difference between ESP32-WROOM-32D and
ESP32-WROOM-32U.
Table 1: ESP32WROOM32D vs. ESP32WROOM32U
Module
ESP32-WROOM-32D
ESP32-WROOM-32U
Core
ESP32-D0WD
ESP32-D0WD
SPI flash
32 Mbits, 3.3 V
32 Mbits, 3.3 V
Crystal
40 MHz
40 MHz
Antenna
on-board PCB antenna
Dimensions
(Unit: mm)
Schematics
external antenna connector (which needs to be
connected to an external antenna)
18 × 25.5 × 3.1 (See Figure 6 for details)
18 × 19.2 × 3.2 (See Figure 7 for details)
See Figure 3 for details.
See Figure 4 for details.
At the core of the two modules is the ESP32-D0WD chip that belongs to the ESP32 series* of chips. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power
coprocessor that can be used instead of the CPU to save power while performing tasks that do not require much
computing power, such as monitoring of peripherals. ESP32 integrates a rich set of peripherals, ranging from
capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I2S and I2C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth® , Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2 provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.
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1 Overview
Table 2: ESP32WROOM32D and ESP32WROOM32U Specifications
Categories
Items
Specifications
See
RF Certification
Certification
Test
certificates
for
ESP32-WROOM-32D
and
ESP32-WROOM-32U
Wi-Fi Certification
Wi-Fi Alliance
Bluetooth certification
BQB
Green Certification
REACH/RoHS
Reliablity
HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Protocols
Wi-Fi
A-MPDU and A-MSDU aggregation and 0.4 µs guard
interval support
Center frequency range of operating
channel
Bluetooth v4.2 BR/EDR and Bluetooth LE specifica-
Protocols
Bluetooth
2412 ~ 2484 MHz
tion
NZIF receiver with –97 dBm sensitivity
Radio
Class-1, class-2 and class-3 transmitter
AFH
Audio
CVSD and SBC
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive touch
Module interfaces
sensor, ADC, DAC, Two-Wire Automotive Interface
(TWAI® ), compatible with ISO11898-1 (CAN Specification 2.0)
On-chip sensor
Hardware
Hall sensor
Integrated crystal
Integrated SPI flash
40 MHz crystal
1
4 MB
Operating voltage/Power supply
3.0 V ~ 3.6 V
Operating current
Average: 80 mA
Minimum current delivered by power
supply
Recommended operating ambient temperature range 2
Moisture sensitivity level (MSL)
500 mA
–40 °C ~ +85 °C
Level 3
Notice:
1. ESP32-WROOM-32D and ESP32-WROOM-32U with 8 MB flash or 16 MB flash are available for custom order.
2. ESP32-WROOM-32D and ESP32-WROOM-32U with high temperature range (–40 °C ~ +105 °C) option are available for custom order. 4 MB SPI flash is supported on the high temperature range version.
3. For detailed ordering information, please see ESP Product Selector.
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2 Pin Definitions
2 Pin Definitions
2.1 Pin Layout
Keepout Zone
1
GND
GND
38
2
3V3
IO23
37
3
EN
IO22
36
4
SENSOR_VP
TXD0
35
5
SENSOR_VN
RXD0
34
6
IO34
IO21
33
39 GND
12
IO27
IO16
27
13
IO14
IO4
26
14
IO12
IO0
25
24
28
IO2
IO17
23
IO26
IO15
11
22
29
SD1
IO5
21
IO25
SD0
10
20
30
CLK
IO18
19
IO33
CMD
9
18
31
SD3
IO19
17
IO32
SD2
8
16
32
IO13
NC
15
IO35
GND
7
Figure 1: ESP32WROOM32D Pin Layout (Top View)
Note:
The pin layout of ESP32-WROOM-32U is the same as that of ESP32-WROOM-32D, except that ESP32-WROOM-32U
has no keepout zone.
2.2 Pin Description
The ESP32-WROOM-32D and ESP32-WROOM-32U have 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name
No.
Type
Function
GND
1
P
Ground
3V3
2
P
Power supply
EN
3
I
Module-enable signal. Active high.
SENSOR_VP
4
I
GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN
5
I
GPIO39, ADC1_CH3, RTC_GPIO3
IO34
6
I
GPIO34, ADC1_CH6, RTC_GPIO4
IO35
7
I
GPIO35, ADC1_CH7, RTC_GPIO5
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2 Pin Definitions
Name
No.
Type
Function
IO32
8
I/O
IO33
9
I/O
IO25
10
I/O
GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26
11
I/O
GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27
12
I/O
GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14
13
I/O
IO12
14
I/O
GND
15
P
IO13
16
I/O
SHD/SD2*
17
I/O
GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3*
18
I/O
GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD*
19
I/O
GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK*
20
I/O
GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0*
21
I/O
GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1*
22
I/O
GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15
23
I/O
IO2
24
I/O
IO0
25
I/O
IO4
26
I/O
IO16
27
I/O
GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17
28
I/O
GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5
29
I/O
GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18
30
I/O
GPIO18, VSPICLK, HS1_DATA7
IO19
31
I/O
GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC
32
-
-
IO21
33
I/O
GPIO21, VSPIHD, EMAC_TX_EN
RXD0
34
I/O
GPIO3, U0RXD, CLK_OUT2
TXD0
35
I/O
GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22
36
I/O
GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23
37
I/O
GPIO23, VSPID, HS1_STROBE
GND
38
P
Ground
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
TOUCH8, RTC_GPIO8
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.
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2 Pin Definitions
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin
MTDI
Default
3.3 V
1.8 V
Pull-down
0
1
Booting Mode
Pin
Default
SPI Boot
Download Boot
GPIO0
Pull-up
1
0
GPIO2
Pull-down
Don’t-care
0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin
Default
U0TXD Active
U0TXD Silent
MTDO
Pull-up
1
0
Timing of SDIO Slave
FE Sampling
FE Sampling
RE Sampling
RE Sampling
Pin
Default
FE Output
RE Output
FE Output
RE Output
MTDO
Pull-up
0
0
1
1
GPIO5
Pull-up
0
1
0
1
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2 Pin Definitions
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 3.3 V SPI flash, so the pin MTDI cannot be set
to 1 when the modules are powered up.
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3 Functional Description
3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32D and
ESP32-WROOM-32U.
3.1 CPU and Internal Memory
ESP32-D0WD contains a dual-core Xtensa® 32-bit LX6 MCU. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 4 MB of external SPI flash. The integrated SPI
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
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3 Functional Description
3.4 RTC and LowPower Management
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.
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4 Peripherals and Sensors
4 Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6 Schematics.
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5 Electrical Characteristics
5 Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in Table 5 below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
–0.3
3.6
V
Cumulative IO output current
-
1,100
mA
Storage temperature
–40
105
°C
Ioutput
1
Tstore
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol
Parameter
Min
Typical
Max
Unit
VDD33
Power supply voltage
3.0
3.3
3.6
V
IV DD
Current delivered by external power supply
0.5
-
-
A
T
Operating ambient temperature
–40
-
85
°C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol
CIN
VIH
Parameter
Min
Pin capacitance
-
High-level input voltage
0.75×VDD
1
Typ
Max
2
-
-
Unit
pF
1
VDD +0.3
V
1
VIL
Low-level input voltage
–0.3
-
0.25×VDD
IIH
High-level input current
-
-
50
nA
IIL
Low-level input current
-
-
50
nA
VOH
High-level output voltage
0.8×VDD1
-
-
V
VOL
Low-level output voltage
-
-
0.1×VDD1
V
VDD3P3_CPU power domain 1, 2
-
40
-
mA
1, 2
-
40
-
mA
-
20
-
mA
High-level source current
1
IOH
(VDD = 3.3 V, VOH >= 2.64 V,
output drive strength set to the
maximum)
VDD3P3_RTC power domain
VDD_SDIO power domain 1,
3
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V
5 Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
-
28
-
mA
Low-level sink current
(VDD1 = 3.3 V, VOL = 0.495 V,
IOL
output drive strength set to the maximum)
RP U
Resistance of internal pull-up resistor
-
45
-
kΩ
RP D
Resistance of internal pull-down resistor
-
45
-
kΩ
VIL_nRST
Low-level input voltage of CHIP_PU to power off the chip
-
-
0.6
V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 WiFi Radio
Table 8: WiFi Radio Characteristics
Parameter
Center frequency range of operating channel
Min
Typical
Max
Unit
-
2412
-
2484
MHz
-
-
note 2
-
Ω
11n, MCS7
12
13
14
dBm
11b mode
17.5
18.5
20
dBm
11b, 1 Mbps
-
–98
-
dBm
11b, 11 Mbps
-
–89
-
dBm
11g, 6 Mbps
-
–92
-
dBm
11g, 54 Mbps
-
–74
-
dBm
11n, HT20, MCS0
-
–91
-
dBm
11n, HT20, MCS7
-
–71
-
dBm
11n, HT40, MCS0
-
–89
-
dBm
11n, HT40, MCS7
-
–69
-
dBm
11g, 6 Mbps
-
31
-
dB
11g, 54 Mbps
-
14
-
dB
11n, HT20, MCS0
-
31
-
dB
11n, HT20, MCS7
-
13
-
dB
note1
Output impedance note2
TX power
Condition
note3
Sensitivity
Adjacent channel rejection
1. Device should operate in the center frequency range of operating channel allocated by regional regulatory authorities.
Target center frequency range of operating channel is configurable by software.
2. For the modules that use external antennas, the output impedance is 50 Ω. For other modules without external
antennas, users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
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5 Electrical Characteristics
5.5 Bluetooth LE Radio
5.5.1 Receiver
Table 9: Receiver Characteristics – Bluetooth LE
Parameter
Conditions
Min
Typ
Max
Unit
Sensitivity @30.8% PER
-
-
–97
-
dBm
Maximum received signal @30.8% PER
-
0
-
-
dBm
Co-channel C/I
-
-
+10
-
dB
F = F0 + 1 MHz
-
–5
-
dB
F = F0 – 1 MHz
-
–5
-
dB
F = F0 + 2 MHz
-
–25
-
dB
F = F0 – 2 MHz
-
–35
-
dB
F = F0 + 3 MHz
-
–25
-
dB
F = F0 – 3 MHz
-
–45
-
dB
30 MHz ~ 2000 MHz
–10
-
-
dBm
2000 MHz ~ 2400 MHz
–27
-
-
dBm
2500 MHz ~ 3000 MHz
–27
-
-
dBm
3000 MHz ~ 12.5 GHz
–10
-
-
dBm
-
–36
-
-
dBm
Adjacent channel selectivity C/I
Out-of-band blocking performance
Intermodulation
5.5.2 Transmitter
Table 10: Transmitter Characteristics – Bluetooth LE
Parameter
Conditions
Min
Typ
Max
Unit
RF transmit power
-
-
0
-
dBm
Gain control step
-
-
3
-
dBm
RF power control range
-
–12
-
+9
dBm
F = F0 ± 2 MHz
-
–52
-
dBm
F = F0 ± 3 MHz
-
–58
-
dBm
F = F0 ± > 3 MHz
-
–60
-
dBm
∆ f 1avg
-
-
-
265
kHz
∆ f 2max
-
247
-
-
kHz
∆ f 2avg /∆ f 1avg
-
-
–0.92
-
-
ICFT
-
-
–10
-
kHz
Drift rate
-
-
0.7
-
kHz/50 µs
Drift
-
-
2
-
kHz
Adjacent channel transmit power
Not Recommended For New Designs (NRND)
Espressif Systems
17
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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5 Electrical Characteristics
Temperature (℃)
5.6 Reflow Profile
Peak Temp.
235 ~ 250 ℃
250
Preheating zone
150 ~ 200 ℃
60 ~ 120 s
217
200
Reflow zone
217 ℃ 60 ~ 90 s
Cooling zone
–1 ~ –5 ℃/s
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0
50
100
150
200
250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃
60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 2: Reflow Profile
Note:
Solder the module in a single reflow.
Not Recommended For New Designs (NRND)
Espressif Systems
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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6 Schematics
Pin.1
GND
The values of C1 and C2 vary with
the selection of the crystal.
Pin.15
GND
D1
LESD8D3.3CAT5G
C1
22pF/6.3V(10%)
1
VDD33
C3
100pF
20K(5%)
3
C6
R3
Not Recommended For New Designs (NRND)
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
A
GND
GND
GND
The values of C14 、 L4 and C15
vary with the actual PCB board.
U0TXD
R2
48
47
46
45
44
43
42
41
40
39
Pin.34
U0RXD
SCS/CMD
Pin.20
CLK
U0RXD
Pin.33
IO21
SCK/CLK
GPIO21
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
GND
VDD33
C4
0.1uF
Pin.7
IO35
VDD_SDIO
Pin.21
SD0
GPIO35
Pin.32
NC
SDO/SD0
GND
C16
NC
C17
NC
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
U2
GPIO19
VDD3P3_CPU
GPIO23
GPIO18
GPIO5
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO17
VDD_SDIO
GPIO16
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GPIO19
GPIO23
GPIO18
GPIO5
SDI/SD1
SDO/SD0
SCK/CLK
SCS/CMD
SWP/SD3
SHD/SD2
GPIO17
GPIO16
U3
SCS/CMD
1
SCK/CLK
6
SHD/SD2
7
Pin.8
IO32
8
1
2
3
4
SENSOR_VP 5
6
7
SENSOR_VN8
CHIP_PU
9
10
GPIO34
11
GPIO35
12
GPIO32
13
GPIO33
14
GPIO25
VCC
PCB ANT
Pin.6
IO34
/CS
CLK
/HOLD
FLASH
GND
C14
TBD
SWP/SD3
SENSOR_VN
GPIO21
U0TXD
U0RXD
GPIO22
499R
DI
DO
/WP
5
SDI/SD1
2
SDO/SD0
3
SWP/SD3
GND
Pin.22
SD1
GPIO32
Pin.9
IO33
Pin.31
IO19
SDI/SD1
Pin.23
IO15
GPIO33
4
C15
TBD
GND
TBD
Pin.10
IO25
GPIO19
Pin.30
IO18
GPIO15
Pin.24
IO2
GPIO25
GPIO18
Pin.29
IO5
GPIO2
GPIO5
VDD_SDIO
C18
1uF
Pin.11
IO26
ESP32-D0WD
GND
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GND
L4
C21
NC
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GND
1
2
C10
0.1uF
GPIO22
Pin.35
U0TXD
Pin.19
CMD
GPIO34
15
16
17
18
19
20
21
22
23
24
ANT1 GND
C13
10uF
GPIO26
GPIO27
GPIO14
GPIO12
C12
NC
2.0nH
GND
C11
1uF
49
GND
L5
GPIO23
Pin.36
IO22
SHD/SD2
SENSOR_VP
3.3nF/6.3V(10%)
GND
VDD33
GPIO13
Pin.18
SD3
Pin.5
SENSOR_VN
0R
C5
10nF/6.3V(10%)
C9
0.1uF
19
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GND
Pin.4
SENSOR_VP
GND
Pin.37
IO23
Pin.17
SD2
CHIP_PU
C2
22pF/6.3V(10%)
GND
40MHz+/-10ppm
R1
GND
Pin.16
IO13
GND
C20
1uF
C
VDD33
Pin.3
CHIP_PU/EN
GND
2
XIN
GND
U1
GND
VDD33
GND XOUT
4
GND
GND
Pin.38
GND
GND
Pin.2
3V3
B
6 Schematics
Espressif Systems
D
VDD33
C19
0.1uF
Pin.28
IO17
GPIO26
GPIO17
Pin.12
IO27
Pin.27
IO16
GPIO27
GPIO16
GND
Pin.13
IO14
Pin.26
IO4
GPIO14
Pin.14
IO12
Pin.39
GND
GPIO12
Figure 3: ESP32WROOM32D Schematics
GPIO4
Pin.25
IO0
GND
GPIO0
D
Pin.2
3V3
1
C5
10nF/6.3V(10%)
C6
GND
GND
GND
U0TXD
3
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
GND
Pin.34
U0RXD
SCS/CMD
Pin.20
CLK
U0RXD
Pin.33
IO21
SCK/CLK
GPIO21
Pin.7
IO35
VDD_SDIO
Pin.21
SD0
GPIO35
Pin.32
NC
SDO/SD0
GND
TBD
C14
TBD
VDD33
C4
0.1uF
C16
NC
C17
NC
The values of C14 、 L4 and C15
vary with the actual PCB board.
1
2
3
4
SENSOR_VP 5
6
7
SENSOR_VN8
CHIP_PU
9
10
GPIO34
11
GPIO35
12
GPIO32
13
GPIO33
14
GPIO25
VDDA
LNA_IN
VDD3P3
VDD3P3
SENSOR_VP
SENSOR_CAPP
SENSOR_CAPN
SENSOR_VN
CHIP_PU
VDET_1
VDET_2
32K_XP
32K_XN
GPIO25
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GPIO19
GPIO23
GPIO18
GPIO5
SDI/SD1
SDO/SD0
SCK/CLK
SCS/CMD
SWP/SD3
SHD/SD2
GPIO17
GPIO16
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
GPIO26
GPIO27
GPIO14
GPIO12
U3
SCS/CMD
1
SCK/CLK
6
SHD/SD2
7
Pin.8
IO32
/CS
CLK
/HOLD
FLASH
DI
DO
/WP
5
SDI/SD1
2
SDO/SD0
3
SWP/SD3
GND
Pin.22
SD1
GPIO32
Pin.9
IO33
Pin.31
IO19
SDI/SD1
Pin.23
IO15
GPIO33
Pin.10
IO25
GPIO19
Pin.30
IO18
GPIO15
Pin.24
IO2
GPIO25
GPIO18
Pin.29
IO5
GPIO2
GPIO5
VDD_SDIO
C18
1uF
Pin.11
IO26
ESP32-D0WD
GND
Not Recommended For New Designs (NRND)
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
U2
GPIO19
VDD3P3_CPU
GPIO23
GPIO18
GPIO5
SD_DATA_1
SD_DATA_0
SD_CLK
SD_CMD
SD_DATA_3
SD_DATA_2
GPIO17
VDD_SDIO
GPIO16
8
GND
C21
NC
VCC
C15
TBD
3
2
L4
SWP/SD3
GND
GND
1
Pin.6
IO34
4
GND
C10
0.1uF
IPEX
J39
2.0nH
GPIO26
GPIO27
MTMS
MTDI
VDD3P3_RTC
MTCK
MTDO
GPIO2
GPIO0
GPIO4
GND
C13
10uF
GPIO22
Pin.35
U0TXD
Pin.19
CMD
GPIO34
15
16
17
18
19
20
21
22
23
24
GND
20
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C12
NC
49
GND
L5
SHD/SD2
SENSOR_VN
GPIO21
U0TXD
U0RXD
GPIO22
499R
48
47
46
45
44
43
42
41
40
39
GND
C11
1uF
R3
3.3nF/6.3V(10%)
R2
C9
0.1uF
VDD33
GPIO23
Pin.36
IO22
Pin.18
SD3
Pin.5
SENSOR_VN
20K(5%)
0R
GND
GPIO13
Pin.17
SD2
SENSOR_VP
GND
40MHz+/-10ppm
R1
GND
Pin.4
SENSOR_VP
GND
Pin.37
IO23
GND
C20
1uF
C
VDD33
Pin.16
IO13
CHIP_PU
C2
22pF/6.3V(10%)
2
XIN
C1
22pF/6.3V(10%)
Pin.3
CHIP_PU/EN
GND
GND XOUT
4
U1
Pin.38
GND
GND
VDD33
GND
GND
C3
100pF
A
D1
LESD8D3.3CAT5G
GND
VDD33
B
Pin.15
GND
GND
VDD33
C19
0.1uF
Pin.28
IO17
GPIO26
GPIO17
Pin.12
IO27
Pin.27
IO16
GPIO27
GPIO16
GND
Pin.13
IO14
Pin.26
IO4
GPIO14
Pin.14
IO12
GPIO12
Figure 4: ESP32WROOM32U Schematics
GPIO4
Pin.39
GND
Pin.25
IO0
GND
GPIO0
6 Schematics
Espressif Systems
Pin.1
GND
The values of C1 and C2 vary with
the selection of the crystal.
C1 10uF
C2 0.1uF
GND
GND
GND
C3
TBD
EN
GND2
IO13
SD2
SD3
CMD
CLK
SD0
SD1
IO15
IO2
P_GND
GND3
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
IO17
IO16
IO4
IO0
15
16
17
18
19
20
21
22
23
24
U2
MTMS
MTDI
MTCK
MTDO
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
J1
IO23
IO22
TXD
RXD
IO21
GND
IO19
IO18
IO5
IO17
IO16
IO4
IO0
GND
J2
BOOT OPTION
GND
1
2
3
4
R2
R3
R4
R5
100R
100R
100R
100R
MTMS
MTDI
MTCK
MTDO
IO2
Not Recommended For New Designs (NRND)
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
GND1
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
3
2
1
1
2
3
SENSOR_VP 4
SENSOR_VN 5
6
IO34
7
IO35
8
IO32
9
IO33
10
IO25
11
IO26
12
IO27
13
14
SD2
SD3
CMD
CLK
SD0
SD1
GND
UART DOWNLOAD
U1
1
2
R1
TBD
21
B
7 Peripheral Schematics
VDD33 VDD33
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C
7 Peripheral Schematics
Espressif Systems
D
JTAG
MTDI should be kept at a low electric level when powering up the module.
Figure 5: ESP32WROOM32D & ESP32WROOM32U Peripheral Schematics
A
Espressif Systems
Title
• Soldering Pad 39 to the Ground is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering
paste is applied.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is
usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
7 Peripheral Schematics
Espressif Systems
Note:
22
Not Recommended For New Designs (NRND)
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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8 Physical Dimensions
8 Physical Dimensions
Unit: mm
6.19
0.85
0.80
0
Ø0.5
10.50
10.29
0.90
1.27
15.80
1.50
3.60
3.60
0.1
17.60
0.90
16.51
25.50±0.15
0.45
0.90
6.19
3.10±0.15
1.05
0.85
8.89
11.43
18.00±0.15
Top View
Side View
Bottom View
Figure 6: Physical Dimensions of ESP32WROOM32D
Not Recommended For New Designs (NRND)
Espressif Systems
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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8 Physical Dimensions
3.07
Unit: mm
0.45
3.20±0.15
3.27
0.85
0.80
10.50
10.29
3.60
0.90
13.05
1.15
1.27
8.89
3.60
0.90
0.1
17.50
0.90
16.51
15.65
1.50
19.20±0.15
10.75
0.85
1.18
11.43
18.00±0.15
Top View
Side View
Bottom View
Figure 7: Physical Dimensions of ESP32WROOM32U
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
Not Recommended For New Designs (NRND)
Espressif Systems
24
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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9 Recommended PCB Land Pattern
9 Recommended PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
6.19
18.00
Antenna Area
38x1.50
3.70
0.90
0.50
16.51
14 15
0.50
1.50
7.50
38
10.29
0.50
0.90
3.70
1.27
1.50
25.50
38x0.90
1
24 25
1.27
0.50
11.43
3.28
Figure 8: Recommended PCB Land Pattern of ESP32WROOM32D
Not Recommended For New Designs (NRND)
Espressif Systems
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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9 Recommended PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
18.00
38x1.50
3.70
0.90
0.50
16.51
14 15
0.50
1.50
7.50
38
10.29
0.50
0.90
3.70
1.27
1.50
19.20
38x0.90
1
24 25
1.27
0.50
11.43
3.28
Figure 9: Recommended PCB Land Pattern of ESP32WROOM32U
Not Recommended For New Designs (NRND)
Espressif Systems
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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10 Dimensions of External Antenna Connector
10
Dimensions of External Antenna Connector
Unit: mm
Figure 10: Dimensions of External Antenna Connector of ESP32WROOM32U
Not Recommended For New Designs (NRND)
Espressif Systems
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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11 Related Documentation and Resources
11
Related Documentation and Resources
Related Documentation
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
Not Recommended For New Designs (NRND)
Espressif Systems
28
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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Revision History
Revision History
Date
Version
Release notes
Updated Table 1
Added a link to RF certificates in Table 2
2022.03
v2.3
Updated Table 5
Added a note below Figure 7
Updated the description to the connector
Added Section 11: Related Documentation and Resources
Replaced Espressif Product Ordering Information with ESP Product Selector
2021.08
v2.2
Updated the description of TWAI in Table 1
Labeled this document as (Not Recommended For New Designs)
Updated Figure 6: Physical Dimensions of ESP32-WROOM-32D, Figure 7: Physical
Dimensions of ESP32-WROOM-32U, Figure 8: Recommended PCB Land Pattern of
ESP32-WROOM-32D, and Figure 9: Recommended PCB Land Pattern of ESP32-
2021.02
V2.1
WROOM-32U.
Modified the note below Figure 2: Reflow Profile.
Modified the note below Figure 5: ESP32-WROOM-32D & ESP32-WROOM-32U
Peripheral Schematics.
Updated the trade mark from TWAI™ to TWAI® .
Added TWAITM in Table 1;
2020.11
V2.0
Added a note under Figure 2: Reflow Profile;
Updated the C value in RC delay circuit from 0.1 µF to 1 µF;
Provided feedback link.
• Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-WROOM-32D and
ESP32-WROOM-32U Specifications;
2019.09
V1.9
• Added notes about ”Operating frequency range” and ”TX power” under Table
8 Wi-Fi Radio Characteristics;
• Updated Section 7 Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 8 and Figure 9 Recommended PCB Land Pattern.
2019.01
V1.8
Changed the RF power control range in Table 10 from –12 ~ +12 to –12 ~ +9 dBm.
Added notice on module custom options under Table 2;
2018.10
V1.7
Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.09
V1.6
Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 6.
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications, and removed
software-specific information;
2018.08
V1.5
• Updated section 3.4: RTC and Low-Power Management;
• Changed the modules’ dimensions;
• Updated Figure 8 and 7: Physical Dimensions;
• Updated Table 8: Wi-Fi Radio.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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Revision History
Date
Version
Release notes
• Deleted Temperature Sensor in Table 2: ESP32-WROOM-32D & ESP32WROOM-32U Specifications;
• Updated Chapter 3: Functional Description;
• Added notes to Chapter 7: Peripheral Schematics;
• Added Chapter 8: Recommended PCB Land Pattern;
2018.06
V1.4
Changes to electrical characteristics:
• Updated Table 5: Absolute Maximum Ratings;
• Added Table 6: Recommended Operating Conditions;
• Added Table 7: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
2018.04
V1.3
2018.02
V1.2
Updated Figure 4 ESP32-WROOM-32U Schematics and Figure 3 ESP32-WROOM32D Schematics.
Update Figure 4 ESP32-WROOM-32U Schematics.
Updated Chapter 6 Schematics.
Deleted description of low-noise amplifier.
2018.02
V1.1
Replaced the module name ESP-WROOM-32D with ESP32-WROOM-32D.
Added information about module certification in Table 2.
Updated the description of eFuse bits in Section 3.1.
2017.11
V1.0
First release.
Not Recommended For New Designs (NRND)
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
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registered trademark of Bluetooth SIG.
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