SBRD10200
Technical Data
Data Sheet N1314, Rev. A
SBRD10200 SCHOTTKY RECTIFIER
Features
150℃ TJ operation
Center tap configuration
Low forward voltage drop
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
DPAK
Circuit Diagram
Applications
Switching power supply
Converters
Free-Wheeling diodes
Reverse battery protection
Battery charging
Maximum Ratings:
Symbol
Condition
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Characteristics
VRRM
VRWM
VR
-
Max.
Units
200
V
Average Rectified Forward Current
IF (AV)
50% duty cycle @Tc=105°C,
rectangular wave form
10
A
Peak One Cycle Non-Repetitive Surge
Current
IFSM
8.3ms, Half Sine pulse
100
A
Electrical Characteristics:
Characteristics
Typ.
Max.
Units
VF1
@ 10A, Pulse, TJ = 25 C
0.90
0.95
V
@ 10A, Pulse, TJ = 125 C
0.80
0.85
V
Reverse Current *
VF2
IR1
@VR = rated VR, TJ = 25 C
0.0002
1.0
mA
IR2
@VR = rated VR , TJ = 125 C
0.02
7.0
mA
Junction Capacitance
CT
@VR = 5.0V, TC = 25 C
fSIG = 1MHz
-
100
150
pF
-
10,000
V/s
Forward Voltage Drop*
Voltage Rate of Change
Symbol
dv/dt
Condition
* Pulse width < 300 µs, duty cycle < 2%
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SBRD10200
Technical Data
Data Sheet N1314, Rev. A
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case
Approximate Weight
Case Style
Symbol
Condition
Specification
Units
TJ
Tstg
-
-55 to +150
-55 to +150
C
C
RJC
-
6
C/W
wt
-
0.39
g
DPAK
Ratings and Characteristics Curves
TJ=125℃
TJ=25℃
TJ=25℃
Fig.1-Typical Junction Capacitance
Fig.2-Typical Reverse Characteristics
TJ=125℃
TJ=25℃
Fig.3-Typical Instantaneous Forward Voltage Characteristics
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http://www.smc-diodes.com - sales@ smc-diodes.com
SBRD10200
Technical Data
Data Sheet N1314, Rev. A
Mechanical Dimensions DPAK
SYMBOL
A
A1
b
c
D
D1
D2
E
e
L
L1
L2
L3
L4
Φ
Θ
h
V
Ordering Information
Device
SBRD10200
Package
DPAK
(Pb-Free)
Millimeters
Inches
Min.
Max.
2.20
2.40
0.00
0.127
0.66
0.86
0.46
0.60
6.50
6.70
5.13
5.46
4.83 REF.
6.00
6.20
2.186
2.386
9.70
10.40
2.90 REF.
1.40
1.70
1.60 REF.
0.60
1.00
1.10
1.30
0°
8°
0.00
0.30
5.35 REF.
Min.
Max.
0.087
0.094
0.000
0.005
0.026
0.034
0.018
0.024
0.256
0.264
0.202
0.215
0.190 REF.
0.236
0.244
0.086
0.094
0.381
0.409
0.144 REF.
0.055
0.067
0.063 REF.
0.024
0.039
0.043
0.051
0°
8°
0.000
0.012
0.211 REF.
Marking Diagram
Where XXXXX is YYWWL
Shipping
SBRD10200
SSG
YY
WW
L
2500pcs / reel
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
= Part Name
= SSG
= Year
= Week
= Lot Number
Cautions:Molding resin
Epoxy resin UL:94V-0
Carrier Tape & Reel Specification DPAK
SYMBOL
A
B
C
d
E
F
P0
P
P1
W
Millimeters
Min.
Max.
6.80
10.40
2.60
Φ1.45
1.65
7.40
3.90
7.90
1.90
15.90
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7.00
10.60
2.80
Φ1.65
1.85
7.60
4.10
8.10
2.10
16.30
SBRD10200
Technical Data
Data Sheet N1314, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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