PESD3V3L4BHC
4-fold bidirectional ESD protection array
7 June 2019
Product data sheet
1. General description
4-fold bidirectional ElectroStatic Discharge (ESD) protection array designed to protect up to four
lines from the damage caused by ESD and other transients.
The device is housed in a leadless extremely thin small DFN1308-6 (SOT8006) Surface-Mounted
Device (SMD) plastic package.
2. Features and benefits
•
•
•
•
•
Bidirectional ESD protection of up to 4 lines
Very high surge robustness; IPP = 6 A for 8/20 µs pulse
Very low clamping voltage: VCL = 7.3 V typ. for 6 A 8/20 µs pulse
ESD protection up to 20 kV
Very low dynamic resistance Rdyn = 0.2 Ω (TLP)
3. Applications
ESD protection for low-speed lines in portable communication, consumer devices and computing
devices.
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VRWM
reverse standoff
voltage
Tamb = 25 °C
-
-
3.3
V
IPPM
rated peak pulse
current
tp = 8/20 µs; Tamb = 25 °C
-
-
6
A
Vt1
trigger voltage
Tamb = 25 °C
-
6.7
-
V
[1]
Device stressed with 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[1]
PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
5. Pinning information
Table 2. Pinning information
Pin
Symbol Description
1
K1
cathode (diode 1)
2
CC
common cathode
3
K2
cathode (diode 2)
4
K3
cathode (diode 3)
5
CC
common cathode
6
K4
cathode (diode 4)
Simplified outline
Graphic symbol
1
2
3
6
5
4
DFN1308-6 (SOT8006)
K1
K4
CC
CC
K2
K3
aaa-030022
6. Ordering information
Table 3. Ordering information
Type number
Package
PESD3V3L4BHC
Name
Description
Version
DFN1308-6
DFN1308-6, plastic, leadless extremely thin small package; 6
terminals; body 1.3 x 0.8 x 0.38 mm
SOT8006
7. Marking
Table 4. Marking codes
Type number
Marking code
PESD3V3L4BHC
L4
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134)
Symbol
Parameter
Conditions
Min
Max
Unit
IPPM
rated peak pulse current
tp = 8/20 µs; Tamb = 25 °C
-
6
A
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1]
ESD maximum ratings
VESD
[1]
[2]
electrostatic discharge
voltage
IEC 61000-4-2 (contact discharge)
[2]
-
20
kV
IEC 61000-4-2 (air discharge)
[2]
-
20
kV
Device stressed with 8/20 µs exponential decay waveform according to IEC 61000-4-5.
Device stressed with ten non-repetitive ESD pulses.
PESD3V3L4BHC
Product data sheet
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
001aaa630
120
IPP
100 %
100 % IPP; 8 µs
IPP
(%)
80
90 %
e-t
50 % IPP; 20 µs
40
10 %
0
Fig. 1.
0
10
20
30
t (µs)
8/20 µs pulse waveform according to
IEC 61000-4-5
t
tr = 0.6 ns to 1 ns
40
30 ns
60 ns
Fig. 2.
001aaa631
ESD pulse waveform according to IEC
61000-4-2
9. Characteristics
Table 6. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VRWM
reverse standoff
voltage
Tamb = 25 °C
-
-
3.3
V
IRM
reverse leakage current VRWM = 3.3 V; Tamb = 25 °C
-
3
100
nA
Cd
diode capacitance
f = 1 MHz; VR = 0 V; Tamb = 25 °C
-
7.2
9
pF
VCL
clamping voltage
IPPM = 1 A; tp = 8/20 µs; Tamb = 25 °C
[1]
-
5.9
-
V
IPPM = 6 A; tp = 8/20 µs; Tamb = 25 °C
[1]
-
7.3
8.5
V
[2]
-
0.2
-
Ω
-
6.7
-
V
4
-
-
V
Rdyn
dynamic resistance
IR = 10 A; Tamb = 25 °C
Vt1
trigger voltage
Tamb = 25 °C
Vh
holding voltage
[1]
[2]
Device stressed with 8/20 µs exponential decay waveform according to IEC 61000-4-5.
Non-repetitive current pulse, Transmission Line Pulse (TLP); square pulse; ANSI/ESD STM5.5.1-2008.
PESD3V3L4BHC
Product data sheet
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
IPPM
IPP
aaa-029986
8
Cd
(pF)
6
IR
IRM
-VCL -VBR -VRWM
4
-IRM
-IR
VRWM VBR VCL
2
-
+
0
-IPP
-IPPM
Fig. 3.
006aab325
V-I characteristics for a bidirectional ESD
protection diode
-2
0
2
VR (V)
4
f = 1 MHz; Tamb = 25 °C
Fig. 4.
Diode capacitance as a function of reverse
voltage; typical values
aaa029987
40
-4
aaa029988
0
IPP
(A)
IPP
(A)
30
-10
20
-20
Rdyn = 0.2 Ω
10
0
0
2
4
6
8
10
12
VCL (V)
-40
-14
14
tp = 100 ns; Transmission Line Pulse (TLP)
Fig. 5.
Rdyn = 0.2 Ω
-30
Product data sheet
-10
-8
-6
-4
-2
VCL (V)
0
tp = 100 ns; Transmission Line Pulse (TLP)
Positive clamping voltage (TLP); typical values
PESD3V3L4BHC
-12
Fig. 6.
Negative clamping voltage (TLP); typical values
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
ESD TESTER
4 GHz DIGITAL
OSCILLOSCOPE
RG 223/U
50 Ω coax
Rd
40 dB
ATTENUATOR
Cs
50 Ω
DUT
(DEVICE
UNDER
TEST)
IEC 61000-4-2 ed.2
Cs = 150 pF; Rd = 330 Ω
10
2
V
(kV) 8
V
(kV) 0
6
-2
4
-4
2
-6
0
-8
-2
-10
0
10
20
30
40
50
t (ns)
60
-10
-10
70
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
0
10
20
30
40
50
t (ns)
60
70
unclamped -8 kV ESD pulse waveform
(IEC 61000-4-2 network)
aaa-003952
Fig. 7.
ESD clamping test setup and waveforms
aaa-029989
100
VCL
(V)
VCL
(V)
60
20
VCL at 30 ns = 7.0 V
20
-60
-10
-60
10
30
50
t (ns)
-100
-10
70
Clamped +8 kV pulse waveform (IEC 61000-4-2
network)
PESD3V3L4BHC
Product data sheet
VCL at 30 ns = -6.8 V
-20
-20
Fig. 8.
aaa-029990
60
Fig. 9.
30
50
t (ns)
70
Clamped -8 kV pulse waveform (IEC 61000-4-2
network)
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
10. Application information
The device is designed for protection of up to 4 bidirectional data lines from the damage caused
by ESD and surge pulses. The device is suitable on lines where the signal polarities are above or
below ground.
data- or transmission lines
DUT
1
6
2
5
3
4
006aab335
Fig. 10. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge
transients. The following guidelines are recommended:
•
•
•
•
•
•
•
•
PESD3V3L4BHC
Product data sheet
Place the device as close to the input terminal or connector as possible
Minimize the path length between the device and the protected line.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
Minimize the length of the transient return path to ground.
Avoid using shared transient return paths to a common ground point.
Use ground planes whenever possible. For multilayer PCBs, use ground vias.
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
11. Package outline
DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm
A
D
SOT8006
B
E
pin 1
index area
detail X
(optional side view)
(6x)
seating plane
X
A1
y C
C
A2
A
e
G x 45°
y1 C
e
1
2
3
L (6x)
6
5
4
b
(6x)
v
0
C A B
0.5
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
max
nom
min
mm
A
A1
A2
b
D
E
e
G
L
u
v
y
y1
0.43
0.38
0.33
0.05
0.02
0.00
0.18
0.13
0.08
0.23
0.18
0.13
1.40
1.30
1.20
0.90
0.80
0.70
0.45
0.11
0.08
0.05
0.30
0.25
0.20
0.1
0.1
0.05
0.05
sot8006_po
Outline
version
SOT8006
References
IEC
JEDEC
JEITA
European
projection
Issue date
19-05-06
---
Fig. 11. Package outline DFN1308-6 (SOT8006)
PESD3V3L4BHC
Product data sheet
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
12. Soldering
Footprint information for reflow soldering of DFN1308-6 package
SOT8006
1.6
0.28
0.17
0.18
0.27
0.45
0.5
0.45
0.4
1.05
1.35 0.15 0.25
1.08
recommend stencil thickness: 0.1 mm
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
19-05-06
sot8006_fr
Fig. 12. Reflow soldering footprint for DFN1308-6 (SOT8006)
PESD3V3L4BHC
Product data sheet
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
13. Revision history
Table 7. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PESD3V3L4BHC v.1
Product data sheet
-
-
PESD3V3L4BHC
Product data sheet
20190607
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
14. Legal information
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
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detailed and full information. For detailed and full information see the relevant
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PESD3V3L4BHC
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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sold subject to the general terms and conditions of commercial sale, as
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In the event that customer uses the product for design-in and use in
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PESD3V3L4BHC
Nexperia
4-fold bidirectional ESD protection array
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Characteristics.............................................................. 3
10. Application information............................................. 6
11. Package outline.......................................................... 7
12. Soldering..................................................................... 8
13. Revision history..........................................................9
14. Legal information......................................................10
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Nexperia B.V. 2019. All rights reserved
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Date of release: 7 June 2019
PESD3V3L4BHC
Product data sheet
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