CMM-2718AB-383161-TR

Additional Resources: Product Page | 3D Model | PCB Footprint date 01/16/2020 page 1 of 5 MODEL: CMM-2718AB-383161-TR │ DESCRIPTION: MEMS MICROPHONE FEATURES • • • • analog small package reflow solder compatible omnidirectional ELECTRICAL parameter conditions/description directivity omnidirectional sensitivity (S) at 94 dB SPL, 1 kHz supply voltage (VDD) min typ max units -41 -38 -35 dB 2.0 3.6 1.6 current consumption (IDSS) VDD = 2.0 V sensitivity reduction VDD = 3.6 ~ 1.6 V 160 -0.5 frequency (f) 100 V µA dB 10,000 Hz signal to noise ratio (S/N) at 94 dB SPL, 1 kHz (A-weighted) 61 dBA total harmonic distortion (THD) at 94 dB SPL, 1 kHz 0.2 % acoustic overload point (AOP) at 10% THD, 1 kHz 124 output impedance (Zout) at 1 kHz Notes: dB SPL 300 Ω 2. All specifications measured at 23±2°C, humidity at 55±20%, unless otherwise noted. ENVIRONMENTAL parameter conditions/description min operating temperature storage temperature in packaging RoHS yes max units -40 typ 105 °C -40 85 °C max units MECHANICAL parameter conditions/description dimensions 2.75 x 1.85 x 0.95 acoustic port bottom terminals surface mount min typ mm weight 0.02 cuidevices.com g Additional Resources: Product Page | 3D Model | PCB Footprint CUI Devices │ MODEL: CMM-2718AB-383161-TR │ DESCRIPTION: MEMS MICROPHONE date 01/16/2020 │ page 2 of 5 MECHANICAL DRAWING units: mm tolerance: ±0.1 mm VDD 2 output 3 GND  5 ķ       ĸ ķ Ĺ      Recommended Vacuum Nozzle Pickup Top View Recommended PCB Layout Top View cuidevices.com   ķ ĸ Ĺ  FUNCTION 1  TERM.   TERMINAL CONNECTIONS Additional Resources: Product Page | 3D Model | PCB Footprint CUI Devices │ MODEL: CMM-2718AB-383161-TR │ DESCRIPTION: MEMS MICROPHONE date 01/16/2020 │ page 3 of 5 FREQUENCY RESPONSE CURVE APPLICATION CIRCUIT VDD 0.1 µF R2 Term. 1 (VDD) Term. 2 (Output) R1 ˉ 0.1 µF Dashed Section Represents MEMS Microphone ˇ External Gain = -R2/R1 (Set By User) Term. 3 (GND) cuidevices.com Additional Resources: Product Page | 3D Model | PCB Footprint CUI Devices │ MODEL: CMM-2718AB-383161-TR │ DESCRIPTION: MEMS MICROPHONE date 01/16/2020 │ page 4 of 5 SOLDERABILITY parameter conditions/description reflow soldering see reflow profile min typ max units 260 °C max units 85 °C Note: 1. Vacuuming over acoustical hole is not allowed. 2. Not suitable for wash process. 3. Not recommended to exceed 5 reflow cycles. 20~40 s 260 Temperature (°C) 3°C/s max ramp up 6°C/s max ramp down 217 60~150 s 200 150 60~180 s 25 480 s max Time (sec) PACKAGING parameter conditions/description min reel storage at relative humidity