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110110064

110110064

  • 厂商:

    SEEED(矽递科技)

  • 封装:

    -

  • 描述:

    110110064

  • 数据手册
  • 价格&库存
110110064 数据手册
    Toybrick RK3399Pro AI Development Kit 3G+16GB SKU 110110064       Description    The TB‐RK3399Pro development board is equipped with the super‐performance AI processor RK3399Pro, which has superior general‐purpose computing performance. It equips ARM big.LITTLE architecture, dual‐core Cortex‐A72 + quad‐core Cortex‐A53, with technical leadership in overall performance and power consumption; quad‐core ARM high‐ end GPU Mali‐T860, integrates multiple bandwidth compression technology, providing overall excellent performance. Its on‐chip NPU (Neural Network Processor) offers up to 3.0TOPs computing power. The TB‐RK3399Pro development board has rich external interfaces, including 4 lanes PCIE and Mini PCIE, dual high‐speed USB3.0 port Type‐C + USB3.0 Type‐A, dual MIPI CSI and dual ISP with pixel processing capability up to 1300W pixels, and HDMI2.1, DP1.2, MIPI‐DSI and EDP; it also supports 8‐channel digital microphone array input. On the software side, TB‐RK3399Pro is pre‐installed Android and Linux system, support dual system boot and one‐button OS switching. integrated rich AI application development components, providing friendly and concise application programming interface, seamless docking NPU to achieve AI computing hardware acceleration, support Various model inferences such as TensorFlow/TensorFlow lite/Caffe. Specification SoC: Rockchip RK3399Pro (NPU built‐in) NPU: Support 8‐bit/16‐bit Inference Deep Learning: Support TensorFlow/Caffe Model CPU: Dual Cortex‐A72 +Quad Cortex‐A53,64‐bit CPU Frequency: up to 1.8GHz GPU: Mali‐T860MP4 GPU Memory: 3GB LPDDR3 EMMC: 16GB eMMC Support: SIM Card, TF Card USB: 2 x USB 2.0 Host, 1 x USB 3.0 Host, 1 x USB 3.0 Type‐C Dual OS: Android 8.0 & Fedora 28 RK3399Pro Dual‐core Cortex‐A72 up to 1.8GHz; Quad‐core Cortex‐A53 up to 1.4GHz NPU up to 3.0TOPS Mali‐T860MP4 GPU Dual‐channel DDR3/DDR3L/LPDDR3/LPDDR4 4K UHD H265/H264/VP9 HDR10/HLG H264 encoder Dual MIPI CSI and ISP USB Type‐C and USB 2.0 CPU Big.Little architecture: Dual Cortex‐A72 + Quad Cortex‐A53, 64‐bit CPU Frequency is up to 1.8GHz NPU Support 8‐bit/16‐bit Inference Support TensorFlow/Caffe Model GPU Mali‐T860MP4 GPU, OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11 Supports AFBC (ARM Frame Buffer Compression) Memory 3GB/6GB LPDDR3 Support eMMC 5.1 with HS400, SDIO 3.0 with HS200 Multi‐ Media 4K VP9 and 4K 10bits H265/H264 video decoders, up to 60fps 1080P other video decoders (VC‐1, MPEG‐1/2/4, VP8) 1080P video encoders for H.264 and VP8 Video post processor: de‐interlace, de‐noise, enhancement for edge/detail/color Display Dual VOP: one supports 4096x2160 with AFBC supported; the other supports 2560x1600 Dual channel MIPI‐DSI (4 lanes per channel) eDP 1.3 (4 lanes with 10.8Gbps) to support display, with PSR HDMI 2.0 for 4K 60Hz with HDCP 1.4/2.2 DisplayPort 1.2 (4 lanes, up to 4K 60Hz) Supports Rec.2020 and conversion to Rec.709 Interface Dual 13M ISP and dual channel MIPI CSI‐2 receive interface USB 3.0 with type‐C supported PCIe 2.1 (4 full‐duplex lanes) Embedded low power MCU for other application 8 channels I2S supports 8 channels RX or 8 channels TX Shipping list: 1 x TB‐RK3399Pro development board with Heatsink (3G+16G eMMC) 1 x Acrylic case with screws 1 x 12V‐2A power supply 1 x Type C cable ECCN/HTS ECCN  5A002.a.1  HSCODE                https://www.seeedstudio.com/Toybrick‐RK3399Pro‐AI‐Development‐Kit‐3G‐16GB‐p‐4037.html/6‐13‐19 
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