ISP1807
Data Sheet
Built-in Antenna Low Energy Module
BT 5 Long Range, Zigbee, Thread, ANT+
This ultra-small LGA module, 8 x 8 x 1 mm, is based on the
nRF52840 Chip. Its powerful Cortex™ M4 CPU, flash and RAM
memory combined with an optimized antenna offers the
perfect solution for Bluetooth connectivity. The solution is
best in class for RF performance and low power
consumption. Long range and multiple digital and analogue
interfaces give optimum flexibility for sensor integration.
Key Features
Applications
▪ 2.4GHz Ultra Low Power RF Transceiver
▪ Full Bluetooth 5 – long range stack
ANT/ANT+ stack
2.4 GHz proprietary stack
▪ Advanced Wearables: watches, fitness
devices, wireless payment wearables,
connected health, augmented reality
applications …
▪ BT Mesh, Zigbee, Thread stacks available
▪ Smart Home sensors and controllers
▪ NFC-A Tag for OOB pairing
▪ Industrial IoT sensors and controllers
▪ Fully integrated RF matching and Antenna
▪ Advanced remote controls
▪ Integrated 32 MHz& 32kHZ Clock
▪ Remote &Gaming controllers
▪ DC/DC converter with loading circuit
▪ Beacons
▪ Based on Nordic Semiconductor nRF52
▪ 32-bit ARM Cortex M4F CPU
▪ ARM CryptoCell 310
Certifications
▪ 1 MB Flash / 256 kB SRAM
▪ Configurable 46 GPIOs including 8 ADC
▪ Bluetooth SIG certified
▪ Many interfaces USB, SPI, UART, PDM, I2C
▪ CE certified
▪ Power supply 1.7 to 3.6V, USB supply 5V
▪ FCC, IC certified
▪ Very small size 8.0 x 8.0 x 1.0 mm
▪ TELEC, KCC certified
▪ Temperature -40 to +85 °C
▪ RoHS and Reach compliant
▪ Pin to Pin compatible with ISP1507
▪ Conflict Mineral Declaration
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The information contained in this document is the
property of Insight SiP and should not be disclosed
to any third party without written permission.
Specification subject to change without notice.
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ISP1807
Data Sheet
Revision History
Revision
Date
Ref
Change Description
R0
23/11/2017
cr pg
Preliminary release
R1
12/12/2017
cr pg
Engineering samples release
R2
20/04/2018
cr pg
Section 5.2 – FW tool correction and update
Section 6.5 – Extension name change
R3
22/08/2018
cr pg
Section 3 – Typo error correction
R4
12/12/2018
cr pg
Section 2.9 – Schematic updated
R5
18/02/2019
cr pg
Definitive release
R6
14/03/2019
cr pg
Correction VCC / VCCH
No High-Power Mode availability
R7
06/06/2019
mm pg
Change to MSL3
R8
08/11/2019
mm pg
Section 4.1 – Mechanical dimension precision
Section 8 – Certification list update
R9
17/04/2020
cb pg
Section 4.2 – Assembly guideline precisions
Section 8 – Certification list update
R10
03/05/2021
Vn pg
Section 8 – Certification list update
R11
29/04/2022
pd pg
Document layout update
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ISP1807
Data Sheet
Contents
1.
Block Diagram ............................................................................................................................................ 4
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
2.8.
2.9.
Specifications ............................................................................................................................................. 5
Important Notice................................................................................................................................. 5
Absolute Maximum Ratings ............................................................................................................... 5
Operating Conditions ......................................................................................................................... 5
Power Consumption........................................................................................................................... 6
Clock Sources .................................................................................................................................... 6
Radio Specifications .......................................................................................................................... 6
Range Measurement ......................................................................................................................... 7
Antenna Performance ........................................................................................................................ 7
Electrical Schematic........................................................................................................................... 9
3.
Pin Description ......................................................................................................................................... 10
4.
4.1.
4.2.
4.3.
Mechanical Outlines ................................................................................................................................ 13
Mechanical Dimensions ................................................................................................................... 13
SMT Assembly Guidelines............................................................................................................... 15
Antenna Keep-Out Zone .................................................................................................................. 15
5.
5.1.
5.2.
5.3.
Product Development Tools .................................................................................................................. 16
Hardware .......................................................................................................................................... 16
Firmware .......................................................................................................................................... 16
Development Tools .......................................................................................................................... 17
6.
6.1.
6.2.
6.3.
6.4.
6.5.
Packaging & Ordering information ....................................................................................................... 18
Marking ............................................................................................................................................ 18
Prototype Packaging ........................................................................................................................ 18
Jedec Trays...................................................................................................................................... 18
Tape and Reel ................................................................................................................................. 19
Ordering Information ........................................................................................................................ 20
7.
7.1.
7.2.
7.3.
Storage & Soldering information .......................................................................................................... 21
Storage and Handling ...................................................................................................................... 21
Moisture Sensitivity .......................................................................................................................... 21
Soldering information ....................................................................................................................... 22
8.
8.1.
8.2.
8.3.
8.4.
8.5.
8.6.
8.7.
Quality & User information ..................................................................................................................... 23
Certifications .................................................................................................................................... 23
USA – User information ................................................................................................................... 23
Canada – User information .............................................................................................................. 24
RF Exposure Information ................................................................................................................. 24
Informations concernant l'exposition aux fréquences radio (RF).................................................... 24
Discontinuity ..................................................................................................................................... 24
Disclaimer ........................................................................................................................................ 25
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property of Insight SiP and should not be disclosed to
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ISP1807
Data Sheet
1.
Block Diagram
This module is based on nRF52840 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, an ARM ®Cortex® -M4 32-bit processor with 64 MHz FPU,
a 1 MB flash memory, a 256 kB RAM and analog and digital peripherals.
It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic
Semiconductor.
Fully qualified BLE stacks for nRF52840 are implemented in the S140 SoftDevices which can be freely
downloaded. ISP1807 can then be used in Bluetooth Central, Peripheral, Observer or Broadcaster role
with up to 20 connections and for both ends of other proprietary protocols. nRF52840 platform also
provides extensive software support for ANT, ZIGBEE and THREAD applications.
Ultra-low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 1.0 mm, the module integrates
decoupling capacitors, 32 MHz and 32.768 kHz crystals, load capacitors, DC-DC converter, RF matching
circuit and antenna in addition to the wireless SoC.
Only the addition of a suitable DC power source is necessary for BLE / ANT / ZIGBEE / THREAD
connectivity. Sensor applications require the further addition of appropriate sensors. The antenna was
designed to be optimized with several standard ground plane sizes. The NFC tag antenna can be
connected externally.
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property of Insight SiP and should not be disclosed to
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ISP1807
Data Sheet
2.
Specifications
2.1. Important Notice
The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for the nRF52840 chipset. Bellow information is only a summary of the main parameters. For more detailed
information, especially about current consumption, please refer to the up-to-date specification of the
chipset available on Nordic Semi website.
2.2. Absolute Maximum Ratings
Parameter
Min
Main Supply Voltage respect to ground – VCC_nRF
Max
Unit
-0.3
3.9
V
USB Supply Voltage respect to ground – VBUS
-0.3
5.8
V
IO Pin Voltage
-0.3
3.9
V
RF Input Level
10
dBm
NFC Antenna pin current
80
mA
+125
°C
Moisture Sensitivity Level
5
-
ESD Human Body Model
4000
V
ESD Charged Device Model
750
V
10000
cycles
Storage Temperature
Typ
-40
Flash Endurance
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.3. Operating Conditions
Parameter
Min
Typ
Max
Unit
VCC_nRF Supply Voltage, independent of DCDC enable
1.7
3.0
3.6
V
VBUS Supply Voltage
4.35
5.0
5.5
V
Extended Industrial Operating Temperature Range
-40
+25
+85
°C
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ISP1807
Data Sheet
2.4. Power Consumption
Parameter
Min
Typ
Max
Unit
Peak Current, Transmitter +8 dBm, VCC 3V + DCDC
16.4
mA
Peak Current, Transmitter 0 dBm, VCC 3V + DCDC
6.4
mA
Peak Current, Receiver 1 Mbps, VCC 3V + DCDC
6.26
mA
System OFF, no RAM retention
0.4
µA
System ON, no RAM retention, wake on RTC
1.5
µA
Additional RAM retention current per 4 KB block
30
N
nA
Typ
Max
Unit
Internal High Frequency Clock for RF Stability:
32 MHz Crystal Frequency Tolerance (1)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
32.768 kHz Crystal Frequency Tolerance (1)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator (2)
+/- 250
ppm
RF Frequency Tolerance for BLE Operation
+/- 40
ppm
Max
Unit
2480
Mhz
+8.5
dBm
2.5. Clock Sources
Parameter
(1)
(2)
Min
including initial tolerance, drift, aging, and frequency pulling
Frequency tolerance after calibration
2.6. Radio Specifications
Parameter
Min
Frequency Range
2402
Typ
Maximum Output Power
+8
Rx Sensitivity Level, BLE1 Mbps
-95
dBm
Rx Sensitivity Level, BLE Long Range 125 kbps
-103
dBm
Antenna Gain
0.6
dBi
EIRP
Data Rate
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-19.4
8.6
dBm
125
2000
kbps
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property of Insight SiP and should not be disclosed to
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Specification subject to change without notice.
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ISP1807
Data Sheet
2.7. Range Measurement
Range measurement between ISP1807-LR test board (configured as Central) and ISP1807-LR test
board (configured as Peripheral).
Parameter
Min
Typ
Max
Unit
Range Open field @1m height (0 dBm, 1 Mbps)
150
m
Range Open field @1m height (0 dBm, 125 Kbps)
175
m
Range Open field @1m height (8 dBm, 1 Mbps)
230
m
Range Open field @1m height (8 dBm, 125 Kbps)
450
m
2.8. Antenna Performance
Typical Antenna Return Loss
Module mounted on a
USB dongle ground plane
Radiation Pattern in 3 planes
Module mounted on a USB
dongle ground plane
Gain measurement
in dBi in the BLE band
from 2.4 to 2.5 GHz.
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ISP1807
Data Sheet
Ground Plane Effect Simulation
USB dongle
ground plane
(size: 18 x 30 mm²)
Cell phone config 1
ground plane
(size: 40 x 100 mm²)
Cell phone config 2 with
side ground plane
(size: 40 x 100 mm²)
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Cell phone config 1 with
side ground plane
(size: 40 x 100 mm²)
Cell phone config 3 with
side ground plane
(size: 40 x 100 mm²)
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Specification subject to change without notice.
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ISP1807
Data Sheet
2.9. Electrical Schematic
Electrical schematic showing
ISP1807 module connections
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ISP1807
Data Sheet
3.
Pin Description
The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads on
the application PCB for mechanical stability and reliability (drop test).
Pin
Name
Pin function
Description
1
2
Ground
Digital I/O
NFC Input
Digital I/O
14
15
16
17
18
19
20
VSS
P0_09
NFC1
P0_12
TRACEDATA1
P0_10
NFC2
P0_14
P0_26
VSS
D+
P0_16
DP0_21
VBUS
P0_18
RESET
VSS
P0_20
VSS
P0_22
VSS
P0_24
OUT_ANT
21
22
VSS
OUT_MOD
Ground
Antenna I/O
23
24
25
26
27
28
29
30
31
32
33
VSS
VSS
VSS
VCC_nRF
P0_17
SWDIO
P0_13
SWDCLK
VSS
P0_08
P0_07
TRACECLK
Ground
Ground
Ground
Power
Digital I/O
Digital I/O
Digital I/O
Digital Input
Ground
Digital I/O
Digital I/O
Should be connected to ground plane on application PCB
General purpose I/O pin
NFC antenna connection
General purpose I/O pin
Trace port output
General purpose I/O pin
NFC antenna connection
General purpose I/O pin
General purpose I/O pin
Should be connected to ground plane on application PCB
USB D+
General purpose I/O pin
USB DGeneral purpose I/O pin
5V input for USB 3.3V regulator
General purpose I/O pin
Configurable as system RESET pin
Should be connected to ground plane on application PCB
General purpose I/O pin
Should be connected to ground plane on application PCB
General purpose I/O pin
Should be connected to ground plane on application PCB
General purpose I/O pin
This pin is connected to the internal antenna
It should be connected to Pin 22 OUT_MOD for normal operation
Should be connected to ground plane on application PCB
This pin is the RF I/O pin of the BLE module
It should be connected to Pin 20 OUT_ANT for normal operation
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
Power supply (1.7 – 3.6V)
General purpose I/O pin
Serial Wire Debug I/O for debug and programming
General purpose I/O pin
Serial Wire Debug clock input for debug and programming
Should be connected to ground plane on application PCB
General purpose I/O pin
General purpose I/O pin
Trace port clock output
3
4
5
6
7
8
9
10
11
12
13
Digital I/O
NFC Input
Digital I/O
Digital I/O
Ground
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Power
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Ground
Digital I/O
Antenna I/O
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ISP1807
Data Sheet
Pin
Name
Pin function
Description
34
35
P0_06
P0_04
AIN2
P0_05
AIN3
P0_15
P0_03
AIN1
P0_27
P0_02
AIN0
P0_25
P0_31
AIN7
P0_11
TRACEDATA2
P0_30
AIN6
P0_19
P0_29
AIN5
P0_23
P0_28
AIN4
P1_02
P1_06
P1_15
P1_14
P1_13
P1_05
P1_08
P1_09
TRACEDATA3
P1_00
TRACEDATA0
P1_03
P1_12
P1_10
P1_11
P1_07
P1_04
P1_01
NC
Digital I/O
Digital I/O
Analog Input
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
Trace port output
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
SAADC/COMP/LPCOMP input
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
Trace port output
General purpose I/O pin
Trace port output
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
to 78
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Analog Input
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Not Connected
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ISP1807
Data Sheet
ISP1807
pad placement and pin assignment
for the LGA QFN package
TOP VIEW
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ISP1807
Data Sheet
4.
Mechanical Outlines
4.1. Mechanical Dimensions
Package dimensions
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ISP1807
Data Sheet
Dimensional drawing for 62-Pad LGA Package
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ISP1807
Data Sheet
4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the same dimensions as
module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.
For implementations in which most or all of the inner pads are used Insight SiP recommends the use of
capped vias placed in the centre of each pad.
For standard PCB types (no micro vias - all vias are top to bottom): we use nominal 0.4mm catch pads
with 0.2mm vias. The vias should be plugged and capped to avoid solder wicking.
For HDI PCB types having micro vias on a layer by layer basis: we use 0.25mm catch pads and 0.1mm
copper filled laser vias. Ideally the via is centered in the pad.
For reduced pinout implementations we recommend using external pads only. The use of a small number
of internal pads can be accommodated by placing normal vias in the centre of the device. In this case only
the required pads should be Solder Mask opened and the vias tented with solder mask to prevent short
circuits.
In general, we recommend NSMD solder mask with 50µm SM extension.
4.3. Antenna Keep-Out Zone
For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of the
board: no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.
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ISP1807
Data Sheet
5.
Product Development Tools
5.1. Hardware
In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1807, Insight SIP
offers a Development Kit containing:
One Interface Board
J-Link Lite CortexM-9 JTAG/SWD Emulator
One Test Board
A Development Dongle
5 ISP1807 module samples
Cables, power supply and coin battery holder
Using this development kit, product developers can use a working solution as starting point to develop
their own products. Time to market is saved by avoiding starting from a blank sheet of paper. In addition,
there may be some applications that use the hardware as is.
Please refer to the documentation for more information:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf
5.2. Firmware
ISP1807supports Bluetooth Low Energy protocol stacks. It also provides extensive software support for
ANT, ZIGBEE and THREAD applications as well as 2.4 GHz protocol stacks, including Gazell. All are
available as downloads at www.nordicsemi.com.
The S140 SoftDevice is a Bluetooth low energy (BLE) Central and Peripheral protocol stack solution.
The S140 SoftDevice supports up to twenty connections with an additional observer and a broadcaster
role all running concurrently.
The S140 SoftDevice integrates a Bluetooth low energy Controller and Host, and provides a full and
flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions:
- Bluetooth 5.0 compliant low energy single-mode protocol stack suitable for Bluetooth low energy
products.
- Concurrent central, observer, peripheral, and broadcaster roles with up to 20 concurrent connections
along with one Observer and one Broadcaster.
- Link layer supporting LE 1M PHY and LE 2M PHY.
- LL Privacy.
- LE Data Packet Length Extension.
- LE Secure Connections pairing model
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ISP1807
Data Sheet
5.3. Development Tools
The following development tools and software are recommended for using and testing ISP1807 module:
Nordic Semiconductor nRFgo Studio:
Downloadable after registering at www.nordicsemi.com.
Nordic Semiconductor Master Control Panel:
Downloadable after registering at www.nordicsemi.com.
Keil MDK-ARM Lite:
Downloadable from https://www.keil.com/demo/eval/arm.htm.
Segger J-Link Lite:
Downloadable from http://www.segger.com/jlink-software.html.
nRF52 Software Development Kit (SDK):
nRF52 SDK can be downloaded after registering at www.nordicsemi.com. It contains example of source
codes applications (C language):
- Precompiled HEX files
- Source code
- Keil ARM project files
- IAR project files
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The information contained in this document is the
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ISP1807
Data Sheet
6.
Packaging & Ordering information
6.1. Marking
M /N :
I
S P 1 8 0 7
T T
Y Y W W R
ISP1807
YY
Part Number
2 letters Module Type (see
section 6.5)
2 digits year number
WW
2 digits week number
R
1 letter Hardware revision
TT
6.2. Prototype Packaging
For engineering samples and prototype quantities
up to 99 units, deliveries are provided in thermoformed
trays or cut tapes.
They are delivered in sealed pack with desiccant
pack and humidity sensors. Please see section 7.2
for more information on moisture sensitivity.
Please order with “ST” code packaging suffix.
6.3. Jedec Trays
For pre-production volumes, ISP1807 are available in Jedec trays. They are delivered in sealed pack with
desiccant pack and humidity sensors. These Jedec trays are also suitable for further baking. Please see
section 7.2 for more information on moisture sensitivity. Please order with “JT” code packaging suffix.
Refer to tray sizes below. Complete information on Jedec trays is available on request.
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ISP1807
Data Sheet
Top view position of
modules within the tray.
6.4. Tape and Reel
ISP1807 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and
humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units
(330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for
2000-unit reels.
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The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1807_R11.docx
Page 19/25
ISP1807
Data Sheet
Top view position of modules within the reel.
6.5. Ordering Information
I S P 1 8 0 7
- T
▼
▼
▼
T - Z Z
▼
▼ ▼
▼
▼ ▼
▼
▼ ▼
I S P 1 8 0 7
Part Number
- L R
Long range version
- E B
Evaluation Board(1)
- T B
Test board (1)
- S T
Standard Tray or Cut Tape
-
Jedec Tray Packaging
J T
- R S
Reel of 500 units
- R 2
Reel of 2000 units
(1) Please see section 5.1 and refer to the following documentation for more information on development
kit and test board:
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_DS1807_DK.pdf
http://www.insightsip.com/fichiers_insightsip/pdf/ble/ISP1807/isp_ble_ANXXXXX.pdf
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
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isp_ble_DS1807_R11.docx
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ISP1807
Data Sheet
7.
Storage & Soldering information
7.1. Storage and Handling
Keep this product away from other high frequency devices which may interfere with operation such as
other transmitters and devices generating high frequencies.
Do not expose the module to the following conditions:
- Corrosive gasses such as Cl2, H2S, NH3, SO2, or NOX
- Extreme humidity or salty air
- Prolonged exposure to direct Sunlight
- Temperatures beyond those specified for storage
Do not apply mechanical stress
Do not drop or shock the module
Avoid static electricity, ESD and high voltage as these may damage the module
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
7.2. Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient temperature.
Any absorbed moisture is quickly turned into superheated steam. This sudden change in vapor pressure
can cause the package to swell. If the pressure exerted exceeds the flexural strength of the plastic mold
compound, then it is possible to crack the package. Even if the package does not crack, interfacial
delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product before
assembly. The baking process for dry packing is 24 hours at 125°C.
ISP1807 has been tested MSL-3 according to standards. After baking, modules can be exposed to ambient
room conditions (approximately 30 °C/60%RH) during 168 hours before assembly on the PCB.
CAUTION
MOISTURE
SENSITIVE DEVICES
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
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ISP1807
Data Sheet
7.3. Soldering information
Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
Preheat/Soak
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from (Tsmin to Tsmax)
Ramp-up rate (TL to Tp)
Liquidous temperature (TL)
Time (tL) maintained above TL
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150 °C
200 °C
60-120 sec
3 °C/sec max
217 °C
60-150 sec
Peak package body temperature (T p)
Classification Temperature (Tc)
Time (tp) maintained above TC-5 °C
Ramp-down rate (Tp to TL)
Time 25 °C to peak temperature
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
260°C
(+0/-5°C)
260 °C
30 sec
6 °C/sec max
8 mn max
Document reference
isp_ble_DS1807_R11.docx
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ISP1807
Data Sheet
8.
Quality & User information
8.1. Certifications
All below certificates can be downloaded on the website:
Bluetooth SIG Declaration ID n° D046560
CE Certified, DoC Insight SiP Ref TR201105
TELEC Certified, n° 020-200037
KCC Certification n° R-C-iNs-ISP1807
FCC Certification n° 2AAQS-ISP1807
IC Certification n° 11306A-ISP1807
RoHS3 and Reach compliant, Ref TR200301 and TR191101
Conflict Mineral Declaration available, Ref TR180701
To support customers in their application certification, Insight SiP can provide test reports on request.
8.2. EC – CE Certification
This device can be operated in at least one Member State without infringing applicable requirements on
the use of radio spectrum.
8.3. USA – User information
This intends to inform how to specify the FCC ID of our module “ISP1807” on the product. Based on the
Public Notice from FCC, the host device should have a label which indicates that it contains our module.
The label should use below example wording or any similar wording that expresses the same meaning:
“Contains FCC ID: 2AAQS-ISP1807”
The label of the host device should also include the below FCC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions.
(1) This device may not cause harmful interference
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Caution: Any Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.”
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
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ISP1807
Data Sheet
8.4. Canada – User information
This intends to inform how to specify the IC ID of our module “ISP1807” on the product. According to
Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that
it contains our module. The label should use below example wording or any similar wording that expresses
the same meaning:
“Contains IC: 11306A-ISP1807”
The label of the host device should also include the below IC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.”
8.5. RF Exposure Information
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment
and meets the FCC radio frequency (RF)Exposure Guidelines in Supplement C toOET65 and RSS-102 of
the IC radio frequency (RF) Exposure rules. This equipment has very low levels of RF energy that it
deemed to comply without maximum permissive exposure evaluation (MPE).
8.6. Informations concernant l'exposition aux fréquences radio (RF)
La puissance de sortie émise par l’appareil de sans-fil est inférieure à la limite d'exposition aux fréquences
radio d'Industry Canada (IC). Ce module a également été évalué et démontré conforme aux limites
d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles et/ou portables.
8.7. Discontinuity
Normally a product will continue to be manufactured as long as all of the following are true:
- The manufacturing method is still available.
- There are no replacement products.
- There is demand for it in the market.
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
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ISP1807
Data Sheet
In case of obsolescence, Insight SiP will follow Jedec Standard JSD-48. A Product Discontinuation Notice
(PDN) will be sent to all distributors and made available on our website. After this, the procedure goes as
follows:
- Last Order Date will be 6 months after the PDN was published.
- Last Shipment Date will be 6 months after Last Order Date, i.e. 12 months after PDN.
8.8. Disclaimer
Insight SiP’s products are designed and manufactured for general consumer applications, so testing and
use of the product shall be conducted at customer’s own risk and responsibility. Please conduct validation
and verification and sufficient reliability evaluation of the products in actual condition of mounting and
operating environment before commercial shipment of the equipment. Please also pay attention (i) to apply
soldering method that don’t deteriorate reliability, (ii) to minimize any mechanical vibration, shock,
exposure to any static electricity, (iii) not to overstress the product during and after the soldering process.
The products are not designed for use in any application which requires especially high reliability where
malfunction of these products can reasonably be expected to result in personal injury or damage to the
third party's life, body or property, including and not limited to (i) aircraft equipment, (ii) aerospace
equipment, (iii) undersea equipment, (iv) power plant control equipment, (v) medical equipment,
(vi) transportation equipment, (vii) traffic signal equipment, (viii) disaster prevention / crime prevention
equipment.
The only warranty that Insight SiP provides regarding the products is its conformance to specifications
provided in datasheets. Insight SiP hereby disclaims all other warranties regarding the products, express
or implied, including without limitation any warranty of fitness for a particular purpose, that they are defectfree, or against infringement of intellectual property rights. Insight SiP customers agree to indemnify and
defend Insight SiP against all claims, damages, costs and expenses that may be incurred, including without
any limitation, attorney fees and costs, due to the use of products.
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
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