ISP1507
Data Sheet
Bluetooth 5.0 Low Energy Module
Supporting Mesh, ANT, NFC
With built-in MCU & Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on the
nRF52 Chip. Its powerful Cortex™ M4 CPU, flash and RAM
memory combined with an optimized antenna offers the
perfect solution for Bluetooth connectivity. The solution is
best in class for RF performance and low power consumption.
Multiple digital and analogue interfaces give optimum
flexibility for sensor integration.
Key Features
Applications
▪ Multi-protocol 2.4GHz Ultra Low Power
RF Transceiver based on
Nordic Semiconductor nRF52
▪ Bluetooth 5.0 & Mesh
ANT
2.4 GHz proprietary protocol
▪ Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
▪ NFC-A Tag for OOB pairing in option
▪ IoT applications, connected objects
▪ Wearable technology
▪ Home automation
▪ Beacons
▪ Fully integrated RF matching and Antenna
▪ Integrated 32 MHz & 32kHZ Clock in option
▪ DC/DC converter with loading circuit
▪ 32-bit ARM Cortex M4 CPU
▪ 512 kB Flash and 64 kB SRAM
or 192 kB Flash and 24 kB SRAM variants
▪ From 10 to 30 configurable GPIOs including
from 2 to 8 ADCs
▪ Interfaces SPI, I2C, UART, PWM, PDM
▪ Single 1.7 to 3.6 V supply
▪ Very small size 8.0 x 8.0 x 0.95 mm
▪ Temperature -40 to +85 °C
www.insightsip.com
Certifications
▪ Fully FCC certified module
▪ Fully CE certified module
▪ Fully IC certified module
▪ Fully TELEC certified module
▪ Bluetooth SIG certified QDL listing
▪ RoHS compliant
The information contained in this document is the
property of Insight SiP and should not be disclosed
to any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 1/31
ISP1507
Data Sheet
Document Revision History
Revision
Date
Ref
Change Description
R0
15/02/2016
cr pg
Preliminary release
R1
16/06/2016
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RF specification update
R2
19/10/2016
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Marking update + schematic CIAA
R3
17/11/2016
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Marking update + RF exposure for FCC/IC
R4
24/11/2016
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Pin description update
R5
04/01/2017
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Current consumption update
R6
16/01/2017
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Bluetooth version update
R7
05/10/2017
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Reference design addition
R8
22/01/2018
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Max capacitance & inductance specification
R9
12/05/2018
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Addition of AL variant
R10
09/07/2018
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AL variant specification update
R11
19/10/2018
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Supply voltage update
R12
14/12/2018
cr pg
Electrical spec update + new reference design
R13
16/10/2019
mm pg
Upgrade to MSL 3
R14
15/10/2020
ys pg
Addition of AC variant + Power consumption update
R15
26/01/2022
cb pg
Certification list update
R16
18/02/2022
ys pg
Marking evolution
R17
13/04/2022
cb pg
Removal of AC variant + Certification list update
R18
29/04/2022
pd pg
Document layout update
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 2/31
ISP1507
Data Sheet
Contents
1.
2.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
3.
4.
4.1.
4.2.
4.3.
5.
5.1.
5.2.
5.3.
6.
6.1.
6.2.
7.
7.1.
7.2.
7.3.
7.4.
7.5.
8.
8.1.
8.2.
8.3.
9.
9.1.
9.2.
9.3.
9.4.
9.5.
9.6.
9.7.
Block Diagram & Features................................................................................................................................... 4
Specifications........................................................................................................................................................ 6
General Notice ............................................................................................................................................ 6
Absolute Maximum Ratings......................................................................................................................... 6
Operating Conditions................................................................................................................................... 6
Power Consumption .................................................................................................................................... 7
Clock Sources ............................................................................................................................................. 7
Radio Specifications .................................................................................................................................... 7
Electrical Schematic .................................................................................................................................. 10
Pin Description.................................................................................................................................................... 13
Mechanical Outlines ........................................................................................................................................... 15
Mechanical Dimensions ............................................................................................................................ 15
SMT Assembly Guidelines ........................................................................................................................ 16
Antenna Keep-Out Zone ........................................................................................................................... 16
Product Development Tools.............................................................................................................................. 17
Hardware................................................................................................................................................... 17
Firmware ................................................................................................................................................... 17
Development Tools ................................................................................................................................... 19
Reference Designs ............................................................................................................................................. 20
Beacon Design .......................................................................................................................................... 20
Sensor Board Design ................................................................................................................................ 21
Packaging & Ordering information................................................................................................................... 24
Marking ..................................................................................................................................................... 24
Prototype Packaging ................................................................................................................................. 24
Jedec Trays............................................................................................................................................... 24
Tape and Reel........................................................................................................................................... 25
Ordering Information ................................................................................................................................. 26
Storage & Soldering information ...................................................................................................................... 27
Storage and Handling................................................................................................................................ 27
Moisture Sensitivity ................................................................................................................................... 27
Soldering information ................................................................................................................................ 28
Quality & User information ................................................................................................................................ 29
Certifications ............................................................................................................................................. 29
USA – User information............................................................................................................................. 29
Canada – User information ....................................................................................................................... 30
RF Exposure Information .......................................................................................................................... 30
Informations concernant l'exposition aux fréquences radio (RF) ............................................................... 30
Discontinuity .............................................................................................................................................. 30
Disclaimer ................................................................................................................................................. 31
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 3/31
ISP1507
Data Sheet
1.
Block Diagram & Features
This module is based on nRF52 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC)
integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4 CPU, flash and RAM memory, and analog
and digital peripherals.
It can support BLE, Mesh, ANT and a range of proprietary 2.4 GHz protocols, such as ShockBurst. Fully
qualified stacks for nRF52 are freely available for operating in Central role, Peripheral role, Scanning and
Advertising.
Ultra-low power consumption and advanced power management enables battery lifetimes up to several
years on a coin cell battery. Even though its very small size 8 x 8 x 0.95 mm, the module integrates, in
addition to the wireless SoC, all required decoupling and load capacitors, DC-DC converter, 32 MHz
crystal, 32.768 kHz optional crystal , RF matching circuit and antenna.
Only the addition of a suitable DC power source is necessary for module connectivity. Sensor
applications require the further addition of appropriate sensors. The antenna was designed to be
optimized with several standard ground plane sizes. When NFC function is available, the NFC tag
antenna can be connected externally.
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 4/31
ISP1507
Data Sheet
The main features versus the different variants are described in the table below.
Module Type
iSP1507-AC
iSP1507-AL
iSP1507-AX
Specification
Features
Other protocol
Tx Power
Data rate
SoftDevice
Processor
Flash / RAM
GPIOs
ADCs
SPI
NFC tag
USB
Other
Power Supply
Crystals
Size (mm)
Temperature
BT 5.0
BLE
+4 dBm
2 Mbps
S112/S113
32-bit ARM Cortex M4
192 kB / 24 kB
10
2
Yes
No
No
UART, PWM, PDM
1.7-3.6 V + LDO/DCDC
32 MHz
8 x 8 x 0.95
85°C
BT 5.0
BLE
ANT
+4 dBm
2 Mbps
S112/S113
32-bit ARM Cortex M4
192 kB / 24 kB
13
3
Yes
No
No
UART, PWM, PDM
1.7-3.6 V + LDO/DCDC
32 MHz & 32 kHz
8 x 8 x 0.95
85°C
BT 5.0
BLE & Mesh
ANT
+4 dBm
2 Mbps
S112/S113/S132
32-bit ARM Cortex M4F
512 kB / 64 kB
30
8
Yes
Yes
No
UART, PWM, PDM
1.7-3.6 V + LDO/DCDC
32 MHz & 32 kHz
8 x 8 x 0.95
85°C
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 5/31
ISP1507
Data Sheet
2.
Specifications
2.1. General Notice
The electrical specifications of the module are directly related to the Nordic Semiconductor specifications
for nRF52 chipset series. Bellow information is only a summary of the main parameters. For more detailed
information, especially about current consumption, please refer to the up-to-date specification of the
chipset available on Nordic Semi website.
2.2. Absolute Maximum Ratings
Parameter
Min
Supply Voltage respect to ground - VCC
IO Pin Voltage
Max
Unit
-0.3
3.9
V
-0.3
3.9
V
RF Input Level
10
dBm
NFC Antenna pin current
80
mA
Module Total Capacity
2.5
µF
Module Total Inductance
15
µH
+125
°C
Moisture Sensitivity Level
5
-
ESD Human Body Model
4000
V
ESD Charged Device Model
750
V
10000
cycles
Storage Temperature
Typ
-40
Flash Endurance
ATTENTION
CONSERVE PRECAUTIONFOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
Human Body Model Class 3A
2.3. Operating Conditions
Parameter
Min
Typ
Max
Unit
Operating Supply Voltage, independent of DCDC enable
1.7
3.0
3.6
V
Extended Industrial Operating Temperature Range
-40
+25
+85
°C
www.insightsip.com
The information contained in this document is the
property of Insight SiP and should not be disclosed to
any third party without written permission.
Specification subject to change without notice.
Document reference
isp_ble_DS1507_R18.docx
Page 6/31
ISP1507
Data Sheet
2.4. Power Consumption
Typ
AC variant
Typ
AL variant
Typ
AX variant
Unit
6.1
6.1
6.5
mA
3.4
3.4
4.1
mA
5.8
5.8
7.1
mA
System OFF, no RAM retention, wake on reset
0.3
0.3
0.3
µA
System ON, full RAM retention, wake on any event
0.8
0.8
1.5
µA
Additional RAM retention current per 4 KB block
40
40
40
nA
Parameter
Peak current, Receiver active (1)
Peak current, Transmitter active -40 dBm Output Power (2)
Peak current, Transmitter active 0 dBm Output Power
(1)
(2)
(2)
DCDC enable, Power supply 3V, 1 Mbps
DCDC enable, Power supply 3V
2.5. Clock Sources
Parameter
Max
Unit
Internal High Frequency Clock for RF Stability:
32 MHz Crystal Frequency Tolerance (1)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
32.768 kHz Crystal Frequency Tolerance (1) (3)
+/- 40
ppm
Internal Low Frequency Clock for BLE Synchronization:
RC Oscillator (2)
+/- 250
ppm
RF Frequency tolerance:
For BLE operation Channels 0 to 39
+/- 40
ppm
(1)
(2)
(3)
Including initial tolerance, drift, aging, and frequency pulling
Frequency tolerance after calibration
The Low Frequency Clock 32.768 kHz is not present in AC variant
2.6. Radio Specifications
Parameter
Min
Frequency Range
2402
Typ
Channel 0 to 39 Spacing
-20
Rx sensitivity Level for BER
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