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ESP32­WROOM­32 FO NO T RE R CO NE M W M (N EN D RN ES DE D) IG NS D Datasheet Version 3.3 Espressif Systems Copyright © 2022 www.espressif.com About This Document This document provides the specifications for the ESP32-WROOM-32 module. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Note that you need to update your subscription to receive notifications of new products you are not currently subscribed to. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. Not Recommended For New Designs (NRND) Contents 1 Overview 6 2 Pin Definitions 8 2.1 Pin Layout 8 2.2 Pin Description 8 2.3 Strapping Pins 10 3 Functional Description 12 3.1 CPU and Internal Memory 12 3.2 External Flash and SRAM 12 3.3 Crystal Oscillators 12 3.4 RTC and Low-Power Management 13 4 Peripherals and Sensors 14 5 Electrical Characteristics 15 5.1 Absolute Maximum Ratings 15 5.2 Recommended Operating Conditions 15 5.3 DC Characteristics (3.3 V, 25 °C) 15 5.4 Wi-Fi Radio 16 5.5 Bluetooth LE Radio 17 5.5.1 Receiver 17 5.5.2 Transmitter 17 5.6 Reflow Profile 18 6 Schematics 19 7 Peripheral Schematics 20 8 Physical Dimensions 21 9 Recommended PCB Land Pattern 22 10 Related Documentation and Resources 23 Revision History 24 Not Recommended For New Designs (NRND) List of Tables 1 ESP32-WROOM-32 Specifications 6 2 Pin Definitions 8 3 Strapping Pins 10 4 Absolute Maximum Ratings 15 5 Recommended Operating Conditions 15 6 DC Characteristics (3.3 V, 25 °C) 15 7 Wi-Fi Radio Characteristics 16 8 Receiver Characteristics – Bluetooth LE 17 9 Transmitter Characteristics – Bluetooth LE 17 Not Recommended For New Designs (NRND) List of Figures 1 ESP32-WROOM-32 Pin Layout (Top View) 8 2 Reflow Profile 18 3 ESP32-WROOM-32 Schematics 19 4 ESP32-WROOM-32 Peripheral Schematics 20 5 Physical Dimensions of ESP32-WROOM-32 21 6 Recommended PCB Land Pattern 22 Not Recommended For New Designs (NRND) 1 Overview 1 Overview ESP32-WROOM-32 is a powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power coprocessor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I2S and I2C. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth® , Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products even after their release, at minimum cost and effort. Table 1 provides the specifications of ESP32-WROOM-32. Table 1: ESP32­WROOM­32 Specifications Categories Certification Test Items Specifications RF certification See certificates for ESP32-WROOM-32 Wi-Fi certification Wi-Fi Alliance Bluetooth certification BQB Green certification RoHS/REACH Reliablity HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support Center frequency range of operating channel Protocols 2412 ~ 2484 MHz Bluetooth v4.2 BR/EDR and Bluetooth LE specification NZIF receiver with –97 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Not Recommended For New Designs (NRND) Espressif Systems 6 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 1 Overview Categories Items Specifications Audio CVSD and SBC SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, Module interfaces DAC, Two-Wire Automotive Interface (TWAI® ), compatible with ISO11898-1 (CAN Specification 2.0) Hardware On-chip sensor Hall sensor Integrated crystal 40 MHz crystal Integrated SPI flash 4 MB Operating voltage/Power supply 3.0 V ~ 3.6 V Operating current Average: 80 mA Minimum current delivered by power supply Recommended operating ambient temperature range 500 mA –40 °C ~ +85 °C Package size 18 mm × 25.5 mm × 3.10 mm Moisture sensitivity level (MSL) Level 3 Not Recommended For New Designs (NRND) Espressif Systems 7 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 2 Pin Definitions 2 Pin Definitions 2.1 Pin Layout Keepout Zone 1 GND GND 38 2 3V3 IO23 37 3 EN IO22 36 4 SENSOR_VP TXD0 35 5 SENSOR_VN RXD0 34 6 IO34 IO21 33 39 GND 12 IO27 IO16 27 13 IO14 IO4 26 14 IO12 IO0 25 24 28 IO2 IO17 23 IO26 IO15 11 22 29 SD1 IO5 21 IO25 SD0 10 20 30 CLK IO18 19 IO33 CMD 9 18 31 SD3 IO19 17 IO32 SD2 8 16 32 IO13 NC 15 IO35 GND 7 Figure 1: ESP32­WROOM­32 Pin Layout (Top View) 2.2 Pin Description ESP32-WROOM-32 has 38 pins. See pin definitions in Table 2. Table 2: Pin Definitions Name No. Type Function GND 1 P Ground 3V3 2 P Power supply EN 3 I Module-enable signal. Active high. Not Recommended For New Designs (NRND) Espressif Systems 8 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 2 Pin Definitions Name No. Type Function SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0 SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3 IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4 IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 8 I/O IO33 9 I/O IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 13 I/O IO12 14 I/O GND 15 P IO13 16 I/O SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO15 23 I/O IO2 24 I/O IO0 25 I/O IO4 26 I/O IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7 IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER Not Recommended For New Designs (NRND) Espressif Systems 9 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 2 Pin Definitions Notice: * Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: • MTDI • GPIO0 • GPIO2 • MTDO • GPIO5 Software can read the values of these five bits from register ”GPIO_STRAPPING”. During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration by strapping pins. Table 3: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin MTDI Default 3.3 V 1.8 V Pull-down 0 1 Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don’t-care 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin Default U0TXD Active U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave FE Sampling FE Sampling RE Sampling RE Sampling Pin Default FE Output RE Output FE Output RE Output MTDO Pull-up 0 0 1 1 GPIO5 Pull-up 0 1 0 1 Not Recommended For New Designs (NRND) Espressif Systems 10 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 2 Pin Definitions Note: • Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO Slave” after booting. • The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up. The strapping pins need a setup and hold time before and after the EN signal goes high. For details please refer to Section Strapping Pins in ESP32 Datasheet. Not Recommended For New Designs (NRND) Espressif Systems 11 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 3 Functional Description 3 Functional Description This chapter describes the modules and functions integrated in ESP32-WROOM-32. 3.1 CPU and Internal Memory ESP32-D0WDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes: • 448 KB of ROM for booting and core functions. • 520 KB of on-chip SRAM for data and instructions. • 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers’ programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. • The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. – When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. – When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. • External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-WROOM-32 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIOs. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Not Recommended For New Designs (NRND) Espressif Systems 12 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 3 Functional Description 3.4 RTC and Low­Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power Management” in ESP32 Datasheet. Not Recommended For New Designs (NRND) Espressif Systems 13 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 4 Peripherals and Sensors 4 Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to the module’s integrated SPI flash. For details, please see Section 6 Schematics. Not Recommended For New Designs (NRND) Espressif Systems 14 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 5 Electrical Characteristics 5 Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in Table 4 below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 4: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V Cumulative IO output current - 1,100 mA Storage temperature –40 105 °C Ioutput 1 Tstore 1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. 5.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Symbol Parameter Min Typical Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 - - A T Operating ambient temperature –40 - 85 °C 5.3 DC Characteristics (3.3 V, 25 °C) Table 6: DC Characteristics (3.3 V, 25 °C) Symbol CIN VIH Parameter Min Pin capacitance - High-level input voltage 0.75×VDD 1 Typ Max 2 - - Unit pF 1 VDD +0.3 V 1 VIL Low-level input voltage –0.3 - 0.25×VDD IIH High-level input current - - 50 nA IIL Low-level input current - - 50 nA VOH High-level output voltage 0.8×VDD1 - - V VOL Low-level output voltage - - 0.1×VDD1 V VDD3P3_CPU power domain 1, 2 - 40 - mA 1, 2 - 40 - mA - 20 - mA High-level source current 1 IOH (VDD = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum) VDD3P3_RTC power domain VDD_SDIO power domain 1, 3 Not Recommended For New Designs (NRND) Espressif Systems 15 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 V 5 Electrical Characteristics Symbol Parameter Min Typ Max Unit - 28 - mA Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, IOL output drive strength set to the maximum) RP U Resistance of internal pull-up resistor - 45 - kΩ RP D Resistance of internal pull-down resistor - 45 - kΩ VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 Wi­Fi Radio Table 7: Wi­Fi Radio Characteristics Parameter Center frequency range of operating channel Min Typical Max Unit - 2412 - 2484 MHz - - note 2 - Ω 11n, MCS7 12 13 14 dBm 11b mode 17.5 18.5 20 dBm 11b, 1 Mbps - –98 - dBm 11b, 11 Mbps - –89 - dBm 11g, 6 Mbps - –92 - dBm 11g, 54 Mbps - –74 - dBm 11n, HT20, MCS0 - –91 - dBm 11n, HT20, MCS7 - –71 - dBm 11n, HT40, MCS0 - –89 - dBm 11n, HT40, MCS7 - –69 - dBm 11g, 6 Mbps - 31 - dB 11g, 54 Mbps - 14 - dB 11n, HT20, MCS0 - 31 - dB 11n, HT20, MCS7 - 13 - dB note1 Output impedance note2 TX power Condition note3 Sensitivity Adjacent channel rejection 1. Device should operate in the center frequency range of operating channel allocated by regional regulatory authorities. Target center frequency range of operating channel is configurable by software. 2. For the modules that use external antennas, the output impedance is 50 Ω. For other modules without external antennas, users do not need to concern about the output impedance. 3. Target TX power is configurable based on device or certification requirements. Not Recommended For New Designs (NRND) Espressif Systems 16 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 5 Electrical Characteristics 5.5 Bluetooth LE Radio 5.5.1 Receiver Table 8: Receiver Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER - - –97 - dBm Maximum received signal @30.8% PER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0 + 1 MHz - –5 - dB F = F0 – 1 MHz - –5 - dB F = F0 + 2 MHz - –25 - dB F = F0 – 2 MHz - –35 - dB F = F0 + 3 MHz - –25 - dB F = F0 – 3 MHz - –45 - dB 30 MHz ~ 2000 MHz –10 - - dBm 2000 MHz ~ 2400 MHz –27 - - dBm 2500 MHz ~ 3000 MHz –27 - - dBm 3000 MHz ~ 12.5 GHz –10 - - dBm - –36 - - dBm Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 5.5.2 Transmitter Table 9: Transmitter Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit RF transmit power - - 0 - dBm Gain control step - - 3 - dBm RF power control range - –12 - +9 dBm F = F0 ± 2 MHz - –52 - dBm F = F0 ± 3 MHz - –58 - dBm F = F0 ± > 3 MHz - –60 - dBm ∆ f 1avg - - - 265 kHz ∆ f 2max - 247 - - kHz ∆ f 2avg /∆ f 1avg - - –0.92 - - ICFT - - –10 - kHz Drift rate - - 0.7 - kHz/50 µs Drift - - 2 - kHz Adjacent channel transmit power Not Recommended For New Designs (NRND) Espressif Systems 17 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 5 Electrical Characteristics Temperature (℃) 5.6 Reflow Profile Peak Temp. 235 ~ 250 ℃ 250 Preheating zone 150 ~ 200 ℃ 60 ~ 120 s 217 200 Reflow zone 217 ℃ 60 ~ 90 s Cooling zone –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 2: Reflow Profile Note: Solder the module in a single reflow. Not Recommended For New Designs (NRND) Espressif Systems 18 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 6 Schematics Espressif Systems 6 Schematics Pin.1 GND The values of C1 and C2 vary with the selection of a crystal. Pin.15 GND GND C5 10nF/6.3V(10%) C14 PCB ANT GND GND GND TBD C15 L4 TBD TBD C16 270pF C17 GND GND GND 270pF 49 1 2 3 4 SENSOR_VP 5 6 7 SENSOR_VN8 CHIP_PU 9 10 GPIO34 11 GPIO35 12 GPIO32 3 VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP ESP32-WROOM-32 Datasheet v3.3 Not Recommended For New Designs (NRND) The values of C14, L4 and C15 vary with the actual selection of a PCB board. ESP32-D0WDQ6 Pin.35 TXD0 SWP/SD3 Pin.19 CMD U0TXD Pin.34 RXD0 SCS/CMD Pin.20 CLK GPIO34 GND U0RXD Pin.33 IO21 SCK/CLK GPIO21 VDD_SDIO GPIO23 GPIO18 GPIO5 SD_DATA_1 SD_DATA_0 SD_CLK SD_CMD SD_DATA_3 SD_DATA_2 GPIO17 VDD_SDIO GPIO16 36 35 34 33 32 31 30 29 28 27 26 25 GPIO23 GPIO18 GPIO5 SDI/SD1 SDO/SD0 SCK/CLK SCS/CMD SWP/SD3 SHD/SD2 GPIO17 Pin.7 IO35 U3 SCS/CMD 1 SCK/CLK 6 SHD/SD2 7 /CS CLK /HOLD FLASH GPIO16 C18 VDD_SDIO Pin.21 SD0 GPIO35 8 1 2 0.1uF Pin.6 IO34 VCC GND ANT1 C10 GPIO22 VDD33 0.1uF GND C13 10uF C4 32K_XN GPIO25 GPIO26 GPIO27 MTMS MTDI VDD3P3_RTC MTCK MTDO GPIO2 GPIO0 GPIO4 C12 10uF Pin.18 SD3 SENSOR_VP Pin.5 SENSOR_VN GPIO23 Pin.36 IO22 SHD/SD2 SENSOR_VN 13 14 15 16 17 18 19 20 21 22 23 24 C11 3.3nF/6.3V(10%) GND GND 1uF C6 GND VDD33 19 Submit Documentation Feedback 0.1uF GPIO13 DI DO /WP 5 SDI/SD1 2 SDO/SD0 3 SWP/SD3 Pin.8 IO32 Pin.32 NC SDO/SD0 Pin.22 SD1 GPIO32 Pin.31 IO19 SDI/SD1 GPIO19 4 C9 Pin.4 SENSOR_VP GPIO21 U0TXD U0RXD GPIO22 GPIO19 20K(5%) GND Pin.37 IO23 Pin.17 SD2 CHIP_PU 2 1 GND GND R1 GND Pin.9 IO33 Pin.23 IO15 GPIO33 Pin.30 IO18 GPIO15 GPIO18 1uF Pin.10 IO25 GND U2 0.1uF Pin.24 IO2 GPIO25 VDD33 C19 GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 VDD33 C2 22pF GND 40MHz+/-10ppm GND GPIO13 GPIO15 GPIO2 GPIO0 GPIO4 1uF Pin.3 CHIP_PU/EN 48 47 46 45 44 43 42 41 40 39 38 37 C20 Pin.16 IO13 VDD33 GND CAP1 CAP2 VDDA XTAL_P XTAL_N VDDA GPIO21 U0TXD U0RXD GPIO22 GPIO19 VDD3P3_CPU C3 100pF D1 ESD3.3V88D-C Pin.2 3V3 GND XOUT 4 C1 22pF VDD33 U1 XIN GND GND GND GND Pin.38 GND Pin.29 IO5 GPIO2 Pin.11 IO26 GPIO5 Pin.28 IO17 GPIO26 GPIO17 GND Pin.12 IO27 Pin.27 IO16 GPIO27 GPIO16 Pin.13 IO14 Pin.26 IO4 GPIO14 Pin.14 IO12 Pin.39 GND GPIO12 Figure 3: ESP32­WROOM­32 Schematics GPIO4 Pin.25 IO0 GND GPIO0 7 Peripheral Schematics 7 Peripheral Schematics VDD33 VDD33 C1 10uF C2 0.1uF GND GND GND C3 TBD 1 2 3 SENSOR_VP 4 SENSOR_VN 5 6 IO34 7 IO35 8 IO32 9 IO33 10 IO25 11 IO26 12 IO27 13 14 EN GND1 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 P_GND GND3 IO23 IO22 TXD0 RXD0 IO21 NC IO19 IO18 IO5 IO17 IO16 IO4 IO0 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 J1 IO23 IO22 TXD RXD IO21 GND IO19 IO18 IO5 IO17 IO16 IO4 IO0 GND 1 2 GND2 IO13 SD2 SD3 CMD CLK SD0 SD1 IO15 IO2 GND UART DOWNLOAD U1 3 2 1 R1 TBD 15 16 17 18 19 20 21 22 23 24 J2 U2 R2 R3 R4 R5 100R 100R 100R 100R MTMS MTDI MTCK MTDO IO2 GND 1 2 3 4 SD2 SD3 CMD CLK SD0 SD1 MTMS MTDI MTCK MTDO BOOT OPTION JTAG MTDI should be kept at a low electric level when powering up the module. Figure 4: ESP32­WROOM­32 Peripheral Schematics Note: • Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. Espressif Systems Title Application of ESP32-WROOM • To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. Size Document Number A4 The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters Date: timing Wednesday, August 07, 201 should be adjusted based on the power-up timing of the module and the power-up and reset sequence 5 4 3 2 of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet. Not Recommended For New Designs (NRND) Espressif Systems 20 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 8 Physical Dimensions 8 Physical Dimensions ESP32-WROOM-32 Dimensions Unit: mm 5.94 0.85 0.80 4.10 0.90 1.27 1.50 15.80 00 Ø1. 9.68 10.67 4.10 0.1 17.60 0.90 16.51 25.50±0.15 0.45 0.90 5.94 3.10±0.15 1.05 0.85 8.89 11.43 18.00±0.15 Top View Bottom View Side View Figure 5: Physical Dimensions of ESP32­WROOM­32 Note: For information about tape, reel, and product marking, please refer to Espressif Module Package Information. Not Recommended For New Designs (NRND) Espressif Systems 21 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 9 Recommended PCB Land Pattern 9 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 5.94 18.00 Antenna Area 38x1.50 4.10 1.05 0.475 16.51 1.50 8.32 14 15 0.50 38 10.67 0.475 1.05 4.10 1.27 1.50 25.50 38x0.90 1 24 25 1.27 0.50 11.43 3.28 Figure 6: Recommended PCB Land Pattern Not Recommended For New Designs (NRND) Espressif Systems 22 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 10 Related Documentation and Resources 10 Related Documentation and Resources Related Documentation • ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals. • ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product. • ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors. • Certificates https://espressif.com/en/support/documents/certificates • ESP32 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns • ESP32 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32 Series SoCs – Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32 • ESP32 Series Modules – Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32 • ESP32 Series DevKits – Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Not Recommended For New Designs (NRND) Espressif Systems 23 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 Revision History Revision History Date Version Release notes Added a link to RF certificates in Table 1 2022.03 v3.3 Updated Table 4 Added a note below Figure 5 Added Section 10: Related Documentation and Resources Replaced Espressif Product Ordering Information with ESP Product Selector 2021.08 v3.2 Updated the description of TWAI in Table 1 Labeled this document as (Not Recommended For New Designs) Modified the note below Figure 2: Reflow Profile Updated the trade mark from TWAI™ to TWAI® 2021.02 V3.1 Deleted Reset Circuit and Discharge Circuit for VDD33 Rail in Section 7: Peripheral Schematics Updated Figure 5: Physical Dimensions of ESP32-WROOM-32 and Figure 6: Recommended PCB Land Pattern Added TWAITM in Table 1; 2020.11 V3.0 Added a note under Figure 2: Reflow Profile; Updated the C value in RC circuit from 0.1 µF to 1 µF; Provided feedback link. • Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V; • Added Moisture sensitivity level (MSL) 3 in Table 1 ESP32-WROOM-32 Specifications; • Added notes about ”Operating frequency range” and ”TX power” under Table 7 Wi-Fi 2019.09 V2.9 Radio Characteristics; • Updated Section 7 Peripheral Schematics and added a note about RC delay circuit under it; • Updated Figure 6 Recommended PCB Land Pattern. 2019.01 V2.8 2018.10 V2.7 Changed the RF power control range in Table 9 from –12 ~ +12 to –12 ~ +9 dBm. Added ”Cumulative IO output current” entry to Table 4: Absolute Maximum Ratings; Added more parameters to Table 6: DC Characteristics. • Added reliability test items the module has passed in Table 1: ESP32-WROOM-32 Specifications, and removed software-specific information; • Updated section 3.4: RTC and Low-Power Management; 2018.08 V2.6 • Changed the module’s dimensions from (18±0.2) mm x (25.5 ±0.2) mm x (3.1±0.15) mm to (18.00±0.10) mm x (25.50±0.10) mm x (3.10±0.10) mm; • Updated Figure 8: Physical Dimensions; • Updated Table 7: Wi-Fi Radio. Not Recommended For New Designs (NRND) Espressif Systems 24 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 Revision History Date Version Release notes • Changed the module name to ESP32-WROOM-32; • Deleted Temperature Sensor in Table 1: ESP32-WROOM-32 Specifications; • Updated Chapter 3: Functional Description; • Added Chapter 6: Recommended PCB Land Pattern; 2018.06 V2.5 Changes to electrical characteristics: • Updated Table 4: Absolute Maximum Ratings; • Added Table 5: Recommended Operating Conditions; • Added Table 6: DC Characteristics; • Updated the values of ”Gain control step”, ”Adjacent channel transmit power” in Table 9: Transmitter Characteristics - BLE. 2018.03 V2.4 Updated Table 1 in Chapter 1. Deleted information on LNA pre-amplifier; 2018.01 V2.3 Updated section 3.4 RTC and Low-Power Management; Added reset circuit in Chapter 7 and a note to it. Updated the description of the chip’s system reset in Section 2.3 Strapping Pins; Deleted ”Association sleep pattern” in Table “Power Consumption by Power Modes” and 2017.10 V2.2 added notes to Active sleep and Modem-sleep; Updated the note to Figure 4 Peripheral Schematics; Added discharge circuit for VDD33 rail in Chapter 7 and a note to it. 2017.09 V2.1 Updated operating voltage/power supply range updated to 2.7 ~ 3.6V; Updated Chapter 7. Changed the sensitivity of NZIF receiver to -97 dBm in Table 1; Updated the dimensions of the module; 2017.08 V2.0 Updated Table “Power Consumption by Power Modes” Power Consumption by Power Modes, and added two notes to it; Updated Table 4, 7, 8, 9; Added Chapter 8; Added the link to certification download. Added a note to Section 2.1 Pin Layout; 2017.06 V1.9 Updated Section 3.3 Crystal Oscillators; Updated Figure 3 ESP-WROOM-32 Schematics; Added Documentation Change Notification. 2017.05 V1.8 Updated Figure 1 Top and Side View of ESP32-WROOM-32 (ESP-WROOM-32). Added the module’s dimensional tolerance; 2017.04 V1.7 Changed the input impedance value of 50Ω in Table 7 Wi-Fi Radio Characteristics to output impedance value of 30+j10 Ω. 2017.04 V1.6 2017.03 V1.5 Added Figure 2 Reflow Profile. Updated Section 2.2 Pin Description; Updated Section 3.2 External Flash and SRAM; Updated Section 4 Peripherals and Sensors Description. Updated Chapter 1 Preface; Updated Chapter 2 Pin Definitions; Updated Chapter 3 Functional Description; 2017.03 V1.4 Updated Table Recommended Operating Conditions; Not Recommended For New Designs (NRND) Espressif Systems 25 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 Revision History Date Version Release notes Updated Table 7 Wi-Fi Radio Characteristics; Updated Section 5.6 Reflow Profile; Added Chapter Learning Resources. 2016.12 V1.3 Updated Section 2.1 Pin Layout. 2016.11 V1.2 Added Figure 7 Peripheral Schematics. 2016.11 V1.1 Updated Chapter 6 Schematics. 2016.08 V1.0 First release. Not Recommended For New Designs (NRND) Espressif Systems 26 Submit Documentation Feedback ESP32-WROOM-32 Datasheet v3.3 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. www.espressif.com All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. Not Recommended For New Designs (NRND)