SIM-ST-MFF2

Hardware Features Chip Type Supplier Chip Codes Electrical Characteristics Operational Temperature Characteristics Memory Size available for program and data Industrial Grade Starchip SCM392G 1.6V to 5.5V -40º to 105ºC 136K/256K Standard Grade Samsung S3FS9FG 1.6V, 3V and 5V -25º to 85ºC 340K/440K NVRAM characteristics Endurance cycles (min) @ 25º Data retention (min) @ 25º Vibration Sector/Bank erase time Page write/erase time Min. 200MM read/write cycle 25 Years Passes JESD22-B103 1.5ms/3ms 1.5ms/0.4ms Min. 500K read/write cycle 25 Years Platform Technology UICC Java Card Global Platform 2G/3G/4G/LTE Release 8 2.2.1 or higher 2.2.1 2G/3G/4G/LTE Release 8 2.2.1 or higher 2.2.1 Supported Applications SIM USIM ISIM HPSIM Release 4 Release 8 Release 8 Release 8 Release 4 Release 8 Release 8 OTA Capabilities Remote File Management Remote Applet Management Release 8 Release 8 Release 8 Release 8 1.5ms/3ms 1.5ms/0.4ms Software Features SIM Card Physical Characteristics Embedded Form Factor (MFF2) Module Format Size Standard Fitting Transportation Technical Details (MFF2) MFF2 (QFN8) embedded. 6 x 5mm*, (height: 0.75-0.82mm) TS 102.671 - standardized format Soldered to circuit board On trays/reels/boxes SIM Card Physical Characteristics 2FF - Mini SIM 3FF - Micro SIM 4FF - Nano SIM Height: 25mm Width: 15mm Thickness: 0.76mm Height: 15mm Width: 12mm Thickness: 0.76mm Height: 12.3mm Width: 8.8mm Thickness: 0.67mm Embedded SIM QNF8 Pinout Gnd 1 8 Vcc NC 2 7 Rst I/O 3 6 Clk NC 4 5 NC