P1 Datasheet (v009)
void setup() {
Particle.publish("my‐event","The internet just got smarter!");
}
Functional description
Overview
The P1 is Particle's tiny Wi-Fi module that contains both the Broadcom Wi-Fi chip and a
reprogrammable STM32F205RGY6 32-bit ARM Cortex-M3 microcontroller. The P1 comes
preloaded with Particle firmware libraries, just like our dev kits, and it's designed to simplify your
transition from prototype to production. The P1 is the PØ's big brother; it's a bit bigger and a tad
more expensive, but it includes some extra flash and an antenna and u.FL connector on board.
Particle provides free access to Particle Cloud for prototyping. Paid tiers of Particle Cloud start when
you create a product with more than 25 devices.
Features
Particle P1 Wi-Fi module
o Broadcom BCM43362 Wi-Fi chip
o 802.11b/g/n Wi-Fi
o STM32F205RGY6 120Mhz ARM Cortex M3
o 1MB flash, 128KB RAM
o 1MB external SPI flash (MX25L8006E)
o Integrated PCB antenna
o Integrated u.FL connector for external antenna
o Integrated RF switch
25 Mixed-signal GPIO and advanced peripherals
Open source design
Real-time operating system (FreeRTOS)
Soft AP setup
FCC, CE and IC certified
Interfaces
Block Diagram
Power
Power to the P1 is supplied via 3 different inputs: VBAT_WL (pin 2 & 3), VDDIO_3V3_WL (pin 5),
VDD_3V3 (pin 26 & 27). Optionally +3.3V may be supplied to VBAT_MICRO (pin 38) for data
retention in low power sleep modes. Each of these inputs also requires a 0.1uF and 10uF ceramic
decoupling capacitor, located as close as possible to the pin (see Fig 1). The voltage should be
regulated between 3.0VDC and 3.6VDC. (Please refer to Absolute Maximum Ratings for more info).
Typical average current consumption is 80mA with 5V @ input of the recommended SMPS power
supply with Wi-Fi on. Deep sleep quiescent current is typically 80uA (Please refer to Recommended
Operating Conditions for more info). When powering the P1 make sure the power supply can handle
600mA continuous. If a lesser power supply is provided, peak currents drawn from the P1 when
transmitting and receiving will result in voltage sag at the input which may cause a system brown out
or intermittent operation.
Warning: When powering the P1 from long wires, care should be taken to protect against damaging
voltage transients if using the same regulator as is used on the Photon. From the Richtek
datasheet:
When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load
step at the output can induce ringing at the input, VIN. At best, this ringing can couple to the output and be mistaken
as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at
VIN large enough to damage the part.
To avoid these voltage spikes, keep input wiring as short as possible. If long wires are unavoidable,
it is advisable to add a 5.1V zener diode or similar transient suppression device from VIN to GND.
Another technique is adding more capacitance to the input using an electrolytic capacitor. Please
refer to AN-88 by Linear for a good discussion on this topic.
Fig. 1 Recommended power connections with decoupling capacitors.
RF
The RF section of the P1 includes an on-board PCB trace antenna and a u.FL connector which
allows the user to connect an external antenna. These two antenna outputs are selectable via a user
API, made possible by an integrated RF switch.
The default selected antenna will be the PCB antenna.
The area surrounding the PCB antenna on the carrier PCB should be free of ground planes and
signal traces for maximum Wi-Fi performance.
FCC Approved Antennas
Antenna Type
Manufacturer
MFG. Part #
Gain
Dipole antenna
LumenRadio
104-1001
2.15dBi
PCB Antenna
Included
-
-
Peripherals and GPIO
The P1 module has ton of capability in a super small footprint, with analog, digital and
communication interfaces.
Note: P1 pin names will be preserved as they are named in the USI datasheet, however for the
scope of this datasheet we will also refer to them as their Photon and code equivalents, i.e. D7
instead of MICRO_JTAG_TMS and A2 instead of MICRO_GPIO_13. This will help to simplify
descriptions, while providing a quick reference for code that can be written for the P1 such as int
value = analogRead(A2);
Peripheral Type
Qty
Input(I) / Output(O)
FT[1] / 3V3[2]
Digital
24
I/O
FT/3V3
Analog (ADC)
13
I
3V3
Analog (DAC)
2
O
3V3
SPI
2
I/O
3V3
I2S
1
I/O
3V3
I2C
1
I/O
FT
CAN
1
I/O
3V3[4]
Peripheral Type
Qty
Input(I) / Output(O)
FT[1] / 3V3[2]
USB
1
I/O
3V3
PWM
12[3]
O
3V3
Notes:
[1]
FT = 5.0V tolerant pins. All pins except A3 and DAC are 5V tolerant (when not in analog mode). If
used as a 5V input the pull-up/pull-down resistor must be disabled.
[2]
3V3 = 3.3V max pins.
[3]
PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, TX, P1S0, P1S1, P1S6 with a caveat:
PWM timer peripheral is duplicated on two pins (A5/D2) and (A4/D3) for 10 total independent PWM
outputs. For example: PWM may be used on A5 while D2 is used as a GPIO, or D2 as a PWM while
A5 is used as an analog input. However A5 and D2 cannot be used as independently controlled
PWM outputs at the same time. P1S6 requires System Feature Wi-Fi Powersave Clock to be
disabled. See System Features in Firmware Reference.
[4]
Technically these pins are 5.0V tolerant, but since you wouldn't operate them with a 5.0V
transceiver it's proper to classify them as 3.3V.
RGB LED, SETUP and RESET button
When using the P1 module, it is very important to remember that your device must have an RGB
LED to show the user the connectivity status. Also required is a SETUP and RESET button to enter
various Device Modes. By default the RGB LED outputs are configured for a Common Anode type of
LED. These components should be wired according to the P1 Reference Design - User I/O. RGB pins
may be accessed in code as: RGBR, RGBG and RGBB.
JTAG and SWD
Pin D3 through D7 are JTAG interface pins. These can be used to reprogram your P1 bootloader or
user firmware image with standard JTAG tools such as the ST-Link v2, J-Link, R-Link, OLIMEX
ARM-USB-TINI-H, and also the FTDI-based Particle JTAG Programmer. If you are short on available
pins, you may also use SWD mode which requires less connections.
Photon Pin
JTAG
SWD
STM32F205RGY6 Pin
P1 Pin #
P1 Pin Name
Default Internal[1]
D7
JTAG_TMS
SWD/SWDIO
PA13
54
MICRO_JTAG_TMS
~40k pull-up
D6
JTAG_TCK
CLK/SWCLK
PA14
55
MICRO_JTAG_TCK
~40k pull-down
D5
JTAG_TDI
PA15
53
MICRO_JTAG_TDI
~40k pull-up
D4
JTAG_TDO
PB3
52
MICRO_JTAG_TDO
Floating
D3
JTAG_TRST
PB4
51
MICRO_JTAG_TRSTN
3V3
Power
Power
GND
Ground
Ground
RST
Reset
Reset
~40k pull-up
Notes: [1] Default state after reset for a short period of time before these pins are restored to GPIO (if
JTAG debugging is not required, i.e. USE_SWD_JTAG=y is not specified on the command line.)
A standard 20-pin 0.1" shrouded male JTAG interface connector should be wired as follows:
(click to stop squinting)
External Coexistence Interface
The P1 supports coexistence with Bluetooth and other external radios via three pins available on the
P1 module.
When two radios occupying the same frequency band are used in the same system, such as Wi-Fi
and Bluetooth, a coexistence interface can be used to coordinate transmit activity, to ensure optimal
performance by arbitrating conflicts between the two radios.
P1 Pin Name
P1 Pin #
I/O
Description
BTCX_RF_ACTIVE
57
I
Coexistence signal: Bluetooth is active
BTCX_STATUS
56
I
Coexistence signal: Bluetooth priority status and TX/RX direction
BTCX_TXCONF
58
O
Output giving Bluetooth permission to TX
 When these pins are programmed to be used as a Bluetooth coexistence interface, they're set as
high impedance on power up and reset.
Memory Map
STM32F205RGY6 Flash Layout Overview
Bootloader (16 KB)
DCT1 (16 KB), stores Wi-Fi credentials, keys, mfg info, system flags, etc..
DCT2 (16 KB), swap area for DCT1
EEPROM emulation bank 1 (16 KB)
EEPROM emulation bank 2 (64 KB)
System firmware (512 KB) [256 KB Wi-Fi/comms + 256 KB hal/platform/services]
Factory backup, OTA backup and user application (384 KB) [3 x 128 KB]
DCT Layout
The DCT area of flash memory has been mapped to a separate DFU media device so that we can
incrementally update the application data. This allows one item (say, server public key) to be
updated without erasing the other items.
DCT layout in release/stable found here in firmware.
https://github.com/spark/firmware/blob/release/stable/platform/MCU/STM32F2xx/SPARK_Firmware_Driver/inc/dct.h
Region
Offset
Size
system flags
0
32
version
32
2
device private key
34
1216
device public key
1250
384
ip config
1634
120
feature flags
1754
4
country code
1758
4
claim code
1762
63
claimed
1825
1
ssid prefix
1826
26
device code
1852
6
version string
1858
32
dns resolve
1890
128
reserved1
2018
64
server public key
2082
768
padding
2850
2
flash modules
2852
100
product store
2952
24
antenna selection
2976
1
cloud transport
2977
1
alt device public key
2978
128
alt device private key
3106
192
alt server public key
3298
192
alt server address
3490
128
device id
3618
12
radio flags
3630
1
mode button mirror
3631
32
led mirror
3663
96
led theme
3759
64
reserved2
3823
435
Note: Writing 0xFF to offset 34 (DEFAULT) or 3106 (ALTERNATE) will cause the device to regenerate a new private key on the next boot. Alternate keys are currently unsupported on the P1 but
are used on the Electron as UDP/ECC keys. You should not need to use this feature unless your
keys are corrupted.
// Regenerate Default Keys
echo ‐e "\xFF" > fillbyte && dfu‐util ‐d 2b04:d00a ‐a 1 ‐s 34 ‐D fillbyte
// Regenerate Alternate Keys
echo ‐e "\xFF" > fillbyte && dfu‐util ‐d 2b04:d00a ‐a 1 ‐s 3106 ‐D fillbyte
Memory Map (Common)
Region
Start Address
End Address
Size
Bootloader
0x8000000
0x8004000
16 KB
DCT1
0x8004000
0x8008000
16 KB
DCT2
0x8008000
0x800C000
16 KB
EEPROM1
0x800C000
0x8010000
16 KB
EEPROM2
0x8010000
0x8020000
64 KB
Memory Map (Modular Firmware - default)
Region
Start Address
End Address
Size
System Part 1
0x8020000
0x8060000
256 KB
System Part 2
0x8060000
0x80A0000
256 KB
User Part
0x80A0000
0x80C0000
128 KB
OTA Backup
0x80C0000
0x80E0000
128 KB
Factory Backup
0x80E0000
0x8100000
128 KB
Memory Map (Monolithic Firmware - optional)
Region
Start Address
End Address
Size
Firmware
0x8020000
0x8080000
384 KB
Factory Reset
0x8080000
0x80E0000
384 KB
Unused (factory reset modular)
0x80E0000
0x8100000
128 KB
Pin and button definition
Pin markings
Pin description
Pin
Description
RST
Active-low reset input. On-board circuitry contains a 1k ohm pull-up resistor between RST and 3V3, and 0.1uF capacitor
between RST and GND.
VBAT
Supply to the internal RTC, backup registers and SRAM when 3V3 not present (1.65 to 3.6VDC).
3V3
This pin represents the regulated +3.3V DC power to the P1 module. In reality, +3.3V must be supplied to 3 different inputs:
VBAT_WL (pin 2 & 3), VDDIO_3V3_WL (pin 5), VDD_3V3 (pin 26 & 27). Optionally +3.3V may be supplied to
VBAT_MICRO (pin 38) for data retention in low power sleep modes. Each of these inputs also requires a 0.1uF and 10uF
ceramic decoupling capacitor, located as close as possible to the pin.
TX
Primarily used as UART TX, but can also be used as a digital GPIO or PWM[1].
RX
Primarily used as UART RX, but can also be used as a digital GPIO or PWM[1].
WKP
Active-high wakeup pin, wakes the module from sleep/standby modes. When not used as a WAKEUP, this pin can also be
used as a digital GPIO, ADC input or PWM[1]. Can be referred to as A7 when used as an ADC.
DAC
12-bit Digital-to-Analog (D/A) output (0-4095), referred to as DAC or DAC1 in software. Can also be used as a digital GPIO
or ADC. Can be referred to as A6 when used as an ADC. A3 is a second DAC output used as DAC2 in software.
A0~A7
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also digital GPIOs. A6 and A7 are code convenience mappings, which
means pins are not actually labeled as such but you may use code like analogRead(A7). A6 maps to the DAC pin and A7
maps to the WKP pin. A4,A5,A7 may also be used as a PWM[1] output.
D0~D7
Digital only GPIO pins. D0~D3 may also be used as a PWM[1] output.
Pin
Description
P1S0
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also can be used as a digital GPIO or PWM[1].
P1S1
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also can be used as a digital GPIO or PWM[1].
P1S2
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also can be used as a digital GPIO.
P1S3
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also can be used as a digital GPIO.
P1S4
Primarily used as a digital GPIO.
P1S5
12-bit Analog-to-Digital (A/D) inputs (0-4095), and also can be used as a digital GPIO.
P1S6
Can be used as a digital GPIO or PWM[1] output. Must disable Wi-Fi Powersave Clock first, see System Features in Firmware
Reference.
Notes: [1] PWM is available on D0, D1, D2, D3, A4, A5, WKP, RX, TX, P1S0, P1S1, P1S6 with a
caveat: PWM timer peripheral is duplicated on two pins (A5/D2) and (A4/D3) for 10 total independent
PWM outputs. For example: PWM may be used on A5 while D2 is used as a GPIO, or D2 as a PWM
while A5 is used as an analog input. However A5 and D2 cannot be used as independently
controlled PWM outputs at the same time. P1S6 requires System Feature Wi-Fi Powersave Clock to
be disabled. See System Features in Firmware Reference.
Pinout diagram
You can download a high resolution pinout diagram in a PDF version here.
https://docs.particle.io/assets/images/p1-pinout.pdf
Notes: [1] Connected to MCO1 by default, outputs 32kHz clock for WICED powersave mode. See
System Features in the Firmware Reference to disable the Wi-Fi Powersave Clock and allow usage
of this pin.
[2]
MICRO_SPI1_SS is only for reference as a P1 module pin name. It is technically speaking the
STM32 pin PA4 which is the SS pin in an hardware SPI driven sense, however in the Particle API
SPI SS is only user controlled as a GPIO. The hardware SS pin is not implemented. The default SS
pin for the Particle SPI API is A2 (STM32 pin PC2), but any GPIO can be used for this function with
SPI.begin(pin).
Complete P1 Module Pin Listing
Type /
STM32F205RGY6
Port
P1 Pin
#
P1 Pin Name
1
GND
PWR
Ground
2~3
VBAT_WL
PWR
+3.3V
4
GND
PWR
Ground
5
VDDIO_3V3_WL
PWR
+3.3V
6
GND
PWR
Ground
7
WL_REG_ON
PWR
BCM43362 Debugging Pin
8~12
NC
13
GND
14
NC
15
GND
16
WL_JTAG_TDI
DEBUG
BCM43362 Debugging Pin
17
WL_JTAG_TCK
DEBUG
BCM43362 Debugging Pin
18
WL_JTAG_TRSTN
DEBUG
BCM43362 Debugging Pin
19
WL_JTAG_TMS
DEBUG
BCM43362 Debugging Pin
20
WL_JTAG_TDO
DEBUG
BCM43362 Debugging Pin
21
MICRO_SPI1_MISO
PA6
A4 (SPI MISO)
22
MICRO_SPI1_SCK
PA5
A3 (SPI SCK)
23
MICRO_SPI1_MOSI
PA7
A5 (SPI MOSI)
24
MICRO_SPI1_SS
PA4
DAC
25
GND
PWR
Ground
26~27
VDD_3V3
PWR
+3.3V
28
GND
PWR
Ground
29
MICRO_UART2_RTS
PA1
RGBR (RGB LED RED)
30
MICRO_UART2_CTS
PA0
WKP
31
MICRO_UART2_RXD
PA3
RGBB (RGB LED BLUE)
32
MICRO_UART2_TXD
PA2
RGBG (RGB LED GREEN)
33
TESTMODE
PA8
P1S6 (Connected to MCO1 by default, outputs 32kHz clock for WICED
powersave mode. See System Features in the Firmware Reference to
disable the Wi-Fi Powersave Clock and allow usage of this pin.)
34
MICRO_RST_N
NC
PWR
NC
PWR
I
Description
NC
Ground
NC
Ground
/RESET (Active low MCU reset)
Type /
STM32F205RGY6
Port
P1 Pin
#
P1 Pin Name
35
MICRO_I2C1_SCL
PB6
D1 (I2C SCL)
36
MICRO_I2C1_SDA
PB7
D0 (I2C SDA)
37
GND
PWR
Ground
38
VBAT_MICRO
PWR
Supply to the internal RTC, backup registers and SRAM when 3V3 not
present (1.65 to 3.6VDC)
39
GND
PWR
Ground
40
MICRO_GPIO_1
PB0
P1S0
41
MICRO_GPIO_2
PB1
P1S1
42
MICRO_GPIO_3
PC0
P1S2
43
MICRO_GPIO_5
PC3
A1
44
MICRO_GPIO_6
PC4
P1S3
45
MICRO_GPIO_7
PB5
D2 (I2S SD)
46
MICRO_GPIO_8
PC7
/SETUP (I2S MCK)
47
MICRO_GPIO_9
PC13
P1S4
48
MICRO_GPIO_12
PC1
P1S5
49
MICRO_GPIO_13
PC2
A2 (DEFAULT SPI SS)
50
MICRO_GPIO_14
PC5
A0
51
MICRO_JTAG_TRSTN
PB4
D3
52
MICRO_JTAG_TDO
PB3
D4 (I2S SCK)
53
MICRO_JTAG_TDI
PA15
D5 (I2S WS)
54
MICRO_JTAG_TMS
PA13
D7
55
MICRO_JTAG_TCK
PA14
D6
56
BTCX_STATUS
I
Coexistence signal: Bluetooth status and TX/RX direction
57
BTCX_RF_ACTIVE
I
Coexistence signal: Bluetooth is active
58
BTCX_TXCONF
O
Output giving Bluetooth permission to TX
59
GND
60
WL_SLEEP_CLK
61
MICRO_UART1_RTS
PA12
OTG_FS_DP (USB D+)
62
MICRO_UART1_CTS
PA11
OTG_FS_DM (USB D--)
63
MICRO_UART1_RXD
PA10
RX
64
MICRO_UART1_TXD
PA9
TX
PWR
DEBUG
Description
Ground
BCM43362 Debugging Pin
Type /
STM32F205RGY6
Port
P1 Pin
#
P1 Pin Name
65~73
GND
PWR
74
PAD1
NC
NC
75
PAD2
NC
NC
Description
Ground
Technical specification
Absolute maximum ratings
Parameter
Symbol
Supply Input Voltage
V3V3-MAX
Storage Temperature
Tstg
ESD Susceptibility HBM (Human Body Mode)
VESD
Min
Typ
-40
Max
Unit
+3.6
V
+85
°C
2
kV
Recommended operating conditions
Parameter
Symbol
Min
Typ
Max
Unit
Supply Input Voltage
V3V3[1]
+3.0
+3.3
+3.6
V
Supply Input Current (VBAT_WL)
IVBAT_WL
310
mA
Supply Input Current (VDDIO_3V3_WL)
IVDDIO_3V3_WL
50
mA
Supply Input Current (VDD_3V3)
IVDD_3V3
120
mA
Supply Input Voltage
VVBAT_MICRO
+3.6
V
Supply Input Current (VBAT_MICRO)
IVBAT_MICRO
19
uA
Operating Current (Wi-Fi on)
I3V3 avg[1]
100
mA
Operating Current (Wi-Fi on)
I3V3 pk[1]
430[2]
mA
Operating Current (Wi-Fi on, w/powersave)
I3V3 avg[1]
18
100[3]
mA
Operating Current (Wi-Fi off)
I3V3 avg[1]
30
40
mA
Sleep Current (5V @ VIN)
IQs
1
2
mA
Deep Sleep Current (5V @ VIN)
IQds
80
100
uA
Operating Temperature
Top
+60
°C
95
%
Humidity Range Non condensing, relative humidity
+1.65
80
235[2]
-20
Notes:
[1]
V3V3 and I3V3 represents the the combined 4 inputs that require +3.3V: VBAT_WL, VDDIO_3V3_WL,
VDD_3V3 and VBAT_MICRO.
[2]
These numbers represent the extreme range of short peak current bursts when transmitting and
receiving in 802.11b/g/n modes at different power levels. Average TX current consumption in will be
80-100mA.
[3]
These are very short average current bursts when transmitting and receiving. On average if
minimizing frequency of TX/RX events, current consumption in powersave mode will be 18mA
Wi-Fi Specifications
Feature
Description
WLAN Standards
IEEE 802 11b/g/n
Antenna Port
Single Antenna
Frequency Band
2.412GHz -- 2.462GHz (United States of America and Canada)
2.412GHz -- 2.472GHz (EU)
Sub Channels
1 -- 11 (United States of America and Canada)
1 -- 13 (EU)
Modulation
DSSS, CCK, OFDM, BPSK, QPSK, 16QAM, 64QAM
P1 module Wi-Fi output power
RF Average Output Power, 802.11b CCK Mode
RF Average Output Power, 802.11g OFDM Mode
RF Average Output Power, 802.11n OFDM Mode
Typ.
Tol.
Unit
1M
Avail. upon request
+/- 1.5
dBm
11M
-
+/- 1.5
dBm
6M
-
+/- 1.5
dBm
54M
-
+/- 1.5
dBm
MCS0
-
+/- 1.5
dBm
MCS7
-
+/- 1.5
dBm
I/O Characteristics
These specifications are based on the STM32F205RGY6 datasheet, with reference to Photon pin
nomenclature.
Parameter
Symbol
Standard I/O input low level voltage
VIL
I/O FT[1] input low level voltage
Conditions
Min
Typ
Max
Unit
-0.3
0.28*(V3V32)+0.8
V
VIL
-0.3
0.32*(V3V32)+0.75
V
Standard I/O input high level voltage
VIH
0.41*(V3V32)+1.3
V3V3+0.3
V
I/O FT[1] input high level voltage
VIH
V3V3 > 2V
0.42*(V3V3-2)+1
5.5
V
VIH
V3V3 ≤ 2V
0.42*(V3V3-2)+1
5.2
V
Standard I/O Schmitt trigger voltage
hysteresis[2]
Vhys
200
mV
I/O FT Schmitt trigger voltage hysteresis[2]
Vhys
5% V3V3[3]
mV
Input/Output current max
Iio
±25
mA
Input/Output current total
Iio total
±120
mA
Input leakage current[4]
Ilkg
GND ≤ Vio ≤ V3V3
GPIOs
±1
µA
Input leakage current[4]
Ilkg
RPU
Vio = 5V, I/O
FT
3
µA
Weak pull-up equivalent resistor[5]
RPU
Vio = GND
30
40
50
kΩ
Weak pull-down equivalent resistor[5]
RPD
Vio = V3V3
30
40
50
kΩ
I/O pin capacitance
CIO
DAC output voltage (buffers enabled by
default)
VDAC
0.2
DAC output resistive load (buffers enabled by
default)
RDAC
5
DAC output capacitive load (buffers enabled
by default)
CDAC
5
pF
V3V3-0.2
V
kΩ
50
pF
Notes:
[1]
FT = Five-volt tolerant. In order to sustain a voltage higher than V3V3+0.3 the internal pull-up/pull-
down resistors must be disabled.
[2]
Hysteresis voltage between Schmitt trigger switching levels. Based on characterization, not tested
in production.
[3]
With a minimum of 100mV.
[4]
Leakage could be higher than max. if negative current is injected on adjacent pins.
[5]
Pull-up and pull-down resistors are designed with a true resistance in series with switchable
PMOS/NMOS. This PMOS/NMOS contribution to the series resistance is minimum (~10% order).
Mechanical specifications
Overall dimensions
P1 module dimensions are: 0.787"(28mm) (W) x 1.102"(20mm) (L) x 0.0787"(2.0mm) (H) +/0.0039"(0.1mm) (includes metal shielding)
Actual size (so tiny!)
P1 Module Dimensions
These are the physical dimensions of the P1 module itself, including all pins:
P1 Module Recommended PCB land pattern
The P1 can be mounted directly on a carrier PCB with following PCB land pattern:
A P1 part for EAGLE can be found in the Particle EAGLE library https://github.com/spark/hardwarelibraries#pcb-footprints-land-pattern
P1 Reference Design Schematic
Schematic - USB
Schematic - Power
Schematic - User I/O
Schematic - P1 Wi-Fi Module
P1 Reference Design Layout
P1 Reference Design Top Layer (GTL)
To be added.
P1 Reference Design Bottom Layer (GBL)
To be added.
Recommended solder reflow profile
Phase
Temperatures and Rates
A-B.
Ambient~150°C, Heating rate: < 3°C/s
B-C.
150~200°C, soak time: 60~120 s
C-D.
200~245°C, Heating rate: < 3°C/s
D.
D-E.
Peak temp.: 235~245°C, Time above 220°C: 40~90 s
245~220°C, Cooling rate: < 1°C/s
Ordering information
P1 modules are available from store.particle.io as cut tape in quantities of 10 each.
Qualification and approvals
RoHS
CE
FCC ID: COFWMNBM11
IC: 10293A-WMNBM11
Product handling
Tape and Reel Info
Moisture sensitivity levels
The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required.
The P1 module is rated level 3. In general, this precaution applies for Photons without headers.
When reflowing a P1 directly onto an application PCB, increased moisture levels prior to reflow can
damage sensitive electronics on the P1. A bake process to reduce moisture may be required.
For more information regarding moisture sensitivity levels, labeling, storage and drying see the MSL
standard see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org).
ESD Precautions
The P1 module contains highly sensitive electronic circuitry and is an Electrostatic Sensitive Device
(ESD). Handling a P1 module without proper ESD protection may destroy or damage it permanently.
Proper ESD handling and packaging procedures must be applied throughout the processing,
handling and operation of any application that incorporates P1 modules. ESD precautions should be
implemented on the application board where the P1 module is mounted. Failure to observe these
precautions can result in severe damage to the P1 module!
Default settings
The P1 module comes pre-programmed with a bootloader and a user application called Tinker. This
application works with an iOS and Android app also named Tinker that allows you to very easily
toggle digital pins, take analog and digital readings and drive variable PWM outputs.
The bootloader allows you to easily update the user application via several different methods, USB,
OTA, Serial Y-Modem, and also internally via the Factory Reset procedure. All of these methods
have multiple tools associated with them as well.
You may use the online Web IDE Particle Build to code, compile and flash a user application OTA
(Over The Air). Particle Dev is a local tool that uses the Cloud to compile and flash OTA as well.
There is also a package Spark DFU‐UTIL for Particle Dev that allows for Cloud compiling and local
flashing via DFU over USB. This requires dfu‐util to be installed on your system. 'dfu-util' can also be
used with Particle CLI for Cloud compiling and local flashing via the command line. Finally the lowest
level of development is available via the GNU GCC tool chain for ARM, which offers local compile and
flash via dfu-util. This gives the user complete control of all source code and flashing methods. This
is an extensive list, however not exhaustive.
Glossary
Radio Frequency
SMT
Surface Mount Technology (often associated with SMD which is a surface mount device).
AP
Access Point
USB
Universal Serial Bus
Quiescent current
Current consumed in the deepest sleep state
FT
Five-tolerant; Refers to a pin being tolerant to 5V.
3V3
+3.3V; The regulated +3.3V supply rail. Also used to note a pin is only 3.3V tolerant.
RTC
Real Time Clock
OTA
Over The Air; describing how firmware is transferred to the device.
FCC IC CE Warnings and End Product Labeling
Requirements
Federal Communication Commission Interference Statement This equipment has been tested
and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC
Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and,
if not installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
-Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment. This device complies with Part
15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause
undesired operation.
FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits
set forth for an uncontrolled environment. This transmitter module must not be co-located or
operating in conjunction with any other antenna or transmitter. This End equipment should be
installed and operated with a minimum distance of 20 centimeters between the radiator and your
body.
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer
considered valid and the FCC ID can not be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate FCC authorization.
End Product Labeling The final end product must be labeled in a visible area with the following:
Contains FCC ID: 2AEMI-PHOTON
Manual Information to the End User The OEM integrator has to be aware not to provide
information to the end user regarding how to install or remove this RF module in the user’s manual
of the end product which integrates this module.
Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is
subject to the following two conditions:
1. This device may not cause interference; and
2. This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio
exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes:
1. l’appareil ne doit pas produire de brouillage;
2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d’en compromettre le fonctionnement.
Caution Exposure: This device meets the exemption from the routine evaluation limits in section
2.5 of RSS102 and users can obtain Canadian information on RF exposure and compliance. Le
dispositif répond à l'exemption des limites d'évaluation de routine dans la section 2.5 de RSS102 et
les utilisateurs peuvent obtenir des renseignements canadiens sur l'exposition aux RF et le respect.
The final end product must be labelled in a visible area with the following: The Industry
Canada certification label of a module shall be clearly visible at all times when installed in the host
device, otherwise the host device must be labelled to display the Industry Canada certification
number of the module, preceded by the words “Contains transmitter module”, or the word
“Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 20127-PHOTON
This End equipment should be installed and operated with a minimum distance of 20 centimeters
between the radiator and your body. Cet équipement devrait être installé et actionné avec une
distance minimum de 20 centimètres entre le radiateur et votre corps.
The end user manual shall include all required regulatory information/warning as shown in this
manual.
Revision history
Revision
Date
Author
Comments
v001
4-May-2015
BW
Initial release
v002
31-May-2015
BW
Update assets
v003
1-June-2015
BW
Updated VBAT_MICRO info
v004
24-July-2015
BW
Added FCC IC CE Warnings and End Product Labeling Requirements,
Updated power output, added approved antennas, Corrected DAC2 as A3,
Corrected A0 as pin 50, Corrected External Coexistence Interface pin
numbers, Added RGB LED, SETUP and RESET button section.
v005
11-April-2016
BW
Added: full STM32 part number, Memory map, DAC limits, SWD pin
locations, max source/sink current, known errata URL and tape-and-reel
dimensions. Updated: BT COEX info, pinout diagrams (fixed RESET pin
number error), operating conditions, pin descriptions (P1S0~P1S5 pins), landpattern image signal keepout note.
v006
14-July-2016
BW
Updated P1 pin listing: TESTMODE pin 33 (PA8), connected to MCO1 by
default, outputs 32kHz clock for WICED powersave mode - currently
unsupported for user control.
v007
20-September2016
BW
Updated P1 pin listing: TESTMODE pin 33 (PA8), can use now as P1S6 if
enabled. Updated Pinmap and added P1S6. Updated Pin Description and
Peripherals and GPIO.
v008
25-July-2017
BW
Added note to clarify MICRO_SPI1SS label, renamed SPI1/SPI3_ to match
Particle API instead of STM32 pin names to avoid confusion (now SPI and
SPI1), updated the Pin Description section and added high resolution pinout
PDF, updated PWM notes, JTAG_TDO pin number (54 -> 52), block diagram
and DCT layout, added warning to power section
v009
30-August-2017
BW
Added part number for 1MB external SPI flash (MX25L8006E)
https://docs.particle.io/datasheets/p1-datasheet/ 11-1-17
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