BMD-350
Stand-alone Bluetooth 5 low energy module
Data sheet
Abstract
This technical data sheet describes the BMD-350 stand-alone Bluetooth® low energy module. The
OEMs can embed their own application on top of the integrated Bluetooth low energy stack using
Nordic Semiconductor SDK integrated development environment (IDE).
UBX-19033354 - R28
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BMD-350 - Data sheet
Document information
Title
BMD-350
Subtitle
Stand-alone Bluetooth 5 low energy module
Document type
Data sheet
Document number
UBX-19033354
Revision and date
R28
Disclosure restriction
C1 Public
16-May-2022
Product status
Corresponding content status
Functional sample
Draft
For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Objective specification
Target values. Revised and supplementary data will be published later.
Engineering sample
Advance information
Data based on early testing. Revised and supplementary data will be published later.
Initial production
Early production information
Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Production information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Firmware version
IN/PCN reference
Product status
BMD-350
BMD-350-A-R-00
All
UBX-20009871
Obsolete
BMD-350
BMD-350-A-R-10
AE
N/A
Mass production
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.
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Document information
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BMD-350 - Data sheet
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1
Functional description ......................................................................................................................... 6
Features ........................................................................................................................................................ 6
Applications ................................................................................................................................................. 7
Block diagram .............................................................................................................................................. 7
Product specifications ............................................................................................................................... 8
2
Pin definition ........................................................................................................................................ 10
Pin assignment ..........................................................................................................................................10
Peripheral pin assignments ....................................................................................................................11
3
Electrical specifications ................................................................................................................... 12
Absolute maximum ratings ....................................................................................................................12
Operating conditions ................................................................................................................................12
General purpose I/O ..................................................................................................................................12
Module reset ..............................................................................................................................................13
Debug and programming .........................................................................................................................13
Clocks ..........................................................................................................................................................13
4
3.6.1
32.768 kHz crystal (LFXO) ..............................................................................................................14
3.6.2
32.768 kHz clock source comparison ...........................................................................................14
Firmware ................................................................................................................................................ 15
Factory image ............................................................................................................................................15
4.1.1
Firmware version “AA” .....................................................................................................................15
4.1.2
Firmware version “AB” .....................................................................................................................15
4.1.3
Firmware version “AC” .....................................................................................................................15
4.1.4
Firmware version “AD” .....................................................................................................................16
4.1.5
Firmware version “AE” .....................................................................................................................16
Module programming and read-back protection ...............................................................................16
SoftDevices ................................................................................................................................................16
4.3.1
S132 ....................................................................................................................................................17
4.3.2
S212 ....................................................................................................................................................17
4.3.3
S332 ....................................................................................................................................................17
Bluetooth device address ........................................................................................................................17
5
Mechanical specifications ............................................................................................................... 18
Dimensions .................................................................................................................................................18
Recommended PCB land pads ...............................................................................................................18
Module marking .........................................................................................................................................19
6
5.3.1
Module marking for type number BMD-350-A-R-00 .................................................................19
5.3.2
Module marking for type number BMD-350-A-R-10 .................................................................19
RF Design notes .................................................................................................................................. 21
Recommended RF layout and ground plane ........................................................................................21
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BMD-350 - Data sheet
Mechanical enclosure ...............................................................................................................................21
Antenna patterns ......................................................................................................................................22
6.3.1
X-Y plane .............................................................................................................................................22
6.3.2
X-Z plane .............................................................................................................................................23
6.3.3
Y-Z plane.............................................................................................................................................23
7
BMD-350 evaluation development kit ......................................................................................... 24
8
Qualification and approvals............................................................................................................. 25
United States (FCC) .................................................................................................................................25
8.1.1
Labeling and user information requirements .............................................................................25
8.1.2
RF exposure .......................................................................................................................................25
Canada (ISED) ............................................................................................................................................26
8.2.1
Labeling and user information requirements .............................................................................26
8.2.2
RF exposure .......................................................................................................................................26
European Union regulatory compliance ...............................................................................................27
8.3.1
Radio Equipment Directive (RED) 2014/53/EU ..........................................................................27
8.3.2
Labeling and user information requirements .............................................................................27
Japan (MIC) ................................................................................................................................................27
Australia / New Zealand (RCM) ..............................................................................................................28
South Korea (KCC) ....................................................................................................................................28
Brazil (ANATEL) .........................................................................................................................................28
Eurasia (EAC) .............................................................................................................................................28
Mexico (IFETEL).........................................................................................................................................29
China (SRRC) ..............................................................................................................................................29
Bluetooth qualification .............................................................................................................................29
9
Environmental...................................................................................................................................... 30
RoHS ............................................................................................................................................................30
REACH .........................................................................................................................................................30
California proposition 65 (P65) ..............................................................................................................30
10 Product handling ................................................................................................................................. 31
Packaging ...................................................................................................................................................31
10.1.1 Reel packaging for type number BMD-350-A-R-00...................................................................31
10.1.2 Reel packaging for type number BMD-350-A-R-10...................................................................31
10.1.3 Carrier tape dimensions for type number BMD-350-A-R-00 ..................................................31
10.1.4 Carrier tape dimensions for type number BMD-350-A-R-10 ..................................................32
Carrier tape orientation ...........................................................................................................................32
Moisture sensitivity level .........................................................................................................................32
Reflow soldering ........................................................................................................................................33
ESD precautions ........................................................................................................................................33
11 Ordering information ......................................................................................................................... 34
12 Life support and high-risk use warnings .................................................................................... 35
Related documents ................................................................................................................................... 36
Revision history .......................................................................................................................................... 37
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BMD-350 - Data sheet
Contact .......................................................................................................................................................... 37
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Contents
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BMD-350 - Data sheet
1
Functional description
The BMD-350 from u-blox is a powerful, highly flexible, ultra-low power, Bluetooth Low energy module
based on the nRF52832 SoC from Nordic Semiconductor. With an Arm® Cortex®-M4 with FPU 32-bit
processor, embedded 2.4GHz transceiver, and integrated antenna, BMD-350 provides a complete RF
solution with no additional RF design, allowing faster time to market. Providing full use of the
nRF52832’s capabilities and peripherals, the BMD-350 can power the most demanding applications,
all while simplifying designs and reducing BOM costs. With an internal DC-DC converter and
intelligent power control, BMD-350 provides class-leading power efficiency, enabling ultra-low power
sensitive applications. Regulatory pre-approvals reduce the burden to enter the market.
Features
•
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Based on the Nordic Semiconductor nRF52832 SoC
Bluetooth 5 PHYs: LE 1M, LE 2M
Bluetooth 5 features: Advertising Extensions, Channel Selection Algorithm #2
Bluetooth Mesh
Complete RF solution with an integrated DC-DC converter
Nordic Semiconductor SoftDevice ready
Over-the-Air (OTA) firmware updates
No external components required
Arm® Cortex®-M4 with FPU 32-bit processor
512 kB embedded flash memory
64 KB RAM
–40 °C to +85 °C Temperature Range
32 General Purpose I/O Pins
12-bit/200 KSPS ADC
Serial Wire Debug (SWD)
Three SPI Master/Slave (8 Mbps)
Two 2-wire Master/Slave (I2C compatible)
UART (w/ CTS/RTS and DMA)
I2S audio interface
Low power comparator
Temperature sensor
Random number generator
20 channel CPU independent Programmable Peripheral Interconnect (PPI)
Quadrature Demodulator (QDEC)
128-bit AES HW encryption
5 x 32 bit, 3 x 24 bit Real Timer Counters (RTC)
NFC-A tag interface for OOB pairing
Dimensions: 8.65 x 6.4 x 1.5 mm
USA (FCC): 2AA9B05
Canada (IC): 12208A-05
Japan (MIC): 210-10894
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BMD-350 - Data sheet
Applications
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Beacons – iBeacon™, Eddystone, AltBeacon, and so on.
Low-power Sensors
Fitness devices
Wearables
Climate control
Lighting
Safety and security
Home appliances
Access control
Internet of Things
Home health care
Advanced remote controls
Smart energy management
Low-power sensor networks
Interactive entertainment
Key fobs
Environmental monitoring
Hotel automation
Office automation
Block diagram
BMD-300 Series Modules
nRF52832
64
kB RAM
Accel Address
Resolver
ARM Cortex-M4F
@ 64MHz
SWD Debug &
Programming
Core LDO
DC/DC Buck
Regulator
2.4GHz Radio
Multi-protocol
AES ECB
Balun
512kB
Flash
Matching
Network
AES CCM Mode
Encryption
Clock
Management
Real Time
Counter x3
Watchdog
Timer
Timer x5
Random Number
Gen
Programmable
Peripheral
Interconnect
Temperature
Sensor
GPIO Task
Event Blocks
Low Power
Comparator
TWI
Master x2
SPI
Master x3
UART
I2S
Quadrature
Decoder
General
Purpose
Comparator
TWI Slave
x2
SPI Slave
X3
PWM
PDM
NFC Tag
8-ch 12-bit
ADC
DC-DC
Inductor
Bulk
Capacitors
Decoupling
Capacitors
GPIO x32
(Analog x8)
Antenna
/ U.FL
32 MHz
Crystal
Figure 1: Block diagram
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Functional description
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BMD-350 - Data sheet
Product specifications
Detail
Description
Bluetooth
Bluetooth version
Bluetooth 5 low energy, Concurrent Central & Peripheral (S132), 2M LE PHY, 1M
LE PHY, Advertising Extensions, CSA #2
Bluetooth Mesh
Security
AES-128
LE connections
Concurrent central, observer, peripheral, and broadcaster roles with up to twenty
concurrent connections along with one Observer and one Broadcaster (S132)
Radio
Frequency
2.360 GHz to 2.500 GHz
Modulations
GFSK at 1 Mbps, 2 Mbps data rates
Transmit power
+4 dBm maximum
Receiver sensitivity
–96 dBm (Bluetooth low energy mode)
Antenna
Ceramic chip (1 dBi peak)
Current consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC
enabled
7.5 mA, 5.3 mA
TX only @ +4 dBm, 0 dBm
16.6 mA, 11.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled
5.4 mA
RX only @ 1 Mbps
11.7 mA
CPU @ 64 MHz from flash, from RAM
7.4 mA, 6.7 mA
CPU @ 64 MHz from flash, from RAM @ 3.7 mA, 3.3 mA
3V, DCDC
System Off, On
0.3 µA, 1.2 µA
Additional current for RAM retention
30 nA / 4 KB block
Dimensions
BMD-350
Length: 8.65 mm ± 0.2 mm
Width: 6.4 mm ± 0.2 mm
Height: 1.5 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x 3
UART
Two-Wire Master/Slave (I2C) x 2
GPIO x 32
I2S
PWM
PDM
Power supply
1.7 V to 3.6 V
Temperature range
–40 °C to +85 °C
Certifications
USA (FCC)
FCC part 15 modular certification
FCC ID: 2AA9B05
Canada (IC)
Industry Canada RSS-210 modular certification IC: 12208A-05
Europe (CE)
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 and 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1
3.2: Effective use of spectrum allocated
Japan (MIC)
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the
Radio Act of Japan: MIC: 210-108944
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BMD-350 - Data sheet
Detail
Description
Australia / New Zealand (RCM)
AS/NZS 4268:2017, Radio equipment and systems – Short range devices
Brazil (ANATEL)
The BMD-350 is evaluated according to: Resolution 680 of 27/06/2017, Act 14448
of 04/12/2017, Certificate number: 00857-21-05903
Eurasia (EAC)
Mexico (IFETEL)
IFT #: RCPRIBM18-1491
China (SRRC)
CMIIT ID: 2018DJ7255
South Korea (KCC)
KCC ID: R-C-Rgd-BMD-350
Bluetooth
BMD-350 BT5 RF-PHY Component (Tested) – DID: D037298; QDID: 101625
Radio chip
Nordic Semiconductor nRF52832
Additional details: nRF52832 Product Specification
Software Development Kit
Table 1: Product specifications
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Functional description
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BMD-350 - Data sheet
2
Pin definition
Pin assignment
Figure 2: BMD-350 Pin assignment (top view)
No.
Name
I/O
Description
1
GND
Power
Electrical Ground
2
GND
Power
Electrical Ground
3
GND
Power
Electrical Ground
4
SWCLK
I
SWD Clock
SWCLK
5
SWDIO
I/O
SWD IO
SWDIO
6
P0.20
I/O
GPIO/TRACECLK
P0.20
7
P0.21
I/O
GPIO/RESET_N
P0.21
8
P0.18
I/O
GPIO/TRACEDATA[0]/SWO P0.18
9
P0.16
I/O
GPIO/TRACEDATA[1]
P0.16
10
P0.17
I/O
GPIO
P0.17
11
P0.15
I/O
GPIO/TRACEDATA[2]
P0.15
12
P0.13
I/O
GPIO
P0.13
13
P0.12
I/O
GPIO
P0.12
14
P0.14
I/O
GPIO/TRACEDATA[3]
P0.14
15
GND
Power
Electrical Ground
16
P0.09
I/O
GPIO/NFC1
P0.09
NFC pin 1 (default)
17
P0.10
I/O
GPIO/NFC2
P0.10
NFC pin 2 (default)
18
P0.11
I/O
GPIO
P0.11
19
P0.06
I/O
GPIO
P0.06
20
P0.08
I/O
GPIO
P0.08
21
P0.05
I/O
GPIO/AIN3
P0.05
22
P0.07
I/O
GPIO
P0.07
23
P0.01
I/O
GPIO/XTAL2 (32.768 kHz)
P0.01
24
P0.00
I/O
GPIO/XTAL1 (32.768 kHz)
P0.00
25
VCC
Power
+1.7 V to +3.6 V
VDD
26
GND
Power
Electrical Ground
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nRF52 port
Pin definition
Remarks
May be used as active low reset input
Pin is analog capable
An internal 4.7 µF bulk capacitor is included on the
module. However, it is good design practice to add
additional bulk capacitance as required for your
application, that is, those with heavy GPIO usage
and/or current draw.
Page 10 of 37
BMD-350 - Data sheet
No.
Name
I/O
Description
nRF52 port
Remarks
27
P0.04
I/O
GPIO/AIN2
P0.04
Pin is analog capable
28
P0.02
I/O
GPIO/AIN0
P0.02
Pin is analog capable
29
P0.30
I/O
GPIO/AIN6
P0.30
Pin is analog capable, use as low drive, low
frequency GPIO only
30
P0.31
I/O
GPIO/AIN7
P0.31
Pin is analog capable, use as low drive, low
frequency GPIO only
31
P0.29
I/O
GPIO/AIN5
P0.29
Pin is analog capable, use as low drive, low
frequency GPIO only
32
P0.27
I/O
GPIO
P0.27
Use as low drive, low frequency GPIO only
33
P0.25
I/O
GPIO
P0.25
Use as low drive, low frequency GPIO only
34
P0.26
I/O
GPIO
P0.26
Use as low drive, low frequency GPIO only
35
P0.23
I/O
GPIO
P0.23
Use as low drive, low frequency GPIO only
36
P0.24
I/O
GPIO
P0.24
Use as low drive, low frequency GPIO only
37
GND
Power
Electrical Ground
38
GND
Power
Electrical Ground
39
GND
Power
Electrical Ground
40
GND
Power
Electrical Ground
41
P0.22
I/O
GPIO
P0.22
Use as low drive, low frequency GPIO only
42
P0.19
I/O
GPIO
P0.19
43
GND
Power
Electrical Ground
44
P0.03
I/O
GPIO/AIN1
P0.03
Pin is analog capable
45
P0.28
I/O
GPIO/AIN4
P0.28
Pin is analog capable, use as low drive, low
frequency GPIO only
46
GND
Power
Electrical Ground
47
GND
Power
Electrical Ground
Table 2: BMD-350 pin-out
Peripheral pin assignments
The peripherals within the BMD-350 may be assigned to nearly any of the GPIO pins through the
application. There are some restrictions called out by the nRF52832 product specification. See the
Remarks column in Table 2. Also note that certain peripherals are assigned to particular pins, such
the analog inputs.
☞
Only one peripheral signal can be multiplexed to a GPIO pin at a time. Some functions are restricted
to certain pins due to additional internal circuitry required by the interface. These include: Trace
signals, analog inputs, XTAL signals, USB signals, SWD interface, and reset. See Table 3.
Peripheral
Signal
Pin options
UART, I2C, SPI, I2S, PDM, PWM
All
P0.00-P0.31
ADC, COMP, LPCOMP
All
P0.02-P0.05, P0.28-P0.31 (AIN0-AIN7)
Reset
RESET_N
P0.21
SWD
SWD Clock
SWD IO
SWCLK
SWDIO
32.768 kHz Crystal
XTAL1
XTAL2
P0.00
P0.01
NFCT
NFC1
NFC2
P0.09
P0.10
Table 3: Peripheral pin options
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BMD-350 - Data sheet
3
Electrical specifications
⚠
Stressing the device above one or more of the ratings listed in the Absolute maximum ratings can
cause permanent damage. These are stress ratings only. Operating the module at these or at any
conditions other than those specified in the Operating conditions should be avoided. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
☞
All given application information is only advisory and does not form part of the specification.
Absolute maximum ratings
Symbol
Description
Min
Max
Unit
VCC_MAX
Voltage on supply pin
–0.3
3.9
V
VIO_MAX
Voltage on GPIO pins (VCC > 3.6 V)
–0.3
3.9
V
VIO_MAX
Voltage on GPIO pins (VCC ≤ 3.6V)
–0.3
VCC+0.3 V
V
TS
Storage Temperature Range
–40
125
°C
Table 4: Absolute maximum ratings
⚠
The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in Table 4, must be limited to values within
the specified boundaries by using appropriate protection devices.
Operating conditions
☞
Unless otherwise specified, all operating condition specifications are at an ambient temperature
of 25 °C and a supply voltage of 3.0 V.
⚠
Operation beyond the specified operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
Symbol
Parameter
Min
Typ.
Max
Unit
VCC
Operating supply voltage
1.7
3.0
3.6
V
TR_VCC
Supply rise time (0 V to 1.7 V)
-
-
60
ms
TA
Operating ambient Temperature range
–40
25
85
°C
Table 5: Operating conditions
General purpose I/O
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO
pins through one port. Each GPIO can be accessed with the following user configurable features:
•
•
•
•
•
•
•
Input/output direction
Output drive strength
Internal pull-up and pull-down resistors
Wake-up from high- or low-level triggers on all pins
Trigger interrupt on all pins
All pins can be used by the PPI task/event system; the maximum number of pins that can be
interfaced through the PPI at the same time is limited by the number of GPIOTE channels
All pins can be individually configured to carry serial interface or quadrature demodulator signals
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BMD-350 - Data sheet
Symbol
Parameter
Min
Typ.
Max
Unit
VIH
Input high voltage
0.7 x VCC
-
VCC
V
VIL
Input low voltage
VSS
-
0.3 x VCC
V
VOH
Output high voltage
VCC – 0.4
-
VCC
V
VOL
Output low voltage
VSS
-
VSS +0.4
V
RPU
Pull-up resistance
11
13
16
kΩ
RPD
Pull-down resistance
11
13
16
kΩ
Table 6: GPIO
Module reset
GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the
user information configuration registers, (UICR) PSELRESET[0] and PSELRESET[1], must both be
set to the value of 0x7FFFFF15. When P0.21 is programmed as RESET, the internal pull-up is
automatically enabled. Nordic Semiconductor example applications and development kits program
P0.21 as RESET_N.
Debug and programming
The BMD-350 series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and
powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and
instruction trace capture of code execution flow are part of this support.
BMD-350 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an
external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports
serial trace via the Serial Wire Output (SWO) trace protocol.
Clocks
BMD-350 requires two clocks, a high frequency clock and a low frequency clock.
The high frequency clock is provided on-module by a high-accuracy 32 MHz crystal as required by the
nRF52832 for radio operation.
The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast
clock, or externally by a 32.768 kHz crystal. An external crystal provides the lowest power
consumption and greatest accuracy. Using the internal RC oscillator with calibration provides
acceptable performance for Bluetooth low energy applications at a reduced cost and slight increase
in power consumption.
☞
The ANT protocol requires the use of an external crystal.
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BMD-350 - Data sheet
3.6.1
32.768 kHz crystal (LFXO)
Symbol
Parameter
FNOM_LFXO
Crystal frequency
1
Typ.
Max.
Unit
32.768
-
kHz
FTOL_LFXO_BLE
Frequency tolerance, Bluetooth low energy applications
-
±250
ppm
fTOL_LFXO_ANT
Frequency Tolerance, ANT applications1
-
±50
ppm
CL_LFXO
Load capacitance
-
12.5
pF
C0_LFXO
Shunt capacitance
-
2
pF
RS_LFXO
Equivalent series resistance
-
100
kΩ
Cpin
Input capacitance on XL1 & XL2 pads
4
-
pF
Table 7: 32.768 kHz crystal (LFXO)
3.6.2
32.768 kHz clock source comparison
Symbol
Parameter
Min.
Typ.
Max.
Unit
ILFXO
Current for 32.768 kHz Crystal oscillator
-
0.25
-
µA
ILFRC
Current for 32.768 kHz RC oscillator
-
0.6
1
µA
ILFSYNT
Current for 32.768 kHz Synthesized oscillator
-
100
-
µA
fTOL_LFXO_BLE
Frequency Tolerance, 32.768 kHz Crystal oscillator (Bluetooth low
energy Stack)1
-
-
±250
ppm
fTOL_LFXO_ANT
Frequency Tolerance, 32.768 kHz Crystal oscillator (ANT Stack) 1
-
-
±50
ppm
f TOL_LFRC
Frequency Tolerance, 32.768 kHz RC oscillator
-
-
±2
%
fTOL_CAL_LFRC
Frequency tolerance, 32.768 kHz RC after calibration
-
-
±250
ppm
fTOL_LFSYNT
Frequency Tolerance, 32.768 kHz Synthesized oscillator
-
-
±48
ppm
Table 8: 32.768 kHz clock source comparison
1
fTOL_LFXO_BLE and fTOL_LFXO_ANT are the maximum allowed for Bluetooth low energy and ANT applications. Actual tolerance depends
on the crystal used.
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BMD-350 - Data sheet
4 Firmware
u-blox recommends that projects for BMD-350 utilize nRF52832 tools and Nordic Semiconductor's
nRF5 SDK, DFU, and examples for any new development. These resources give access to the very
latest Bluetooth support from Nordic Semiconductor and provide an ongoing development path as
new features are released.
☞
For legacy applications, source code is provided through our GitHub repositories for RigDFU,
BMDware, Rigablue, developer tools, and mobile apps. The code allows customers to customize
and extend their own development applications.
Factory image
The factory programmed firmware version is indicated on the label. Programming of the factory image
is maintained solely for legacy applications. New development should use the latest Nordic
Semiconductor SDK and examples.
4.1.1
•
•
•
•
Firmware version “AA”
RigDFU v3.2.0 (42)
Nordic Semiconductor S132 SoftDevice v2.0.0
BMDware v3.1.0 (50)
Read-back protection enabled.
Modules can be programmed with customer code after a full-chip erase via the SWD interface.
☞
A full-chip erase will clear the assigned Public MAC address from memory. With Firmware Version
AA and AB, the MAC address must be manually recovered.
4.1.2
•
•
•
•
Firmware version “AB”
RigDFU v3.2.1 (43)
Nordic Semiconductor S132 SoftDevice v2.0.0
BMDware v3.1.1 (51)
Read-back protection enabled.
Modules can be programmed with customer code after a full-chip erase via the SWD interface.
☞
A full-chip erase will clear the assigned Public MAC address from memory. With Firmware Version
AA and AB, the MAC address must be manually recovered.
4.1.3
•
•
•
•
Firmware version “AC”
RigDFU v3.2.2 (44)
Nordic Semiconductor S132 SoftDevice v2.0.0
BMDware v3.1.1 (51)
Read-back protection disabled.
Modules can be programmed with customer code after a full-chip erase via the SWD interface.
☞
A full chip erase clears the assigned Public MAC address from memory; see Bluetooth device
address on how to retain it.
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4.1.4
•
•
•
•
Firmware version “AD”
RigDFU v3.3.1 (46)
Nordic Semiconductor S132 SoftDevice v3.1.0
BMDware v3.2.1 (60)
Read-back protection disabled.
Modules can be programmed with customer code after a full-chip erase via the SWD interface.
☞
A full chip erase clears the assigned Public MAC address from memory; see Bluetooth device
address on how to retain it.
4.1.5
Firmware version “AE”
• RigDFU v3.4.0 (47)
• Nordic Semiconductor S132 SoftDevice v3.1.0
• BMDware v3.2.1 (60)
• Read-back protection disabled.
Modules can be programmed with customer code after a full-chip erase via the SWD interface.
☞
A full chip erase clears the assigned Public MAC address from memory; see Bluetooth device
address on how to retain it.
☞
“AE” marked modules may not be loaded with previous factory firmware due to Nordic
Semiconductor nRF52832 Errata #108. “AA” through “AD” marked modules may be loaded with
any Factory Firmware version, including “AE”.
☞
Type number BMD-350-A-R-10 is loaded with firmware version “AE” only.
Module programming and read-back protection
For legacy applications, RigDFU allows for UART and OTA updates to RigDFU, the SoftDevice and
application firmware.
In order to utilize the SWD port on “AA” and “AB” marked modules, the nRF52832 must be erased and
recovered. Without this step, the module will not be recognized by most programmers. This is
accomplished through nrfjprog, which is provided with the Nordic Semiconductor command line
utilities:
nrfjprog -f nrf52 ––recover
☞
A full chip erase is performed, so all components must be reloaded (Bootloader, SoftDevice and
application firmware).
The BMD-350 module may be restored to the factory firmware versions noted above with the utilities
available at our GitHub repositories.
SoftDevices
Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled,
pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable
from the Nordic Semiconductor website. The BMD-350 with the nRF52832 SoC supports the S132
(Bluetooth low energy Central and Peripheral), S212 (ANT) and S312 (ANT and Bluetooth low energy)
SoftDevices.
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4.3.1
S132
The S132 SoftDevice is a Bluetooth® low energy (LE) Central and Peripheral protocol stack solution
supporting up to twenty connections with an additional Observer and a Broadcaster role all running
concurrently. The S132 SoftDevice integrates a Bluetooth LE Controller and Host and provides a full
and flexible API for building Bluetooth Smart nRF52 System on Chip (SoC) solutions.
4.3.2
S212
The S212 SoftDevice is an ANT™ protocol stack solution that provides a full and flexible Application
Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip.
The S212 SoftDevice simplifies combining the ANT protocol stack and an application on the same
CPU. See the ANT+ website for membership in the ANT+ Alliance and S212 licensing.
4.3.3
S332
The S332 SoftDevice is a combined ANT and Bluetooth low energy protocol stack solution. It supports
all four Bluetooth low energy roles (central, peripheral, observer, broadcaster) and ANT.
The S332 SoftDevice provides a full and flexible Application Programming Interface (API) for building
concurrent ANT and Bluetooth low energy System on Chip (SoC) solutions. It simplifies combining an
ANT and Bluetooth low energy protocol stack and an application on the same CPU, therefore
eliminating the need for an added device to support concurrent multiprotocol. See the ANT+ website
for membership in the ANT+ Alliance and S332 licensing.
Bluetooth device address
The BMD-350 module is preprogrammed from the factory with a unique public Bluetooth device
(MAC) address stored in the CUSTOMER[0] and CUSTOMER[1] registers of the User Information
Configuration Registers (UICR). The Bluetooth device address consists of the IEEE Organizationally
Unique Identifier (OUI) combined with the six hexadecimal digits that are printed on a 2D barcode and
in human-readable text on the module label, as described in Module marking. The Bluetooth device
address is stored in little endian format. The most significant bytes of the CUSTOMER[1] register are
0xFF to complete the 32-bit register.
UICR Register
Address
Description
Remarks
CUSTOMER[0]
0x10001080
Bluetooth_addr [0] (0xFF) Example value. Actual value printed on label
CUSTOMER[0]
0x10001081
Bluetooth_addr [1] (0xEE) Example value. Actual value printed on label
CUSTOMER[0]
0x10001082
Bluetooth_addr [2] (0xDD) Example value. Actual value printed on label
CUSTOMER[0]
0x10001083
Bluetooth_addr [3] (0xCC) IEEE OUI2,3
CUSTOMER[1]
0x10001084
Bluetooth_addr [4] (0xBB) IEEE OUI2,3
CUSTOMER[1]
0x10001085
Bluetooth_addr [5] (0xAA) IEEE OUI2,3
CUSTOMER[1]
0x10001086
0xFF
Unused
CUSTOMER[1]
0x10001087
0xFF
Unused
Table 9: Bluetooth device address
2
3
The IEEE OUI is 94:54:93 for type number BMD-350-A-R-00. The full Bluetooth device address is stored in the UICR.
Type number BMD-350-A-R-10 encodes the full Bluetooth device address in the label data matrix and is stored in the UICR.
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5 Mechanical specifications
Dimensions
All dimensions in mm
Figure 3: BMD-350 mechanical drawing
Recommended PCB land pads
All dimensions in mm
Figure 4: Recommended PCB land pads
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Module marking
5.3.1
Module marking for type number BMD-350-A-R-00
1
2
Figure 5: Module marking for type number BMD-350-A-R-00
Reference
Description
1
Data Matrix with unique serial number of six alphanumeric symbols, also in human-readable form. The full
Bluetooth address consists of the IEEE OUI (94:54:93) with the six symbols appended: Example value:
94:54:93:XX:YY:ZZ
2
First two characters indicate firmware version (AA, AB, AC, AD, or AE)
Table 10: Module marking for type number BMD-350-A-R-00
5.3.2
Module marking for type number BMD-350-A-R-10
1
2
3
4
5
Figure 6: Module marking for type number BMD-350-A-R-10
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Reference
Description
1
“U-BLOX” imprinted on silkscreen
2
PCB revision
3
Product name (Model)
4
Data Matrix with unique serial number of 19 alphanumeric symbols. The first 3 symbols represent module
type number unique to each module variant, the next 12 symbols represent the unique hexadecimal Bluetooth
device address of the module AABBCCDDEEFF, and the last 4 symbols represent the hardware and firmware
version encoded HHFF. Factory firmware version “AE” is encoded as “01” in the data matrix.
3+5
Product type number
Table 11: Module marking for type number BMD-350-A-R-10
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6 RF design notes
Recommended RF layout and ground plane
For the BMD-350, the integrated antenna requires a suitable ground plane to radiate effectively.
The area under and extending out from the antenna portion of the module should be kept clear of
copper and other metal on all layers. The module should be placed at the edge of the PCB with the
antenna edge facing out. Reducing the ground plane from that shown in Figure 7 will reduce the
effective radiated power.
Figure 7: Recommended RF layout and ground plane
Mechanical enclosure
Care should be taken when designing and placing the BMD-350 into an enclosure. Metal should be
kept clear from the antenna area, both above and below. Any metal around the module can negatively
impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting,
epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must
be evaluated by the customer.
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Antenna patterns
Antenna patterns are based on the BMD-350 Evaluation Kit with a ground plane size of
82 mm x 56 mm. The X-Y-Z orientation is shown in Figure 8.
Figure 8: BMD-350 Evaluation kit X-Y-Z orientation
6.3.1
X-Y plane
Figure 9: X-Y plane antenna pattern
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6.3.2
X-Z plane
Figure 10: X-Z plane antenna pattern
6.3.3
Y-Z plane
Figure 11: Y-Z plane antenna pattern
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7 BMD-350 evaluation development kit
BMD-350 is a full featured evaluation board that provides a complete I/O pin out to headers,
on-board programming and debugging, 32.768 kHz crystal, power and virtual COM port over USB, four
user LEDs, and four user buttons. The evaluation boards is optionally powered from a CR2032 coin
cell battery and includes current sense resistors and headers for convenient current measurements.
An Arduino Uno R3 style header is provided for easy prototyping of additional functions. The
evaluation boards also support programming off-board BMD-3 series, ANNA-B1, and NINA-B1/B3/B4
series modules.
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8 Qualification and approvals
United States (FCC)
BMD-350 has received Federal Communications Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.247 Modular
Transmitter approval. The modular approval allows the end user to integrate the module into a
finished product without obtaining subsequent and separate FCC approvals for intentional radiation,
provided no changes or modifications are made to the module circuitry. Changes or modifications
could void the user’s authority to operate the equipment. The end user must comply with all of the
instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all applicable FCC equipment authorizations
regulations, requirements and equipment functions not associated with the transmitter module
portion. For example, compliance must be demonstrated to regulations for other transmitter
components within the host product; to requirements for unintentional radiators (Part 15 Subpart B
“Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to
additional authorization requirements for the non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital
logic functions) as appropriate.
☞
Modification to this product will void the users’ authority to operate this equipment.
⚠
The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B
limits for unintentional radiators through an accredited test facility.
8.1.1
Labeling and user information requirements
The BMD-350 is assigned the FCC ID number: 2AA9B05
If the FCC ID is not visible when the module is installed inside another device, then the outside of the
finished product into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use the following or similar wording:
Contains FCC ID: 2AA9B05
In addition to marking the product with the appropriate FCC ID, the end product user manual may also
require specific information based on the digital device classification. Refer to the FCC Rules, Title 47,
Subchapter A, Part 15, Subpart B, Chapter §15.105 for specific wording of the notices.
8.1.2
RF exposure
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General
RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission (FCC).
This module is approved for installation into mobile and/or portable host platforms and must not be
co-located or operating in conjunction with any other antenna or transmitter except in accordance
with FCC multi-transmitter guidelines. End users must be provided with transmitter operating
conditions for satisfying RF Exposure compliance.
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Canada (ISED)
BMD-350 module is certified for use in Canada under Innovation, Science and Economic Development
Canada (ISED) Radio Standards Specification (RSS) RSS-247 and RSSGen.
8.2.1
Labeling and user information requirements
BMD-350 is assigned the IC ID number: 12208A-05
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry
Canada certification label of a module shall be clearly visible at all times when installed in the host
device, otherwise the host device must be labeled to display the Industry Canada certification number
of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or
similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 12208A-05
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada license exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals
for transmitters shall display the following notice in a conspicuous location:
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry
Canada. To reduce potential radio interference to other users, the antenna type and its gain
should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than
that necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son
gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas
l'intensité nécessaire à l'établissement d'une communication satisfaisante.
8.2.2
RF exposure
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio
Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). This
module is approved for installation into mobile and/or portable host platforms and must not be
co-located or operating in conjunction with any other antenna or transmitter except in accordance
with Industry Canada's multi-transmitter guidelines. End users must be provided with transmitter
operating conditions for satisfying RF Exposure compliance.
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European Union regulatory compliance
Information about regulatory compliance of the European Union for the BMD-350 module is available
in the BMD-350 Declaration of Conformity.
8.3.1
Radio Equipment Directive (RED) 2014/53/EU
BMD-350 complies with the essential requirements and other relevant provisions of Radio Equipment
Directive (RED) 2014/53/EU.
8.3.2
Labeling and user information requirements
The label on the final products which contain the BMD-350 module must follow CE marking
requirements. The “R&TTE Compliance Association Technical Guidance Note 01” provides guidance
on final product CE marking.
Japan (MIC)
BMD-350 has received type certification and is labeled with its own technical conformity mark and
certification number as required to conform to the technical standards regulated by the Ministry of
Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration
of this module into a final end product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed. Additional
testing may be required:
•
If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this
testing is required.
•
There is a voluntary Electromagnetic Compatibility (EMC) test for the host product
administered by VCCI: http://www.vcci.jp/vcci_e/index.html
The label on the end product which contains a BMD-350 module must follow the MIC marking
requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and
Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm.
The BMD-350 module is labeled with its assigned technical conformity mark and certification number.
The end product in which this module is being used must have an external label referring to the type
certified module inside:
Contains transmitter module with certificate number:
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Australia / New Zealand (RCM)
BMD-350 has been tested to comply with the AS/NZS 4268:2017, Radio equipment and systems –
Short range devices – Limits and methods of measurement. The report may be obtained from your
local FAE and may be used as evidence in obtaining permission to use the Regulatory Compliance
Mark (RCM).
Information on registration as a Responsible Party, license and labeling requirements may be found
at the following websites:
Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard2004
New Zealand: http://www.rsm.govt.nz/compliance
Only Australian-based and New Zealand-based companies who are registered may be granted
permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also
register as a Responsible Party to use the RCM on behalf of a company not in Australia or New
Zealand.
South Korea (KCC)
The BMD-350 is certified under Clause 2, Article 58-2 of the Radio Waves Act.
When a product containing the BMD-350 is placed on the South Korean market, the product must be
affixed with a label or marking containing the KCC logo and certification number as shown in the
following figure. This information must also be included in the product user manuals.
R-C-Rgd-BMD-350
The height of the KCC logo must be at least 5 mm.
Brazil (ANATEL)
BMD-350 is evaluated according to: Resolution 680 of 27/06/2017, Act 14448 of 04/12/2017,
Certificate number: 00857-21-05903.
The end products that contain these modules must list the ANATEL number from the modular
approval. The number can go on the end product label, manual, box or software, with the following
phrase:
Contains ANATEL approved module # 00857-21-05903
Eurasia (EAC)
BMD-350 is certified in Eurasia (EAC) with the following number:
The image of the unified product turnover sign EAC is a combination of three stylized letters E, A, and
C graphically shown using straight angles and having the same length and width as well as precise
square proportion against the light of contrasting background. Two versions are shown here:
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Marking Application Procedure and Rules:
•
•
•
•
The dimensions of the EAC marks are determined by the manufacturer (supplier) authorized to
use it.
The basic size is at least 5 mm.
Dimensions of the unified turnover sign must guarantee that is elements are accurate and visible
with unaided eye against the common color background of the object.
If unable to indicate on product, must be added to accompanying document.
Mexico (IFETEL)
The end products that contain these modules must list the IFETEL number from the modular
approval. The number can go on the end product label, manual, box or software, with the following
phrase:
Este equipo contiene el módulo BMD-350 con Número IFETEL: RCPRIBM18-1491
- or Este equipo contiene el módulo con IFT #: RCPRIBM18-1491
China (SRRC)
BMD-350 has received certification of conformity in accordance with the China MIIT Notice 2014-01
of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a
final product does not require additional radio certification, provided installation instructions are
followed and no modifications of the module are allowed. The BMD-350 is marked with the following
ID:
CMIIT ID: 2018DJ7255
Bluetooth qualification
The Bluetooth SIG maintains the Bluetooth specification and ensures that products are properly
tested and comply with the Bluetooth license agreements. Companies that list products with the
Bluetooth SIG are required to be members of the SIG and submit the listed fees. Refer to this link for
details: https://www.bluetooth.com/develop-with-bluetooth/qualification-listing
The BMD-350 Bluetooth Low Energy module based on the Nordic Semiconductor nRF52832 is listed
as a “Tested Component”, with Qualified Design ID 101018. This allows an end-product based on a
BMD-350 module to inherit the component listings without the need to run through all of the tests
again. The end-product will often inherit several QDIDs, and are identified on a “Declaration of
Compliance”.
The BMD-350 primarily utilizes the 132 SoftDevice.
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9 Environmental
RoHS
BMD-350 is in compliance with Directive 2011/65/EU, 2015/863/EU of the European Parliament and
the Council on the restriction of the use of certain hazardous substances in electrical and electronic
equipment. The RoHS declaration is available in the BMD-350 EU Declaration of Conformity [2].
REACH
BMD-350 does not contain the SVHC (Substance of Very High Concern), as defined by Directive
EC/1907/2006 Article according to REACH Annex XVII.
California proposition 65 (P65)
This product can expose you to Nickel (metallic), which is known to the State of California to cause
cancer. For more information go to www.P65Warnings.ca.gov.
☞
Warnings are not required where the listed chemical is inaccessible to the average user of the
end product.
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10 Product handling
Packaging
10.1.1 Reel packaging for type number BMD-350-A-R-00
Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic
bag with a desiccant pack and humidity card and placed in a 340x350x65 mm box. An antistatic
warning and reel label are adhered to the outside of the bag.
Figure 12 – Reel cartons
10.1.2 Reel packaging for type number BMD-350-A-R-10
Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic
bag with a desiccant pack and humidity card and placed in a 370x355x56 mm box. See the u-blox
Package Information Guide [1] for full specifications on reel dimensions, box sizes and shipping label
content. BMD-350-A-R-10 modules use u-blox reel type A2.
10.1.3 Carrier tape dimensions for type number BMD-350-A-R-00
Figure 13: Carrier tape dimensions for type number BMD-350-A-R-00
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10.1.4 Carrier tape dimensions for type number BMD-350-A-R-10
Figure 14: Carrier tape dimensions for type number BMD-350-A-R-10
Carrier tape orientation
BMD-350 modules are positioned in the carrier tape with the antenna oriented toward the sprocket
holes. See Figure 15.
2
1
Feed direction
Figure 15: Carrier tape orientation
☞
“Feed direction” is defined in such a way that at the customer’s assembly line a module is first
picked at position “1” and then at position “2”.
Moisture sensitivity level
The BMD-350 is rated for MSL 3, 168-hour floor life after opening.
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Reflow soldering
Figure 16: Reflow profile for lead free solder
ESD precautions
⚠
BMD-350 contains highly sensitive electronic circuitry and is an Electrostatic Sensitive Device
(ESD). Handling the BMD-350 module without proper ESD protection may destroy or damage
them permanently.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling
and operation of any application that incorporates the BMD-350 module. Failure to observe these
recommendations can result in severe damage to the device.
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11 Ordering information
Ordering Code
Product
BMD-350-A-R
BMD-350 module, Rev A, Tape and Reel, 1000-piece multiples
BMD-350-Eval
BMD-350 Evaluation Kit w/ SEGGER J-Link-OB debug probe
Table 12: Product ordering codes
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12 Life support and high-risk use warnings
This product is not designed nor intended for use in a life support device or system, nor for use in other
fault-intolerant, hazardous, or other environments requiring fail-safe performance, such as any
application in which the failure or malfunction of the product could lead directly or indirectly to death,
bodily injury, or physical or property damage (collectively, “High-Risk Environments”).
⚠
u-blox expressly disclaims any express or implied warranty of fitness for use in high-risk
environments.
The customer using this product in a High-Risk Environment agrees to indemnify and defend u-blox
from and against any claims and damages arising out of such use.
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Related documents
[1]
[2]
[3]
[4]
☞
u-blox package information guide, UBX-14001652
u-blox BMD-350 EU Declaration of Conformity, UBX-20002678
Nordic Semiconductor, nRF52832 Product Specification
Nordic Semiconductor, nRF5 Software Development Kit
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Page 36 of 37
BMD-350 - Data sheet
Revision history
Revision
Date
Name
0.8
06-Nov-2015
Initial preliminary release.
0.8.1
10-Nov-2015
Updated Table 5, Figure 5, Section 7.5. Corrected antenna references.
0.8.2
11-Nov-2015
Updated Figure 1.
0.8.3
20-Nov-2015
Updated current ratings from nRF52832 OPC v0.6.3. Corrected Table 3.
0.9
17-Mar-2016
Added BMD-301, GPIO notes, MSL, updated certifications, updated electrical
specifications
0.9.4
23-Mar-2016
Added BMD-301 antennas
1.0
04-May-2016
Production Release; removed pending for FCC, Japan (MIC), & Bluetooth
1.1
20-May-2016
Removed pending for IC, MIC (BMD-301)
1.2
03-Jun-2016
Added Factory Firmware Version AB information
1.3
06-Jun-2016
Updated Module Programming and Read-Back Protection section
1.4
07-Jul-2016
Added preliminary information for the BMD-350
1.5
28-Jul-2016
Added RigDFU and BMDware pin numbers, corrected nRF52832 PS link
1.6
10-Aug-2016
Corrected RESET pin number on BMD-350
1.7
10-Nov-2016
Updated layout drawings, added more BMD-350 data + certs
1.8
02-Dec-2016
Added BMD-350 Japan certificate number
10-Aug-2017
Add RED for BMD-300, BMD-301, BMD-350; Bluetooth DID for BMD-350, Factory
Firmware AD
1.10
29-Sep-2017
Added Bluetooth 5 QDIDs, Factory Firmware AE
1.11
17-Apr-2018
Added antenna gain in section 5
1.2
08-Oct-2018
Added BMDware, RigDFU, Rigablue notice in Section 8. Removed BMDware and
RigDFU pin-out sections 6.3 and 6.4. Called out BMD-300/301/350 in title rather
than “Series”
2.0
22-Jan-2019
Updated to new format
BMD-300, BMD-301, and BMD-350 are now in separate datasheets
Updated Life Support and other High-Risk Use Warning
2.1
11-Feb-2019
Corrected Figure 5 – Recommended PCB Land Pads. Added Bluetooth Mesh to
Features and Quick Specifications. Updated links to Nordic Semiconductor web
information.
R22
10-Jan-2020
brec
Document converted from Rigado to u-blox BMD-350 data sheet.
R23
03-Mar-2020
brec
Added type number BMD-350-A-R-10; Added label information for new type
number in section 5.3; Added ESD precautions in section 10.5; Changed images
to be u-blox branded; Added packaging specification for type number BMD-350A-R-10 in section 10.1.
R24
31-Mar-2020
brec
Updated product photo
R25
03-Feb-2021
brec
Corrected dimension rounding errors in chapters 1 and 5.
R26
22-Mar-2021
brec
Updated ANATEL certificate number
R27
28-Oct-2021
brec
Added reference to existing South Korea (KCC) certification
R28
16-May-2022
brec
Included KCC certification info in Table 1. Updated product status for type
number BMD-350-A-R-00 to Obsolete. Added Carrier tape orientation
information. Removed ambiguous description of operating condition ranges in
Electrical specifications.
1.9
Comments
Contact
For further support and contact information, visit us at www.u-blox.com/support.
UBX-19033354 - R28
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Revision history
Page 37 of 37