PDF文档中包含的物料型号为STM32F103C8T6,器件简介为ARM Cortex-M3内核的微控制器,引脚分配如下:
- 1: VBAT(Battery Supply)
- 2: PC13(ADC12_IN16)
- 3: PC14(OSC32_IN)
- 4: PC15(OSC32_OUT)
- 5: PF0(ADC3_IN8)
- 6: PF1(ADC3_IN9)
- 7: NRST
- 8: VSSA
- 9: VREF+
- 10: PA0(USART2_CTS, ADC1_IN0)
- 11: PA1(USART2_RTS, ADC1_IN1)
- 12: PA2(USART2_TX, ADC1_IN2)
- 13: PA3(USART2_RX, ADC1_IN3)
- 14: PA4(SPI1_NSS, SPI3_NSS, ADC1_IN4)
- 15: PA5(SPI1_SCK, TIM2_CH1, ADC1_IN5)
- 16: PA6(SPI1_MISO, TIM3_CH1, ADC1_IN6)
- 17: PA7(SPI1_MOSI, TIM3_CH2, ADC1_IN7)
- 18: PB0(ADC12_IN8)
- 19: PB1(ADC12_IN9)
- 20: PB2(ADC12_IN10)
- 21: PB10(USART3_TX, I2C2_SCL, TIM2_CH3)
- 22: PB11(USART3_RX, I2C2_SDA, TIM2_CH4)
- 23: PB12(SPI2_NSS, I2C2_SMBA, I2C2_SCL, CAN2_RX)
- 24: PB13(SPI2_SCK, I2C2_SDA, CAN2_TX)
- 25: PB14(SPI2_MISO, TIM12_CH1)
- 26: PB15(SPI2_MOSI, TIM12_CH2)
- 27: PC0(ADC12_IN1)
- 28: PC1(ADC12_IN2)
- 29: PC2(ADC12_IN3)
- 30: PC3(ADC12_IN4)
- 31: PC4(ADC12_IN5)
- 32: PC5(ADC12_IN6)
- 33: PB3(ADC12_IN11)
- 34: PB4(ADC12_IN12)
- 35: PB5(ADC12_IN13)
- 36: PB6(ADC12_IN14)
- 37: PB7(ADC12_IN15)
- 38: PB8(I2C1_SCL, TIM4_CH1)
- 39: PB9(I2C1_SDA, TIM4_CH2)
- 40: PC6(ADC12_IN7)
- 41: PC7(ADC12_IN8)
- 42: PC8(ADC12_IN9)
- 43: PC9(ADC12_IN10)
- 44: PA8(USART1_CK, SPI1_SCK, TIM1_CH1)
- 45: PA9(USART1_TX, SPI1_MISO, TIM1_CH2)
- 46: PA10(USART1_RX, SPI1_MOSI, TIM1_CH3)
- 47: PA11(USART1_CTS, SPI1_NSS, CAN1_RX)
- 48: PA12(USART1_RTS, SPI2_NSS, CAN1_TX)
- 49: PA13(JTMS/SWDIO)
- 50: VSS
- 51: VDD
- 52: PA14(JTCK/SWCLK)
- 53: PA15(JTDI)
- 54: PB16(I2C1_SDA)
- 55: PB17(I2C1_SCL)
参数特性包括工作温度范围-40~85℃,工作电压2.0~3.6V,内置64~512KB的闪存和20KB的RAM。
功能详解包括支持多种通信接口如USART、SPI、I2C,具有丰富的定时器和ADC通道,支持多种中断和异常处理。
应用信息广泛用于工业控制、消费电子、医疗设备等领域。
封装信息为LQFP64。