BTM511

A Datasheet BTM510/511 Multimedia Module Version 6.8 – Specific to FW v22.2.5.0 Note: For additional information on features and functionality of the BTM510/511, refer to the user guide and other documents found on the Laird Embedded Wireless Support site’s product page for this module. BTM510/511 Multimedia Module Datasheet REVISION HISTORY Version 1.0 Date 3/01/2012 Notes Initial Release Approver Jonathan Kaye 2.0 3.0 3/30/2012 4/13/2012 Updates and correct to firmware v18.1.3.0 Jonathan Kaye Jonathan Kaye 4.0 5.0 10/16/2012 1/10/2013 General reformatting edits Fixed Search bug. Jonathan Kaye Jonathan Kaye 6.0 6.1 3/22/2013 13 Jan 2014 Fixed general formatting and hyperlink issues Update FCC and IC statements Jonathan Kaye Sue White 6.2 6.3 6.4 06 Feb 2014 20 Feb 2014 15 Dec 2014 Jonathan Kaye Jonathan Kaye 6.5 6.6 6.7 6.8 22 Jan 2015 08 Jun 2015 15 Nov 2015 08 Feb 2017 Updated mechanical drawings Updated document for new firmware: v18.1.4.0/BTM51x - 08 Separated document into two docs: Hardware Integration Guide and User Guide Updated Bluetooth SIG Qualification section Removed USB D+ and USB D- references Changed USB references to UART Fixed module height Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 2 © Copyright 2017 Laird. All Rights Reserved Jonathan Kaye Jonathan Kaye Jonathan Kaye Andrew Chen Andrew Chen Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet CONTENTS 1 Overview ............................................................................................................................................................4 Features .................................................................................................................................................................4 Application Areas....................................................................................................................................................4 2 Specifications......................................................................................................................................................5 2.1 Detailed Specifications ...............................................................................................................................5 2.2 Pin Definitions ............................................................................................................................................6 2.3 Operating Parameters ................................................................................................................................9 2.4 Voltage Specifications ................................................................................................................................9 2.5 Audio Design Requirements .......................................................................................................................9 2.5.1 Speaker Output................................................................................................................................ 11 3 FCC Regulatory Statements ............................................................................................................................. 11 3.1 BTM510 FCC and Industry Canada Statements ....................................................................................... 11 3.1.1 Considerations for OEM integration: .............................................................................................. 11 3.1.2 FCC Labelling Requirement.............................................................................................................. 11 3.2 BTM511 FCC and Industry Canada Statements ....................................................................................... 12 3.2.1 Considerations for OEM Integration ............................................................................................... 12 3.2.2 FCC Labelling requirement .............................................................................................................. 12 4 EU Declaration of Compliance......................................................................................................................... 12 4.1 Declaration of Conformity – BTM510...................................................................................................... 12 4.1.1 Declaration ...................................................................................................................................... 13 4.2 Declaration of Conformity – BTM511...................................................................................................... 13 4.2.1 Declaration ...................................................................................................................................... 14 5 Mechanical Drawings ...................................................................................................................................... 15 5.1 BTM510 Mechanical Drawings ................................................................................................................ 15 5.4 BTM511 Mechanical Diagrams ................................................................................................................ 17 6 Ordering Information ...................................................................................................................................... 20 6.1 General Comments .................................................................................................................................. 20 7 Application Note.............................................................................................................................................. 20 7.1 Introduction ............................................................................................................................................. 20 7.2 Shipping ................................................................................................................................................... 20 7.3 Reflow Parameters .................................................................................................................................. 21 8 Bluetooth SIG Qualification ............................................................................................................................. 22 9 Additional Assistance ...................................................................................................................................... 23 10 Related Documents and Files .......................................................................................................................... 23 Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 3 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 1 OVERVIEW The BTM510 and BTM511 are low-power Bluetooth® modules designed for adding robust audio and voice capabilities. Based on the market-leading Cambridge Silicon Radio BC05 chipset, these modules provide exceptionally low power consumption with outstanding range. Supporting Bluetooth v3.0 specification, these modules provide the important advantage of secure simple pairing that improves security and enhances easy use. At only 14 mm x 20 mm, the compact size of the BTM510 is ideal for battery-powered or headset form factor audio and voice devices. With a 16-bit stereo codec and microphone inputs to support both stereo and mono applications, these modules also contain a full, integrated Bluetooth-qualified stack along with SPP, HFP 1.6, HSP, AVRCP v1.5, and A2DP profiles. The BTM510/511 modules include an embedded 32-bit, 64-MIPS DSP core within the BC05. This is integrated with the Bluetooth functionality which allows designers to add significant product enhancements including features such as echo cancellation, noise reduction, and audio enhancement using additional soft codecs. The availability of the 16MB of flash memory in the module allows complex functionality to be included. DSP routines can be licensed through a number of specialist partners. Typical applications for these modules include Bluetooth stereo headsets, VoIP phones, and wireless audio links. To speed product development and integration, Laird Technologies has developed a comprehensive AT command interface that simplifies application development, including support for audio and headset functionality. Access to GPIO pins allows mapping for direct connection to actuator buttons on headsets. Combined with a low-cost development kit, Laird Technologies’ Bluetooth® modules provide faster time to market. Application Areas Features                 Fully featured Bluetooth® multimedia module Bluetooth® v3.0 (FW v22.2.5.0 onwards) Supports mono and stereo headset applications Adaptive Frequency Hopping to cope with interference from other wireless devices 32-bit Kalimba DSP for enhanced audio applications Support for Secure Simple Pairing External or internal antenna options HSP, HFP, A2DP, and AVRCP audio profiles 16-bit stereo codec and microphone input Integrated audio amplifiers for driving stereo speaker Comprehensive AT interface for simple programming Bluetooth END product qualified Compact size Class 2 output – 4 dBm Low power operation Wi-Fi co-existence hardware support Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp          High-quality stereo headsets Mono voice headsets Hands-free devices Wireless audio cable replacement MP3 and music players Phone accessories VoIP products Cordless headsets Automotive 4 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 2 SPECIFICATIONS 2.1 Detailed Specifications Table 1: Detailed specifications Categories Wireless Specification Antenna Modes UART Interface General Purpose Interface Feature Standards Supported Transmit Class Frequency Channels Maximum Transmit Power Minimum Transmit Power Receive Sensitivity Data Transfer Rate Range External Antenna Integrated Antenna Serial Interface Baud Rate Bits Parity Stop bits Default Serial parameters Levels Modem Control I/O I2S LED Audio Codec Amplifiers Microphone Sample Rates (DAC and ADC) Protocols and Firmware Bluetooth® Stack Profiles Protocols Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp Implementation Bluetooth® v3.0 Class 2 2.402 – 2.480 GHz 79 channels Frequency Hopping Adaptive Frequency Hopping +4 dBm @ antenna pad – BTM510 +4 dBmi from integrated antenna – BTM511 -27 dBm @ antenna pad – BTM510 -27 dBmi from integrated antenna – BTM511 Better than -86 dBm Up to 300 kbps Up to 30 meters 50 Ohm matched SMT pad – BTM510 +0 dB multilayer ceramic – BTM511 RS-232 bi-directional for commands and data 16550 compatible Configurable from 1,200 to 921,600 bps Non-standard baud rates supported 8 Odd, even, none 1 or 2 9600,n,8,1 4 general purpose I/O pins Stereo Audio Digital Interface Bus 2 Integrated stereo codec with -95 dB SNR for DAC Direct drive for 16 Ω Speakers Input for low noise microphone 8, 11.025, 16, 22.05, 32 & 44.1kHz V3.0 compliant. Fully integrated. GAP Generic Access Profile SDP Service Discovery Profile SPP Serial Port Profile HSP – Audio Gateway and Headset unit HFP v1.6 – Audio Gateway and Handsfree A2DP – Source and Sink AVRCP v1.5 – Target and Controller RFCOMM AVCTP AVDTP 5 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Categories Command Interface Feature AT Instruction set DSP Kalimba DSP Current Consumption Supply Voltage Coexistence / Compatibility Connections Physical Environmental Approvals Miscellaneous Development Tools 2.2 Applications Data Transfer Stereo Music Low Power Sniff Mode Supply I/O UART WLAN (802.11) External Antenna (option) Interface Dimensions Weight Operating Temperature Storage Temperature Bluetooth® FCC MIC CE and R&TTE Lead free Warranty Development Kit Implementation Comprehensive control of connection and module operation, including extensions for Audio control. Direct mapping of GPIO to audio functions, e.g. Play, Volume, etc. S Registers for non-volatile storage of parameters Integrated in BC05 32bit, 64MIPS, 16 Mbps Flash Memory (shared) Available from partners Typically < 35 mA Typically < 70 mA (including speaker drive) Less than 1.5 mA 3.0 V – 3.6 V DC 1.7 V – 3.6 V DC 1.7 V – 3.6 V DC 2-wire and 3-wire hardware coexistence schemes supported Pad for 50 Ohm antenna – BTM510 Surface Mount Pads 14.0 mm x 20.0 mm x 2.9 mm - BTM510 14.0 mm x 25.0 mm x 2.9 mm - BTM511 3 grams -40° C to +85° C -40° C to +85° C Qualified as an END product Limited Modular Approval – BTM510 Modular Approval (Integrated Antenna – BTM511) (Japan) Previously TELEC Meets CE and R&TTE requirements Lead-free within EU requirements and RoHS compliant 1-Year Warranty Development board and software tools Pin Definitions Table 2: Pin definitions Pin 1 2 3 4 5 6 7 8 9 10 11 Signal GPIO_8 / DTR GPIO_5 / BT_STATE / BT_PRIORITY PCM_IN PCM_OUT PCM_SYNC PCM_CLK LED_EXT1 LED_EXT0 GND VDD_UART VDD_IO Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp Description Host I/O Host I/O, BT Co-existence Voltage Specification VIO VIO PCM Data I/P PCM Data O/P PCM Sync I/P PCM CLK I/P Host I/O Host I/O VIO VIO VIO VIO See Note 2 See Note 2 UART supply voltage I/O supply voltage 6 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Pin 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Signal VDD_IN GND SPI_CSB SPI_MISO SPI_CLK SPI_MOSI GPIO_3 / DSR GPIO_4 / RI GPIO_2 / DCD GPIO_1 / BT_ACTIVE GND AUDIO_GND SPKR_A_N SPKR_A_P SPKR_B_N SPKR_B_P MIC_BIAS MIC_BP_C MIC_BN_C MIC_AP_C MIC_AN_C Unused 34 ANT 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 Unused Unused Unused Unused Unused Unused Unused Unused Unused Unused Unused Unused GND UART_RTS UART_CTS UART_TX UART_RX GPIO_7 / RF_Active GPIO_6 / WLAN_ACTIVE Reset Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp Description Main supply voltage Voltage Specification SPI bus chip select I/P SPI bus serial O/P SPI bus clock I/P SPI bus serial I/P Host I/O Host I/O Host I/O Host I/O, BT Co-existence VIO VIO VIO VIO VIO VIO VIO VIO Audio ground Speaker, channel A- (left) Speaker, channel A+ (left) Speaker, channel B- (right) Speaker, channel B+ (right) Microphone bias Microphone, channel B+ (right) Microphone, channel B- (right) Microphone, channel A+ (left) Microphone, channel A- (left) See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements See Audio Design Requirements Antenna connection – BTM510 only (50 ohm matched) Request to Send O/P Clear to Send I/P Transmit data O/P Receive data I/P Host I/O, BT Co-existence Host I/O, BT Co-existence Module reset I/P 7 © Copyright 2017 Laird. All Rights Reserved VUSB VUSB VUSB VUSB VIO VIO See Note 1 Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Note: 1. Reset input is active low. Input is pulled up to VDD_IN via 22 k. Minimum reset pulse width is 5 ms. 2. LED drive pins are open drain outputs, so the external circuit to the right should be used. The voltage on the module pad should be maintained below 0.5 V in which case the RON of the FET is around 20 Ω. If this condition is met, the current flowing through the diode is as follows: Where VF is the forward bias voltage of the LED. Figure 1: Microphone mode The input impedance on the microphone inputs (in microphone mode) is typically 6kΩ. The audio input is designed for use with inputs of between 1 μA and 10 μA at 94 dB SPL. If the biasing resistors are set to 1 kΩ, this implies a microphone with sensitivity in the range -40 dBV to -60 dBV. The low pass filter elements formed by the inductor and capacitor are necessary to eliminate RF pick up on the microphone inputs and should be placed as close to the module as possible. When operating in line input mode, the input can be connected directly to the module input pins in either single or double ended configuration as follows: Figure 2: Line input mode Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 8 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 2.3 Operating Parameters Table 3: Operating parameters Recommended Operating Conditions Operating Condition VDD_UART VDD_IO VDD_IN 2.4 Min 1.7 1.7 3.0 Max 3.6 3.3 3.6 Voltage Specifications Table 4: Voltage specifications (VUART) Logic Levels (VUART) Input Voltage Levels Vih Vil OUTPUT VOLTAGE LEVELS Voh (Iout = -4mA) Vol (Iout = 4mA) Min 0.7VDD_UART -0.4 Typical Max +0.8 VDD_UART – 0.4 0 0.4 Table 5: Voltage specifications (VIO) Logic Levels (VIO) INPUT VOLTAGE LEVELS Vih Vil Output Voltage Levels Voh (Iout = -4mA) Vol (Iout = 4mA) MIN 0.625 VDD_UART -0.3 TYPICAL 0.75VDD_IO 0 MAX VDD_IO+0.3 0.25VDD_IO VDD_IO 0.125 Notes for PCB layout: 1. The RF output pin must match to a 50 Ω strip-line or coplanar waveguide on the BTM510 (no antenna). 2. Ensure there are no exposed conductors under the module to avoid shorts to the module test points. 3. The PCB footprint is provided for guidance only. Users may wish to modify the PCB land dimensions to suit their specific manufacturing or process. 2.5 Audio Design Requirements The audio inputs of the BTM510/511 can operate in either line input mode or microphone mode. The input circuit has a two stage amplifier – the first stage provides a fixed 24 dB gain and the second a variable gain of between -3 dB and 18 dB. If an input gain of less than 24 dB is selected, then the first stage is switched out and the module is operating in line input mode. The BTM511 can support both Single-Ended and Fully Differential Stereo Line Input (Figure 3). Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 9 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Figure 3: Single and Double Ended Line Inputs A 15nH / 15pF low pass filter must be added to each input line and placed as close to the BTM511 input pins as possible. Otherwise the BT envelope may be demodulated, causing audio artifacts in the 800 – 1600kHz range that cannot be removed. If using single-ended line input, it is only necessary to fit one low pass filter per channel. For both Stereo Line In and Microphone modes, you may connect the input signal to either the positive or negative side of the input. The unused input should be connected to either MIC_BIAS or AGND (Note: The ADK-BTM511-v04 design fits one low pass filter on each of the 4 channel inputs). The Left channel (MIC_AP_C / MIC_AN_C) should be used as the standard mono channel, the Right channel inputs (MIC_BP_C / MIC_BN_C) can be used as an auxiliary mono channel or connected to AGND if unused (Remember to fit the low pass filter on one or both of the unused Right channel inputs). A typical line input signal has a voltage of 1.75Vrms or 5Vpk-pk. However, the BTM511 can only tolerate 0.4Vrms on the audio inputs. A resistive network can be used to divide the input signal down to 0.4Vrms if necessary. The audio inputs can operate in either line input mode or microphone mode. The input circuit has a two stage amplifier – the first stage provides a fixed 24 dB gain and the second a variable gain of between -3 dB and 18 dB. If an input gain of less than 24 dB is selected, then the first stage is switched out and the module is operating in line input mode. When operating in microphone mode the microphone should be biased as shown in Figure 4. Figure 4: Microphone biasing for microphone mode Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 10 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet The input impedance on the microphone inputs (in microphone mode) is typically 6kΩ. The audio input is designed for use with inputs of between 1 μA and 10 μA at 94 dB SPL. If the biasing resistors are set to 1 kΩ, this implies a microphone with sensitivity in the range -40 dBV to -60 dBV. 2.5.1 Speaker Output The speaker output is capable of driving loads with a minimum impedance of 16Ω directly. 3 FCC REGULATORY STATEMENTS 3.1 BTM510 FCC and Industry Canada Statements The Final Equipment user manual must show the following statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be colocated or operating to conjunction with any other antenna or transmitter. 3.1.1 Considerations for OEM integration: This module has a limited modular approval. Approval with any other antenna configuration or layout other than that approved will necessitate additional radiated emission testing to be performed. To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. This module was approved with the following antenna: RF Solutions: ANT-24G-WHJ-SMA 0 dBi Operation of this module with any other antenna will require additional testing to be performed. Co-location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification. Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment ≤ 60/f (GHz) i.e. 25 mW for a 2.4 Ghz device. The Maximum Power Exposure for the BTM510 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices. 3.1.2 FCC Labelling Requirement If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 11 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet use wording such as the following: “Contains Transmitter Module FCC ID: PI4510B” or “Contains FCC ID: PI4510B.” Any similar wording that expresses the same meaning may be used. 3.2 BTM511 FCC and Industry Canada Statements The user manual must show the following statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. To comply with the FCC RF exposure compliance requirements, this device and its antenna must not be colocated or operating to conjunction with any other antenna or transmitter. 3.2.1 Considerations for OEM Integration To inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Co-location with other radio transmitting devices operating concurrently in the same band requires additional testing and certification. Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment ≤ 60/f (GHz) i.e. 25 mW for a 2.4 Ghz device. The Maximum Power Exposure for the BTM511 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization policies for mobile and portable devices. 3.2.2 FCC Labelling requirement If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: PI4511B” or “Contains FCC ID: PI4511B.” Any similar wording that expresses the same meaning may be used. 4 EU DECLARATION OF COMPLIANCE 4.1 Declaration of Conformity – BTM510 Manufacturer: Laird Technologies Product: BTM510 EU Directive: RTTE 1995/5/EC Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 12 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Reference standards used for presumption of conformity: Article Requirement # Reference standard(s): Health and Safety IEC 60950-1:2005 (2nd Ed); +Am 1:2009 +Am2:2013; EN 60950-1: 2006+A11+A1:2010+A12:2011+A2:2013 3.1b Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions: EN55022:2010 /AC:2011, Class B Immunity: EN61000-4-2:2009 EN61000-4-3:2006 /A1:2008/A2:2010 3.2 Means of the efficient use of EN 300 328 V1.8.1 (2012-06) the radio frequency spectrum 3.1a 4.1.1 Declaration We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose. Place of Issue: Laird 11160 Thompson Ave. Lenexa, KS 66219 USA Date of Issue: February 2015 Name of Authorized Person: Daniel Waters/Certifications Specialist Signature: 4.2 Declaration of Conformity – BTM511 Manufacturer: Laird Technologies Product: BTM511 EU Directive: RTTE 1995/5/EC Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 13 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet Reference standards used for presumption of conformity: Article Requirement # Reference standard(s): Health and Safety IEC 60950-1:2005 (2nd Ed); +Am 1:2009 +Am2:2013; EN 60950-1: 2006+A11+A1:2010+A12:2011+A2:2013 3.1b Protection requirements with respect to electromagnetic compatibility EN 301 489-1 V1.9.2 (2011-09) EN 301 489-17 V2.2.1 (2012-09) Emissions: EN55022:2010 /AC:2011, Class B Immunity: EN61000-4-2:2009 EN61000-4-3:2006 /A1:2008/A2:2010 3.2 Means of the efficient use of EN 300 328 V1.8.1 (2012-06) the radio frequency spectrum 3.1a 4.2.1 Declaration We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose. Place of Issue: Laird 11160 Thompson Ave. Lenexa, KS 66219 USA Date of Issue: February 2015 Name of Authorized Person: Daniel Waters/Certifications Specialist Signature: Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 14 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 5 MECHANICAL DRAWINGS 5.1 BTM510 Mechanical Drawings Notes: An area of 1.5 mm around the module should be reserved as a keep-out area. The Development Kit Schematics for this product can be accessed from the following link: Development Kit Schematics – BTM510 Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 15 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 5.2 Note: 5.3 BTM510 Mechanical Diagrams An area of 1.5 mm around the module should be reserved as a keep-out area. The Development Kit Schematics for this product can be accessed on the software downloads tab of the BTM51x product page. BTM510 Mechanical Diagrams WARNING: Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp Test point dimensions are for reference only. DO NOT make electrical connections to these test points. This voids the warranty. Laird does not recommend routing on the top layer underneath the module. 16 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 5.4 Note: BTM511 Mechanical Diagrams An area of 1.5 mm around the module should be reserved as a keep-out area. The Development Kit Schematics for this product can be accessed on the software downloads tab of the BTM51x product page. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 17 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 5.5 Note: BTM511 Mechanical Diagrams An area of 1.5 mm around the module should be reserved as a keep-out area. The Development Kit Schematics for this product can be accessed on the software downloads tab of the BTM51x product page. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 18 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 5.6 BTM511 Mechanical Diagrams 5.7 BTM511 Mechanical Diagrams WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points. This voids the warranty. Laird does not recommend routing on the top layer underneath the module. Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 19 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 6 ORDERING INFORMATION Part Number BTM510 Description Bluetooth® Multimedia Module (external antenna) BTM511 Bluetooth® Multimedia Module with integrated antenna DVK – BTM510 Development Board with BTM510 soldered in place DVK – BTM511 Development Board with BTM511 soldered in place 6.1 General Comments Refer to the schematic BTV-R-003.pdf for the Development Kit on the following two pages for examples of typical pin connections. A PDF of the schematic can be downloaded from the product web page. 7 APPLICATION NOTE 7.1 Introduction Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This application note provides additional guidance beyond the information that is presented in the user’s manual. This application note is a living document and is updated as new information is presented. The modules are designed to meet the needs of many commercial and industrial applications. The modules are designed to be easily manufactured and conform to current automated manufacturing processes. 7.2 Shipping Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and place machines. Layouts of the trays are provided in Figure 5. Detail A Notes: 1) Material must be capable of discharging an electro-static charge (ESD), and symbol must be located as shown. Detail B R 0.050 Detail B Pocket Wall Angles 0.602 Pocket Corner Detail 92.0° 0.707 88.0° 2) Laird Part Number must be embossed into the carrier at this location. 0.813 R 0.50 Detail A 0.602 0.202 3) Exterior edges may be modified to allow for ‘stamping’ tray, as long as outside maximum dimension is not exceeded. 0.176 Top and Bottom Radius r = 0.025" 0.804 1.010 4) Dimensions: All dimensions are in inches (unless otherwise shown) Radius Acceptable (0.25" maximum) 4.019 5) Tolerances: x.xx +/- 0.010 x.xxx +/- 0.005 angles +/- 1 degree (unless otherwise shown) 3.119 Reference Assemblies 1.319 1.231 BTM 510 0.143 0.551 0.787 0.524 0.419 1.126 2.219 5.250 BTM 511 0.143 1 0.551 Laird-5200-00021 0,0 0.156 0.984 2 0.313 3 0,0 + 0.0 - 0.010 1.645 2.745 3.845 4.945 6.045 7.145 8.245 9.345 10.445 Telematics - Lenexa 1.555 0.749 1.351 Title 0.545 BTM510/11 Voice Shipping Tray 12.000 Dwg. No. Drawn by 5200-00021 drk Date 8-10-09 Rev Sheet 1 1/1 Figure 5: BTM510 and BTM511 shipping tray detail Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 20 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 7.3 Reflow Parameters Laird surface mount modules are designed to be easily manufactured including reflow soldering to a PCB. It is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform to J-STD020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds. Target Profile Soak Min Soak Max Liquidous Lower Target Upper Target Absolute Peak Figure 6: Recommended reflow temperature Temperatures should not exceed the minimums or maximums presented in Table 7-1: Recommended maximum and minimum temperatures. Table 7-1: Recommended maximum and minimum temperatures Specification Temperature Inc./Dec. Rate (max) Temperature Decrease rate (goal) Soak Temp Increase rate (goal) Flux Soak Period (min) Flux Soak Period (max) Flux Soak Temp (min) Flux Soak Temp (max) Time Above Liquidous (max) Value 3 2-3 .5 - 1 60 90 150 190 60 Unit °C / Sec °C / Sec °C / Sec Sec Sec °C °C Sec Time Above Liquidous (min) Time In Target Reflow Range (goal) Time At Absolute Peak (max) Liquidous Temperature (SAC305) Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature 20 30 30 217 225 250 260 Sec Sec Sec °C °C °C °C Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 21 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 8 BLUETOOTH SIG QUALIFICATION The BTM510 and BTM511 modules are listed on the Bluetooth SIG website as qualified End Products. Design Name BTM510, BTM511 Owner Declaration ID Link to listing on the SIG website Laird D023160 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=23160 It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to registered as a member of the Bluetooth SIG – www.bluetooth.org The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document: https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm. In step 1, select the option, Reference a Qualified Design and enter 16227 in the End Product table entry. You can then select your pre-paid Declaration ID from the drop down menu or go to the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card, it will not be possible to proceed until the SIG invoice is paid. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 22 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 BTM510/511 Multimedia Module Datasheet 9 ADDITIONAL ASSISTANCE Please contact your local sales representative or our support team for further assistance: Laird Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com Phone: Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Web: http://www.lairdtech.com/bluetooth 10 RELATED DOCUMENTS AND FILES The following additional BTM510/511 technical documents are also available from the Laird BTM51x Series product page of the Embedded Wireless Support site under the Documentation tab:   BTM510/511 Product Brief BTM510/511 User Manual Firmware   BTM510/511 Firmware Files BTM510/511 Firmware Release Notes - Version 18.1.4.0 Development Kit Schematics    BTM510 Development Kit Schematics BTM511 Development Kit Schematics BTM511 Development Kit Schematics - Version 4 Development Kit Documentation     BTM511 Development Kit Quick Start A2DP and AVRCP - Version 2 BTM511 Development Kit Quick Start HFP - Version 2 BTM511 Development Kit Quick Start SPP - Version 2 BTM511 Audio Development Kit (ADK) User Manual - Version 4 The following download are also available from the Laird BTM51x Series product page:  Laird (EZURiO) Terminal v6.9.0.zip Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/ramp 23 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610