IRF540NPBF
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N-Channel 100-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
100
rDS(on) (Ω)
ID (A)
0.032 at VGS = 10 V
45
0.035 at VGS = 4.5 V
40
• TrenchFET® Power MOSFETS
• 175 °C Junction Temperature
• Low Thermal Resistance Package
Available
RoHS*
COMPLIANT
D
TO-220AB
G
G D S
S
Top View
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energya
Maximum Power Dissipationa
L = 0.1 mH
TC = 25 °C
TA = 25 °Cc
Operating Junction and Storage Temperature Range
ID
Unit
V
45
30
IDM
135
IAR
35
EAR
61
A
mJ
b
PD
127
3.75
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
RthJA
40
RthJC
1.4
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
(PCB Mount)c
Junction-to-Case (Drain)
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply.
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VSS = 0 V, ID = 250 µA
100
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
± 100
VDS = 100 ,VVGS = 0 V
1
VDS = 80 V, VGS = 0 V, TJ = 125 °C
50
VDS = 80 V, VGS = 0 V, TJ = 175 °C
250
VDS ≥ 5 V, VGS = 10 V
ID(on)
Drain-Source On-State Resistancea
rDS(on)
75
0.032
VGS = 4.5 V, ID = 3 A
0.035
VGS = 10 V, ID = 5 A, TJ = 125 °C
Forward Transconductance
gfs
VDS = 15 V, ID = 15 A
V
nA
µA
A
VGS = 10 V, ID = 5 A
Ω
0.050
VGS = 10 V, ID = 3 A, TJ = 175 °C
a
3
0.065
10
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
90
Total Gate Chargec
Qg
35
c
2400
VGS = 0 V, VDS = 25 V, f = 1 MHz
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
9
RG
1.7
Gate Resistance
Turn-On Delay Time
c
Rise Timec
Turn-Off Delay Timec
Fall Timec
VDS = 50 V, VGS = 10 V, ID = 40 A
td(on)
tr
td(off)
VDD = 50 V, RL = 1.25 Ω
ID ≅ 40 A, VGEN = 10 V, RG = 2.5 Ω
tf
pF
270
60
nC
11
Ω
11
20
12
20
30
45
12
20
ns
Source-Drain Diode Ratings and Characteristics TC = 25 °Cb
IS
40
Pulsed Current
ISM
120
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 30 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 30 A, di/dt = 100 A/µs
A
1.0
1.5
V
60
100
ns
5
8
A
0.15
0.4
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
75
75
VGS = 10 thru 5V
60
45
ID - Drain Current (A)
I D - Drain Current (A)
60
4V
30
45
30
TC = 125 °C
15
15
25 °C
2V
- 55 °C
0
0
0
2
4
6
8
0
10
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
100
0.10
TC = - 55 °C
r DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
80
25 °C
60
125 °C
40
0.08
0.06
VGS = 4.5V
0.04
20
VGS = 10 V
0.02
0
0
15
30
45
60
0
75
15
30
75
On-Resistance vs. Drain Current
3500
20
VGS - Gate-to-Source Voltage (V)
Ciss
2800
C - Capacitance (pF)
60
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
2100
1400
700
Crss
VDS = 50 V
ID =10 A
16
12
8
4
Coss
0
0
0
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45
20
40
60
80
100
0
10
20
30
40
50
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
Capacitance
Gate Charge
60
70
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.5
100
VGS = 10 V
ID = 15 A
I S - Source Current (A)
(Normalized)
r DS(on) - On-Resistance
2.0
1.5
0.8
TJ = 150 °C
10
TJ = 25 °C
0.4
0.0
- 50
- 25
0
25
50
75
100
125
150
1
0
175
0.9
1.2
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
Drain-Source Breakdown Voltage (V)
130
100
I Dav (A)
0.6
On-Resistance vs. Junction Temperature
1000
10
IAV (A) at TA = 25 °C
1
IAV (A) at TA = 150 °C
0.1
0.00001
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0.3
0.0001
0.001
0.01
0.1
1
ID = 10 mA
125
120
115
110
105
100
95
- 50
- 25
0
25
50
75
100
125
150
tin (s)
TJ - Junction Temperature (°C)
Avalanche Current vs. Time
Drain-Source Breakdown Voltage
vs. Junction Temperature
175
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THERMAL RATINGS
1000
50
100
I D - Drain Current (A)
I D - Drain Current (A)
40
30
20
10
0
0
25
50
75
100
125
150
Limited
by rDS(on)*
10 µs
10
100 µs
1 ms
10 ms
1
0.1
0.1
175
TC - Ambient Temperature (°C)
1
* VGS
Maximum Avalanche and Drain Current
vs. Case Temperature
DC, 100 ms
TC = 25 °C
Single Pulse
10
100
1000
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
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TO-220AB
MILLIMETERS
A
E
F
D
H(1)
Q
ØP
3
2
L(1)
1
M*
L
b(1)
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
0.040
b
0.69
1.01
0.027
b(1)
1.20
1.73
0.047
0.068
c
0.36
0.61
0.014
0.024
D
14.85
15.49
0.585
0.610
E
10.04
10.51
0.395
0.414
e
2.41
2.67
0.095
0.105
e(1)
4.88
5.28
0.192
0.208
F
1.14
1.40
0.045
0.055
H(1)
6.09
6.48
0.240
0.255
J(1)
2.41
2.92
0.095
0.115
L
13.35
14.02
0.526
0.552
L(1)
3.32
3.82
0.131
0.150
ØP
3.54
3.94
0.139
0.155
Q
2.60
3.00
0.102
0.118
ECN: X12-0208-Rev. N, 08-Oct-12
DWG: 5471
Notes
* M = 1.32 mm to 1.62 mm (dimension including protrusion)
Heatsink hole for HVM
C
b
e
J(1)
e(1)
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