ES3GC

山东晶导微电子有限公司 ES3AC THRU ES3JC Jingdao Microelectronics Surface Mount Superfast Recovery Rectifier Reverse Voltage – 50 to 600 V Forward Current –3 A PINNING PIN FEATURES • For surface mounted applications • Low profile package • Glass Passivated Chip Junction • Superfast reverse recovery time • Lead free in comply with EU RoHS 2011/65/EU directives DESCRIPTION 1 Cathode 2 Anode 2 1 MECHANICAL DATA • Case : SMC • Terminals: Solderable per MIL-STD-750, Method 2026 • A pprox. Weight : 0.22g / 0.0077oz Top View Marking Code: ES3A~ES3J Simplified outline SMC and symbol Absolute Maximum Ratings and Characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Symbols Parameter ES3AC ES3BC ES3CC ES3DC ES3EC ES3GC ES3JC Units Maximum Repetitive Peak Reverse Voltage V RRM 50 100 150 200 300 400 600 V Maximum RMS voltage V RMS 35 70 105 140 210 280 420 V Maximum DC Blocking Voltage V DC 50 100 150 200 300 400 600 V Maximum Average Forward Rectified Current at T c = 125 °C I F(AV) 3 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load I FSM 90 A Maximum Forward Voltage at 3 A VF Maximum DC Reverse Current T a = 25 °C at Rated DC Blocking Voltage T a =125 °C Typical Junction Capacitance at V R =4V, f=1MHz Maximum Reverse Recovery Time （1） Typical Thermal Resistance （2） Operating and Storage Temperature Range 1.25 1 1.68 V IR 5 100 μA Cj 40 pF t rr 35 ns RθJA RθJC 40 16 °C/W T j , T stg -55 ~ +150 °C （1）Measured with I F = 0.5 A, I R = 1 A, I rr = 0.25 A . （2）P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas. 2017.04 SMC-E-ES3AC~ES3JC-3A600V Page 1 of 3 山东晶导微电子有限公司 ES3AC THRU ES3JC Jingdao Microelectronics Fig.1 Reverse Recovery Time Characteristic And Test Circuit Diagram 50 ohm Noninductive t rr 10 ohm Noninductive +0.5 D.U.T + PULSE GENERATOR Note 2 25Vdc approx 0 - -0.25 1 ohm NonInductive OSCILLOSCOPE Note 1 -1.0 Note：1.Rise Time = 7ns, max. Input Impedance = 1megohm,22pF. 2. Ries Time =10ns, max. Source Impedance = 50 ohms. 10ns/div Set time Base for 10ns/div Fig.3 Typical Reverse Characteristics 3.5 300 3.0 100 I R - Reverse Current ( μ A) Average Forward Current (A) Fig.2 Maximum Average Forward Current Rating 2.5 2.0 1.5 1.0 0.5 Single phase half-wave 60 Hz resistive or inductive load T J =125°C 10 T J =75°C 1.0 T J =25°C 0.1 0.0 25 50 75 100 125 150 0 175 20 40 Case Temperature (°C) Junction Capacitance ( pF) Instaneous Forward Current (A) T J =25°C 1.0 ES3AC~ES3DC ES3EC/ES3GC ES3JC 0.01 T J =25°C 100 0.001 0.5 1.0 1.5 100 Fig.5 Typical Junction Capacitance 10 0 80 % of PIV.VOLTS Fig.4 Typical Forward Characteristics 0.1 60 2.0 2.5 Instaneous Forward Voltage (V) 10 T J=25°C f = 1.0MHz V sig = 50mV p-p 1 0.1 1.0 10 100 Reverse Voltage (V) Peak Forward Surage Current (A) Fig.6 Maximum Non-Repetitive Peak Forward Surage Current 126 108 90 72 54 36 18 8.3 ms Single Half Sine Wave (JEDEC Method) 00 1 10 100 Number of Cycles 2017.04 www.sdjingdao.com Page 2 of 3 山东晶导微电子有限公司 ES3AC THRU ES3JC Jingdao Microelectronics PACKAGE OUTLINE SMC Plastic surface mounted package; 2 leads E A A1 A C b D L E1 VM A SMC mechanical data A E D E1 A1 C L b max 2.62 7.0 6.2 8.0 0.21 0.31 1.6 3.25 min 2.00 6.5 5.6 7.6 0.05 0.15 0.9 2.75 max 103 276 244 315 8.3 12 63 128 min 79 256 220 299 2.0 5.9 35 108 UNIT mm mil Marking The recommended mounting pad size 3.8 (150) 4.1 (160) 4.3 (170) 4.1 (160) Type number Marking code ES3AC ES3A ES3BC ES3B ES3CC ES3C ES3DC ES3D ES3EC ES3E ES3GC ES3G ES3JC ES3J mm Unit ： (mil) 2017.04 JD704228B4 Page 3 of 3