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FCM2012KF-221T05

FCM2012KF-221T05

  • 厂商:

    TAI-TECH(台庆)

  • 封装:

    0805

  • 描述:

    贴片磁珠 0805 220Ω@100MHz ±25% 500mA 300mΩ

  • 详情介绍
  • 数据手册
  • 价格&库存
FCM2012KF-221T05 数据手册
TAI-TECH KBM01-181000446 P2. Ferrite Chip Bead(Lead Free) FCM2012KF-221T05 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. 3. S.M.T. type. 4. Suitable for reflow soldering. 5. Shapes and dimensions follow E.I.A. spec. 6. Available in various sizes. 7. Excellent solder ability and heat resistance. 8. High reliability. 9.100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Pb Halogen-free Pb-free 2.Dimensions Chip Size A 2.00±0.20 B 1.25±0.20 C 0.85±0.20 D 0.50±0.30 Units: mm 3.Part Numbering FCM 2012 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 221 T 05 D E F LxW Lead Free Material 221=220Ω T=Taping and Reel, B=Bulk(Bags) 05=500mA 4.Specification Tai-Tech Part Number Impedance (Ω) FCM2012KF-221T05 ● DC Resistance (Ω) max. Rated Current (mA) max. 60mV/100M 0.30 500 220±25% Rated current: based on temperature rise test In compliance with EIA 595  Impedance-Frequency Characteristics FCM2012KF-221T05 600 IMPEDANCE(Ohm) ● Test Frequency (Hz) 400 Z 200 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 TAI-TECH KBM01-181000446 P3. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB Test Condition GHB FCA -55~+125℃ (Including self-temperature rise) -55~+125℃ (on board) Transportation Storage Temperature --- For long storage conditions, please see the Application Notice Agilent4291 Agilent E4991 Impedance (Z) Agilent4287 Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Rated Current < 1A ΔT 20℃Max Rated Current ≧ 1A ΔT 40℃Max Life test Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Load Humidity Appearance: no damage. Thermal shock Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Temperature: 125±2℃ Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2℃. Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Condition for 1 cycle Step1: -55±2℃ 30±5 min. Step2: 25±2℃ ≦0.5min Step3: +125±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Appearance:No damage. Impedance:within±15% of initial value Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10~2K~10Hz for 20 minutes Equipment: Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Bending Appearance:No damage. Impedance:within±10% of initial value Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions: >=0805inch(2012mm):40x100x1.2mm =0805inch(2012mm):1.2mm 0805inch(2012mm):1kg
FCM2012KF-221T05
- 物料型号:FCM2012KF-221T05 - 器件简介:该芯片珠采用单片无机材料构造,具有闭磁路设计,避免串扰,适用于表面贴装技术(SMT),无卤素,符合RoHS标准,适合回流焊接,具有高可靠性。 - 引脚分配:文档中未明确列出引脚分配,但提到了封装遵循EIA规格。 - 参数特性: - 阻抗:220Ω ± 25% - 测试频率:60 MHz - 最大直流电阻:0.30Ω - 最大额定电流:500mA - 功能详解:文档提供了详细的电气特性列表,包括阻抗-频率特性图。 - 应用信息:文档提供了推荐的PCB布局图案,焊接信息,包括无铅焊接和手工焊接的推荐温度曲线,以及包装信息。 - 封装信息:提供了不同尺寸的封装信息,包括卷轴尺寸和包装数量。
FCM2012KF-221T05 价格&库存

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FCM2012KF-221T05
  •  国内价格
  • 100+0.02924
  • 500+0.02750
  • 1000+0.02488
  • 5000+0.02140
  • 10000+0.01932

库存:3640