RS2227
High-Speed USB 2.0 (480-Mbps)
1:2 Multiplexer/Demultiplexer Switch
FEATURES
•
-3dB Bandwidth: 550MHz
•
Supply Range: +1.8V to +5.5V
•
RON is Typically 6Ω
•
Fast Switching Times:
tON 20ns
tOFF 15ns
•
Break-Before-Make Switching
•
Low Power Consumption (1μA Maximum)
•
Rail-to-Rail Input and Output Operation
•
Extended Industrial Temperature Range:
-40°C to +85°C
•
MicroSIZE
DESCRIPTION
The RS2227 is a high-speed, low-power doublepole/double-throw (DPDT) analog switch with single
Enable. It is designed to operate from 1.8 V to 5.5 V.
The RS2227 has a bus-switch enable pin, ̅̅̅̅
OE, that can
place the signal paths in high impedance. This allows
the user to isolate the bus when it is not in use and
consume less current.
The RS2227 is a high-bandwidth switch specially
designed for the switching of high-speed USB2.0
signals in handset and consumer applications, such as
cell phones, digital cameras, and notebooks with hubs
or controllers with limited USB I/Os.
PACKAGES: MSOP-10
The RS2227 is available MSOP-10 package. It
operates over an ambient temperature range of -40°C
to +85°C.
APPLICATIONS
•
Routes Signals for USB 1.0, 1.1, and 2.0
•
MP3 and Other Personal Media Players
•
Portable Instrumentation
•
USB Switching
•
Digital Cameras
•
Set-Top Box
•
Cell Phones
•
PDAs
Functional Block Diagram
HSD1+
D+
HSD2+
HSD1–
D–
HSD2–
S
OE
REV B.1
1
Control
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RS2227
PIN CONFIGURATIONS
RS2227
V+
1
10 OE
S
2
9
HSD2+
D+
3
8
HSD2-
D-
4
7
HSD1+
GND 5
6
HSD1-
MSOP10
PIN DESCRIPTION
NAME
PIN
FUNCTION
V+
1
Power Supply
GND
5
Ground
S
2
Select Input
OE
10
Output Enable
HSD1+, HSD2+
7,9
HSD1-, HSD2-
6,8
D+, D-
3,4
Data Port
FUNCTION TABLE
̅̅̅̅
𝐎𝐄
S
HSD1+, HSD1-
HSD2+, HSD2-
0
0
ON
OFF
0
1
OFF
ON
1
X
OFF
OFF
X =Don’t care
2
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RS2227
ABSOLUTE MAXIMUM RATINGS (1)
V+ to GND..............................................................0V to 6V
Analog, Digital Voltage Range (2) …......– 0.3 to (V+) + 0.3V
Continuous Current HSDn or Dn……......…............±100mA
Peak Current HSDn or Dn……........….....….......... ±150mA
Storage Temperature ……….…………… −65°C to +150°C
Operating Temperature ……….……...…… −40°C to +85°C
Junction Temperature................................................150°C
Lead Temperature (Soldering, 10s) ……………........260°C
ESD Susceptibility
HBM …......................................................................3000V
MM ……………………….........………………...……….200V
ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes
could cause the device not to meet its published
specifications.
(1) Stresses above these ratings may cause permanent damage. Exposure
to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those
specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input
signals that can swing more than 0.3V beyond the supply rails should
be current-limited to 10mA or less.
PACKAGE/ORDERING INFORMATION
PRODUCT
ORDERING NUMBER
RS2227
RS2227XN
TEMPERATURE
PACKAGE
PACKAGE
RANGE
LEAD
MARKING
-40°C ~+85°C
MSOP-10
RS2227
3
PACKAGE OPTION
Tape and Reel,3000
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RS2227
ELECTRICAL CHARACTERISTICS
(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =
+25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TA
MIN
-40°C to +85°C
0
TYP
MAX
UNITS
V+
V
ANALOG SWITCH
Analog I/O Voltage
(HSD1+, HSD1-, HSD2+, HSD2-)
On-Resistance
On-Resistance Match
Between Channels
On-Resistance Flatness
VIS
RON
∆RON
RFLAT(ON)
V+ = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
V+ = 3.0V, VIS = 0V to 0.4V,
ID = 8mA, Test Circuit 1
V+ = 3.0V, VIS = 0V to 1.0V,
ID = 8mA, Test Circuit 1
+25°C
6
10
Ω
-40°C to +85°C
10.5
+25°C
0.15
-40°C to +85°C
+25°C
5
0.6
Ω
1.6
Ω
7
Ω
-40°C to +85°C
8
Power Off Leakage Current
(D+, D-)
IOFF
V+ = 0V, VD = 0V to 3.6 V,
VS, V̅̅̅̅
OE = 0V or 3.6 V
-40°C to +85°C
1
μA
Increase in I+ per Control
Voltage
ICCT
V+ = 4.3V, VS or V̅̅̅̅
OE = 2.6 V
-40°C to +85°C
40
μA
IHSD2(OFF)
V+ = 3.6V, VIS = 3.3V/ 0.3V,
VD = 0.3V/ 3.3V
V+ = 3.6V, VIS = 3.3V/ 0.3V,
VD = 0.3V/ 3.3V or floating
-40°C to +85°C
1
μA
-40°C to +85°C
1
μA
Source Off Leakage Current
Channel On Leakage Current
IHSD1(OFF)
IHSD2(ON)
IHSD1(ON)
DIGITAL CONTROL INPUTS(1)
Input High Voltage
VIH
-40°C to +85°C
Input Low Voltage
VIL
-40°C to +85°C
0.5
V
Input Leakage Current
IIN
-40°C to +85°C
1
μA
V+ = 3.0V, VS, VOE
̅̅̅̅ = 0V or V+
1.6
V
(1) All unused digital inputs of the device must be held at VIO or GND to ensure proper device operation.
4
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RS2227
ELECTRICAL CHARACTERISTICS (continued)
(V+ = +1.8V to +5.5V, GND = 0V, VIH = +1.5V, VIL = +0.5V, TA = -40°C to + 85°C. Typical values are at V+ = +3.3V, TA =
+25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
TYP
MAX
UNITS
DYNAMIC CHARACTERISTICS
Turn-On Time
tON
Turn-Off Time
tOFF
VIS = 0.8V, RL = 50Ω,
CL = 10pF, Test Circuit 2
+25°C
20
ns
+25°C
15
ns
Break-Before-Make Time
Delay
tD
VIS = 0.8V, RL = 50Ω,
CL = 10pF, Test Circuit 3
+25°C
4
ns
Propagation Delay
tPD
RL = 50Ω, CL = 10pF
+25°C
0.35
ns
Off Isolation
OISO
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 4
+25°C
-35
dB
Channel-to-Channel
Crosstalk
XTALK
Signal = 0dBm, RL = 50Ω,
f = 250MHz, Test Circuit 5
+25°C
-40
dB
BW
Signal = 0dBm, RL = 50Ω,
CL = 5pF, Test Circuit 6
+25°C
550
MHz
RL = 50Ω, CL = 10pF
+25°C
0.05
ns
VG = GND, CL = 1.0nF, RG = 0Ω,
Q = CL x VOUT, Test Circuit 7
+25°C
11
pC
CON
+25°C
7
pF
Power Supply Range
V+
-40°C to +85°C
Power Supply Current
I+
-3dB Bandwidth
Channel-to-Channel Skew
Charge Injection Select Input
to Common I/O
HSD+, HSD-, D+, D- ON
Capacitance
tSKEW
Q
POWER REQUIREMENTS
V+ = 3.0V, VS, V̅̅̅̅
OE = 0V or V+
5
-40°C to +85°C
1.8
5.5
V
1
μA
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RS2227
Parameter Measurement Information
V+
VHSD1n
HSD1n
VHSD2n
HSD2n
VIS
Dn
+
Channel ON
RON
VSEL
ID
S
- VHSD1nI orVHSD2nΩ
VIS
D
VSEL = V IH or V IL
+
GND
Test Circuit 1. ON-State Resistance (RON)
V+
V+
HSD1n
50%
50%
Dn
HSD2n
VOUT
0.1μ F
VOH
RL
90%
90%
CL
VS
VOL
GND
tOFF
tON
Test Circuit 2. Turn-On (tON) and Turn-Off Time (tOFF)
V+
HSD1n
V+
VS
Dn
HSD2n
V OUT
0.1μ F
RL
CL
50%
0
90% of VOH
V OUT
VS
0
GND
tD
Test Circuit 3. Break-Before-Make Time (tD)
6
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RS2227
V+
0.1μ F
V+
HSD1n
Dn
VOUT
HSD2n
Source
Signal
RL
S
GND
Test Circuit 4.OFF Isolation (OISO)
V+
0.1μ F
V+
HSDn
Dn
RL
Source
Signal
HSDn
N.C.
Dn
VOUT
RL
S
GND
Channel To Channel Crosstalk = -20 × log
VHSDn
VOUT
Test Circuit 5. Channel-to-Channel Crosstalk
V+
0.1μF
V+
HSDn
Source
Signal
Dn
VOUT
RL
S
CL
GND
Test Circuit 6. -3dB Bandwidth
7
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RS2227
V+
HSD1n
RG
VG
0
Dn
VOUT
HSD2n
CL
S
Δ OUT
VOUT
GND
Q = ΔVOUT× CL
Test Circuit 7. Charge Injection(Q)
8
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RS2227
APPLICATION NOTES
There are many USB applications in which the USB hubs or controllers have a limited number of USB I/Os.
The RS2227 solution can effectively expand the limited USB I/Os by switching between multiple USB buses in
order to interface them to a single USB hub or controller. RS2227 can also be used to connect a single
controller to two USB connectors or controllers.
Design requirements of the USB 1.0, 1.1, and 2.0 standards should be followed. It is recommended that the
digital control pins S and ̅̅̅̅
OE be pulled up to V+ or down to GND to avoid undesired switch positions that could
result from the floating pin.
V+
RS2227
HSD1+
USB2.0
Controller
D+
HSD1USB
Connector
Processor
D–
HSD2+
Controller
HSD2-
Control
S
OE
Figure 1. Application Diagram
9
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RS2227
PACKAGE OUTLINE DIMENSIONS
MSOP-10
b
e
E
4.65
E1
1.02
0.31
D
0.5
RECOMMENDED LAND PATTERN (Unit: mm)
A2
A1
A
c
L
Symbol
Dimensions In Millimeters
θ
Dimensions In Inches
Min
Max
Min
Max
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.180
0.280
0.007
0.011
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
e
0.50(BSC)
0.020(BSC)
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
10
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