BZT52C2V0 THRU BZT52C39
PINNING
PIN
Surface Mount Zener Diodes
DESCRIPTION
1
Cathode
2
Anode
FEATURES
Total power dissipation: Max. 500mW.
Wide zener reverse voltage range 2.0 V to 39V.
Small plastic package suitable for surface mounted design.
2
1
Simplified outline SOD-123 and symbol
MECHANICAL DATA
Case: SOD-123
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight:16mg 0.00056oz
Absolute Maximum Ratings And Characteristics (Ta = 25 °C)
Symbol
Value
Unit
Power Dissipation
PD
500
mW
Forward Voltage at I F = 10 mA
VF
0.9
V
RθJA
305
°C/W
T j , T stg
-55 ~ +150
°C
Parameter
Typical thermal resistance juncting to ambient
(1)
Operating and Storage Temperature Range
(1) Thermal resistance from junction to ambient at P.C.B. mounted with 7.6mm X 9.4mm X 0.87mm copper areas pads.
Transient Thermal Impedance( °C /W)
Fig.1 Maximum Continuous Power Derating
0.6
Power Dissipation ( W )
0.5
0.4
0.3
0.2
0.1
0.0
25
50
75
100
125
150
175
T c ,Case Temperature (°C)
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Fig.2 Typical Transient Thermal Impedance
2000
1000
100
10
0.01
0.1
1
10
t, Pulse Duration(sec)
1
100
BZT52C2V0 THRU BZT52C39
Characteristics at Ta = 25°C
Maximum Zener (3)
Impedance
Zener Voltage Range (2)
Type
Marking
V ZT(at I ZT)
Z ZT@I ZT
I ZT
Z ZK@I ZK
(Ω)
Min(V) Nom(V) Max(V) (mA)
Reverse Current
(2)
Typical temperature
coefficient
@I ZTC
mV/°C
Test
current
I ZTC
I ZK
IR
@V R
(mA)
μA
V
MIN
MAX
mA
BZT52C2V0
WY
1.91
2.0
2.09
5
100
600
1
150
1.0
-3.5
0
5
BZT52C2V4
WX
2.2
2.4
2.6
5
100
600
1
50
1.0
-3.5
0
5
BZT52C2V7
W1
2.5
2.7
2.9
5
100
600
1
20
1.0
-3.5
0
5
BZT52C3V0
W2
2.8
3.0
3.2
5
95
600
1
10
1.0
-3.5
0
5
BZT52C3V3
W3
3.1
3.3
3.5
5
95
600
1
5.0
1.0
-3.5
0
5
BZT52C3V6
W4
3.4
3.6
3.8
5
90
600
1
5.0
1.0
-3.5
0
5
BZT52C3V9
W5
3.7
3.9
4.1
5
90
600
1
3.0
1.0
-3.5
0
5
BZT52C4V3
W6
4.0
4.3
4.6
5
90
600
1
3.0
1.0
-3.5
0
5
BZT52C4V7
W7
4.4
4.7
5.0
5
80
500
1
3.0
2.0
-3.5
0.2
5
BZT52C5V1
W8
4.8
5.1
5.4
5
60
480
1
2.0
2.0
-2.7
1.2
5
BZT52C5V6
W9
5.2
5.6
6.0
5
40
400
1
1.0
2.0
-2
2.5
5
BZT52C6V2
WA
5.8
6.2
6.6
5
10
150
1
3.0
4.0
0.4
3.7
5
BZT52C6V8
WB
6.4
6.8
7.2
5
15
80
1
2.0
4.0
1.2
4.5
5
BZT52C7V5
WC
7.0
7.5
7.9
5
15
80
1
1.0
5.0
2.5
5.3
5
BZT52C8V2
WD
7.7
8.2
8.7
5
15
80
1
0.7
5.0
3.2
6.2
5
BZT52C9V1
WE
8.5
9.1
9.6
5
15
100
1
0.5
6.0
3.8
7.0
5
BZT52C10
WF
9.4
10
10.6
5
20
150
1
0.2
7.0
4.5
8.0
5
BZT52C11
WG
10.4
11
11.6
5
20
150
1
0.1
8.0
5.4
9.0
5
BZT52C12
WH
11.4
12
12.7
5
25
150
1
0.1
8.0
6.0
10.0
5
12.4
13
14.1
5
30
170
1
0.1
8.0
7.0
11.0
5
200
1
0.1
10.5
9.2
13.0
5
1
0.1
11.2
10.4
14.0
5
BZT52C13
WI
BZT52C15
WJ
13.8
15
15.6
5
30
BZT52C16
WK
15.3
16
17.1
5
40
200
BZT52C18
WL
16.8
18
19.1
5
45
225
1
0.1
12.6
12.4
16.0
5
BZT52C20
WM
18.8
20
21.2
5
55
225
11
0.1
14.0
14.4
18.0
5
BZT52C22
WN
20.8
22
23.3
5
55
250
1
0.1
15.4
16.4
20.0
5
BZT52C24
WO
22.8
24
25.6
5
70
250
1
0.1
16.8
18.4
22.0
5
BZT52C27
WP
25.1
27
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
2
BZT52C30
WQ
28.0
30
32.0
2
80
300
0.5
0.1
21.0
24.4
29.4
2
BZT52C33
WR
31.0
33
35.0
2
80
325
0.5
0.1
23.1
27.4
33.4
2
BZT52C36
WS
34.0
36
38.0
2
90
350
0.5
0.1
25.2
30.4
37.4
2
BZT52C39
WT
37.0
39
41.0
2
130
350
0.5
0.1
27.3
33.4
41.2
2
NOTES:(1)f=1KHz
(2)Short duration test pulse used to minimize self-heating effect.
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1
2
BZT52C2V0 THRU BZT52C39
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
A
D
b
E
A1
C
∠ALL ROUND
L1
E1
SOD-123 mechanical data
A
C
D
E
E1
L1
b
A1
max
1.3
0.22
1.8
2.8
3.9
0.45
0.7
0.2
min
0.9
0.09
1.5
2.5
3.6
0.25
0.5
max
51
8.7
71
110
154
18
28
min
35
3.5
59
98
142
10
20
UNIT
∠
mm
9°
mil
The recommended mounting pad size
1.2
(47)
1.2
(47)
1.2
(47)
2.0
(79)
Unit: mm
(mil)
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1
3
8
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