JK-SMD0603-050 PPTC DEVICES
Edition:A0
Part Number:Q/JKTD-6-050
Page No: 1 OF 3
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : Part identification 1=050
Table1 :DIMENTION(Unit : mm)
Model
Marking
JK-SMD0603-050
5
A
B
C
D
E
Min.
Max.
Min.
Max.
Min.
Max
Min.
MAX
1.45
1.85
0.65
1.05
0.60
1.50
0.15
0.4
Table2 :PERFORMANCE RATINGS:
Model
Marking
Vmax
(Vdc)
JK-SMD0603-050
5
6.0
Imax
(A)
Ihold
@25℃
(A)
40
0.50
Itrip
@25℃
(A)
Pd
Typ
(W)
1.00
0.50
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Rimin
(Ω)
R1max
(Ω)
8A
0.10
0.100
0.800
Table3:Test Conditons and Standards
Test Conditon
Item
Initial Resistance
IH
Ttrip
.trip
Trip endurance
Operating Temperature:-40℃ TO
Packaging:Bulk ,3500pcs per bag
25℃
25℃,0.20A,60min
25℃,8A
6V,40A,60min
0.100~0.800Ω
No Trip
≤0.10S
No arcing or burning
85℃
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD
INDUSTRY PARK
Standard
6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
JK-SMD0603-050 PPTC DEVICES
Part Number:Q/JKTD-6-050
Edition:A0
Page No: 2 OF 3
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD
INDUSTRY PARK
6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
JK-SMD0603-050 PPTC DEVICES
Edition:A0
Part Number:Q/JKTD-6-050
Page No: 3 OF 3
Recommended pad layout (mm)
WARNING
· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD
INDUSTRY PARK
6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
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