WCM4532F2SF-102T10

P1 TAI-TECH Wire Wound Type Common Mode Filter WCM4532F2SF-102T10 ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/04/08 新發行 楊祥忠 林志鴻 林宜蕰 備 註 www.tai-tech.com.tw P2 TAI-TECH Wire Wound Type Common Mode Filter WCM4532F2SF-102T10 1. Features 1. High common mode impedance at high frequency cause excellent noise suppression performance. 2. WCM4532F2SF series realizes small size and low profile. 4.5x3.2x2.8 mm. 3. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Pb Halogen-free Pb-free 2. Dimension Recommended PC Board Pattern A C 1 2 G2 B H 3 4 G1 D L D PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. D D Series A(mm) B(mm) C(mm) D1(mm) D2(mm) L(mm) H(mm) G1(mm) G2(mm) 4532F2SF 4.5±0.2 3.2±0.2 2.8±0.2 1.0±0.1 1.2±0.1 4.8 3.8 2.5 0.7 Units: mm 3. Part Numbering WCM 4532 A B F 2 S F C D E F - 102 T 10 G H I A: Series B: Dimension C: Material Ferrite Core D: Number of Lines 2=2 lines E: Type S=Shielded , N=Unshielded F: Lead free G: Impedance 102=1000Ω H: Packaging I: Rated Current T=Taping and Reel 10=1000mA 4. Specification WCM4532F2SF-102T10 DC Common mode Impedance Test Frequency Resistance (MHz) (Ω) (Ω) max. 1000±25% 100 Rated Current (mA) max. 0.24 1000 WCM4532F2SF-102 10000 1000 IMPEDANCE(Ohm) TAI-TECH Part Number Common Mode 100 10 Normal Mode 1 0.1 1 10 100 1000 FREQUENCY(MHz) www.tai-tech.com.tw Withstand Rated Volt. Volt. (Vdc) IR (Vdc) max. (Ω) min. max. 50 125 10M P3 TAI-TECH 5.Schematic Diagram 6. Materials No. Description Specification a. Upper Plate Ferrite b. Core Ferrite Core c Termination Tin (Pb Free) d Wire Enameled Copper Wire 7. Reliability and Test Condition Item Performance Test Condition Electrical Characteristics Test Agilent-4291A+ Agilent -16197A Z(common mode) DCR Refer to standard electrical characteristics list. Agilent-4338B Agilent4339 I.R. Operating Temperature -40℃~+125℃ Storage Temperature(on board) Temperature Rise Test Rated Current < 1A ΔT 20℃Max Rated Current ≧ 1A ΔT 40℃Max 1.Applied the allowed DC current. 2.Temperature measured by digital thermometer surface Mechanical Performance Test Solderability Test More than 95% of terminal electrode should be covered with solder. Preheat: 150℃,60sec.。 Solder: Sn99.5%-Cu0. 5%。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。 Depth: completely cover the termination Solder Heat Resistance Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate Number of heat cycles 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s 1 Depth: completely cover the termination Appearance：No damage. Impedance：within±15% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning :Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a force (>0805:1kg ,