CHTPW3316F-6R8M

P1 TAI-TECH SMD Type Power Inductor CHTPW3316F-Series ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 12/10/31 新 發 行 許智良 張榮泉 徐允珮 備 註 www.tai-tech.com.tw P2 TAI-TECH SMD Type Power Inductor CHTPW3316F-Series 1. Features 1.Low profile very effective in space-conscious applications. Halogen Pb Halogen-free Pb-free 2.Low resistance and high energy storage. 3.100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension D F D Recommended PC Board Pattern L H E A 100 MARKING INDUCTANCE CODE G B L(mm) G(mm) H(mm) CHTPW3316 13.21 7.37 2.79 C size Units: mm Series A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) CHTPW3316 9.30±0.20 12.80±0.20 5.00±0.30 2.40±0.20 2.50±0.20 7.60±0.30 Units: mm 3. Part Numbering CHTPW 3316 A B A: Series B: Dimension C: Lead free D: Inductance E: Inductance Tolerance F: Control S/N F C - 100 M D E - F01 F 100=10.0uH M=±20%, N=±25% , Y=±30 4. Specification Part Number Inductance (uH) Test Frequency (Hz) SRF (MHz) typ. DCR (Ω) max. I rms (A) I sat (A) CHTPW3316F-1R0M 1.0±20% 0.1V/100K 150 0.009 6.8 9.0 CHTPW3316F-1R5M 1.5±20% 0.1V/100K 100 0.010 6.4 8.0 0.1V/100K 85 0.012 6.1 7.0 0.1V/100K 60 0.015 5.4 5.8 0.018 4.8 5.2 CHTPW3316F-2R2M CHTPW3316F-3R3M 2.2±20% 3.3±20% CHTPW3316F-4R7M 4.7±20% 0.1V/100K 45 CHTPW3316F-6R8M 6.8±20% 10±20% 0.1V/100K 35 0.027 4.4 4.3 CHTPW3316F-100M 0.1V/100K 25 0.038 3.9 3.4 CHTPW3316F-150M 15±20% 0.1V/100K 20 0.046 3.1 3.0 CHTPW3316F-220M 22±20% 0.1V/100K 18 0.085 2.7 2.5 CHTPW3316F-330M 33±20% 0.1V/100K 14 0.10 2.1 2.0 CHTPW3316F-470M 47±20% 0.1V/100K 11 0.14 1.8 1.8 CHTPW3316F-680M 68±20% 0.1V/100K 10 0.20 1.5 1.4 CHTPW3316F-101M 100±20% 0.1V/100K 7.0 0.28 1.3 1.1 0.1V/100K 6.5 0.40 1.0 0.9 0.61 0.8 0.8 CHTPW3316F-151M 150±20% CHTPW3316F-221M 220±20% 0.1V/100K 5.0 CHTPW3316F-331M 330±20% 0.1V/100K 4.0 1.02 0.6 0.6 CHTPW3316F-471M 470±20% 0.1V/100K 3.0 1.27 0.5 0.5 CHTPW3316F-681M 680±20% 0.1V/100K 2.5 2.02 0.4 0.4 0.1V/100K 2.0 3.00 0.3 0.3 CHTPW3316F-102M 1000±20% www.tai-tech.com.tw P3 TAI-TECH 5. Schematic Diagram 6. Reliability and Test Condition Item Operating Temperature Performance Test Condition -40~+85℃ -40~+85℃(For products in unopened tape package, less than 40℃) Storage temperature Rated Current 50~60%RH (Product without taping) Saturation DC Current (Isat) will cause L0 Base on temp. rise & △L/LOA≦30% typ. to drop approximately △L(%). Heat Rated Current (Irms) will cause the coil temperature Temperature Rise Test rise approximately △T(℃) without core loss. 40℃ max. (Δt) 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Preheat:150±5℃,60sec. Preheating Dipping Natural cooling Solder heat Resistance MIL-STD-202 Method210F Condition B Solder : Sn-Cu0.5% 260°C Appearance: No significant abnormality. Inductance change: Within ± 20%. Solder tamperature:260±5℃ Flux: rosin 150°C 60 second 10±0.5 second Dip time:10±0.5sec. Preheat:150±5℃,60sec. Preheating Dipping Natural cooling Solderability ANSI /J-STD-002C Method B More than 90% of the terminal electrode should be covered with Solder tamperature:235±5℃ Flux: rosin 150° C 60 second solder. Phase 1 Thermal shock (Unload Test) MIL-STD-202G METHOD 107G Test condition A-3 Solder : Sn-Cu0.5% 235° C 4±1 second Dip time:4±1sec.. Temperature(℃) Time(min) -55+0/-2℃ 15±1 For CHTPW Condition for 1 cycle 2 Appearance: no damage. Room Temp. 5 Step1:- 55+0/-2℃ 15±1 min. Step2:Room temperature 5 min. Inductance: within±20%of initial value. 3 +85+2/-0℃ 15±1 Step3:+85+2/-0℃ 15±1 min. Step4: Room temperature 5 min. 4 Room Temp. 5 Number of cycles:100 Measured:100 times Humidity Resistance Test (Unload Test) MIL-STD-202G METHOD 103B Test condition C Appearance: no damage. Inductance: within±20%of initial value. High Temperature Resistance Test (Unload Test) MIL-STD-202G METHOD 108A Test condition C Appearance: no damage. Inductance: within±20%of initial value. Low Temperature Life Test Appearance: no damage. Inductance: within±20%of initial value. Temperature:40±2℃. Duration:500 hrs. Humidity:90~95% Temperature:85±2℃. Duration:500 hrs. Temperature:-40±2℃. Applied current:rated current. Duration:500 hrs. Frequency: 10-55-10Hz for 15 min. Random Vibration Test (Unload Test) MIL-STD-202 Method 204 D Test condition A Amplitude: 1.52mm Appearance: Cracking, shipping and any other defects harmful to the Directions and times: characteristics should not be allowed. Inductance: within±20%of initial value. X, Y, Z directions for 15 min. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). www.tai-tech.com.tw P4 TAI-TECH 8. Soldering and Mounting 8-1. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 8-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING 20~40s 60~150s 200 150 60~180s SOLDERING within 4~5s TEMPERATURE(°C) ( 217 PRE-HEATING NATURAL COOLING TP(260° C / 40s max.) ) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5 sec. NATURAL COOLING 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.1 Fig.2 9. Packaging Information 9-1. Reel Dimension & Tape Dimension COVER TAPE C B D 2.0±0.5 A Type A(mm) B(mm) C(mm) D(mm) 13”x24mm 24.5 100 13.5±0.5 330 EMBOSSED CARRIER 4mm 16mm 9-2. Packaging Quantity CHTP W 3316F Chip / Reel 500 Reel Style 13”x24mm www.tai-tech.com.tw P5 TAI-TECH 9-3. Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw