TMPF0603A-2R2MN-D

TAI-TECH P1 SMD Power Inductor TMPF0603A-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 16/11/23 新發行 楊祥忠 詹偉特 何秦芝 備 注 TAI-TECH P2 SMD Power Inductor TMPF0603A-Series(N)-D 1. Features 1. Soft saturation. 2. High current，low DCR，high efficiency. 3. Very low acoustic noise and very low leakage flux noise. Halogen Pb Halogen-free Pb-free 4. High reliability. 5. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications Recommend PC Board Pattern Note PC power system，incl. IMVP-6 H DC/DC converter . L A D C E 　1R2 1602 B F Inductance Range Series TMPF0603A 1.2uH and below G 3. Dimensions L(mm) G(mm) H(mm) 5.6 ref 2.5 ref 5.6 ref Note: 1、The above PCB layout reference only. 2、Recommend solder paste thickness at 0.15mm and above. A (mm) B (mm) 6.6±0.2 6.4±0.2 1.5uH and above C (mm) D (mm) E (mm) F (mm) 2.8±0.2 See Spec table 1.4±0.2 2.6±0.25 2.9±0.2 4. Part Numbering TMPF 0603 A A B C - 1R2 MN D E - D F A: Series B: Dimension BxC C: Type D: Inductance E: Inductance Tolerance F: Code Material. 1R2=1.20uH M=±20% Marking: Black.1R2 and 1602(16 YY, 02 WW,follow production date). DCR Test TAI-TECH P3 5. Specification Part Number Inductance(uH) ±20% @ 0 A TMPF0603A-R18MN-D TMPF0603A-R33MN-D I rms(A) Typ I sat(A) DCR DCR (mΩ) Typ. (mΩ) Max. D(mm) ±0.3 20℃ rise 40℃ rise Typ Max 0.18 24.0 32.0 40.0 36.0 1.60 1.75 5.30 0.33 20.0 25.0 32.0 28.0 2.25 2.50 5.55 TMPF0603A-R56MN-D 0.56 17.0 22.0 29.0 25.0 3.00 3.31 5.30 TMPF0603A-1R0MN-D 1.00 13.0 18.0 23.0 18.0 5.50 6.05 5.20 TMPF0603A-1R2MN-D 1.20 12.0 16.0 22.0 16.0 6.70 7.40 5.15 TMPF0603A-1R8MN-D 1.80 10.0 14.0 18.2 13.0 9.20 10.2 5.10 TMPF0603A-2R2MN-D 2.20 7.00 10.0 15.9 11.0 11.0 12.2 5.05 TMPF0603A-3R3MN-D 3.30 6.00 8.00 12.2 9.00 18.8 20.8 5.00 TMPF0603A-4R5MN-D 4.50 5.00 7.00 10.0 8.00 23.0 25.3 5.00 Note: 1. Test frequency : L : 100KHz /0.1V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L: HP4284A,HP4395A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER,or EQU. 4. Current that causes the specified temperature rise from 25°C ambient. 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. 6. Material List 2 4 3 2 1 NO Items Materials 1 Core Alloy powder. 2 Wire Polyester Wire or equivalent. 3 Solder 100% Pb free solder 4 Ink Halogen-free ketone TAI-TECH P4 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1.-10~+40℃,50~60%RH (Product without taping) 2.-40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%). Heat Rated Current (Irms) Approximately △T 20℃ Approximately △T 40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Life Test reflow for 2 Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Load Humidity reflow for 2 Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Appearance：No damage. Moisture Resistance Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min for Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 2 TAI-TECH P5 Item Shock Performance Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec Inductance：within±10% of initial value SMD 50 11 Half-sine 11.3 Q：Shall not exceed the specification value. Lead 50 11 Half-sine 11.3 Appearance：No damage. RDC：within ±15% of initial value and shall not exceed the specification value Bending Solderability Test Condition More than 95% of the terminal electrode should be covered with solder。 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,