AHP252012TF-R47M

P1 TAI-TECH Power Inductor AHP252012TF-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/03/12 新 發 行 楊祥忠 詹偉特 林宜蕰 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor AHP252012TF-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free B A D E D C Series A(mm) B(mm) C(mm) D(mm) E(mm) AHP252012TF 2.5 -0.1/+0.2 2.0 -0.1/+0.2 1.2Max 0.85 ref. 0.80 ref. Units: mm 3. Part Numbering AHP A 252012 TF B - R33 M D E C A: Series B: Dimension C: Lead Free Material D: Inductance E: Inductance Tolerance R33=0.33uH M=±20% 4. Specification TAI-TECH Part Number Test Inductance Tolerance Frequency (uH) (%) (Hz) DCR (Ω) typ. DCR (Ω) Max. I sat (A) typ. I sat (A) Max. I rms (A) typ I rms (A)Max AHP252012TF-R24M 0.24 ±20% 1V/1M 0.021 0.027 7.80 6.50 4.70 4.05 AHP252012TF-R33M 0.33 ±20% 1V/1M 0.025 0.032 6.20 5.30 4.30 3.70 AHP252012TF-R47M 0.47 ±20% 1V/1M 0.029 0.037 5.60 4.90 4.00 3.45 AHP252012TF-R68M 0.68 ±20% 1V/1M 0.036 0.046 4.30 3.70 3.60 3.15 AHP252012TF-1R0M 1.0 ±20% 1V/1M 0.048 0.058 4.20 3.60 3.40 3.00 AHP252012TF-1R5M 1.5 ±20% 1V/1M 0.060 0.072 3.50 2.80 2.80 2.40 AHP252012TF-2R2M 2.2 ±20% 1V/1M 0.100 0.120 3.00 2.60 2.15 1.90 Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃.）Max www.tai-tech.com.tw P3 TAI-TECH AHP252012TF-R24 0.4 0.45 Inductance(uH) Inductance(uH) 0.3 0.2 0 0 0 2 4 6 8 DCcurrent(A) 0 10 AHP252012TF-R47 0.8 4 6 8 DCcurrent(A) 10 AHP252012TF-R68 Inductance(uH) 0.9 0.4 0.2 0.6 0.3 0 0 0 1.5 3 DCcurrent(A) 4.5 6 0 AHP252012TF-1R0 2 1.5 3 DCcurrent(A) 4.5 6 3 4 AHP252012TF-1R5 2.5 2 Inductance(uH) 1.5 1 0.5 1.5 1 0.5 0 0 0 1 2 3 DCcurrent(A) 4 5 2.4 3 0 AHP252012TF-2R2 4 3 Inductance(uH) 2 1.2 0.6 Inductance(uH) 0.3 0.15 0.1 Inductance(uH) AHP252012TF-R33 0.6 2 1 0 0 0.6 1.2 1.8 DCcurrent(A) www.tai-tech.com.tw 1 2 DCcurrent(A) P4 TAI-TECH 5. Material List No. Description Specification a. Core Metal Magnetic Core b. Coating Epoxy with Magnetic powder c Termination Tin (Pb Free) d Wire Enameled Copper Wire Appearance of exposed wire tolerance limit: 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. 6. Reliability and Test Condition Item Operating Temperature Performance Test Condition -40~+125℃ Storage Temperature (on board) Electrical Performance Test Agilent-4291, Agilent-4287 Inductance L Refer to standard electrical characteristic list Agilent-4338 DC Resistance Rated Current Temperature Rise Test Base on temp. rise & △L/L0A≦30%. Saturation DC Current (Isat) will cause L0 to drop approximately △L(%). ΔT 40℃Max Heat Rated Current (Irms) will cause the coil temperature rise approximately △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Mechanical Performance Test Appearance：No damage. Inductance：within±10% of initial value Solder Heat Resistance Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate 260 ±5 (solder temp) 10 ±1 25mm/s±6 mm/s RDC：within ±15% of initial value and shall not exceed the specification value Depth: completely cover the termination www.tai-tech.com.tw Number of heat cycles 1 P5 TAI-TECH Item Solderability Test Performance More than 95% of terminal electrode should be covered with solder. Test Condition Preheat: 150℃,60sec.。 Solder: Sn99.5%-Cu0. 5%。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec。 Depth: completely cover the termination Reliability Test Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature： 85±2℃ Life Test Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Thermal shock Step3：105±2℃ 30±5min Appearance：No damage. Inductance：within±10% of initial value Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Humidity Resistance Test Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Vibration Test www.tai-tech.com.tw P6 TAI-TECH 7. Soldering and Mounting 7-1. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-1.1 Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 7-1.2 Soldering Iron(Figure 2): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5 sec. 7-2. Recommended PC Board Pattern H L L(mm) G(mm) H(mm) 2.9 0.8 2.4 G www.tai-tech.com.tw P7 TAI-TECH 8. Packaging Information 8-1. Reel Dimension C B D A Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 8.4±1.0 50 min. 13±0.8 178±2 7"x8mm 8-2. Tape Dimension / 8mm t P Ao Bo Po:4±0.1 W:8.0±0.1 P2:2±0.05 Series Size AHP 252012 Bo(mm) Ao(mm) Ko(mm) P(mm) 2.85±0.1 2.45±0.1 1.40±0.1 4.0±0.1 t(mm) 0.23±0.05 Ko 8-3. Packaging Quantity Chip size 252012 Chip / Reel 2000 8-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions(Component level) To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw