HPC3012A-6R8M

P1 TAI-TECH Power Inductor HPC3012A-SERIES ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 12/12/25 新 發 行 楊祥忠 詹偉特 林宜蕰 備 註 www.tai-tech.com.tw P2 TAI-TECH Power Inductor HPC3012A-SERIES 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free H I G I Series A(mm) B(mm) C(mm) D(mm) E(mm) G(mm) H(mm) HPC3012A 3.0±0.1 3.0±0.1 1.2 max. 0.9±0.2 1.9±0.2 2.2 ref. 2.7 ref. Test Frequency (Hz) SRF (MHz) min. DCR (Ω) ±20% I sat (A) I(mm) 0.8 ref. Units: mm 3. Part Numbering HPC 3012 A A B C - 2R2 M D E A: Series B: Dimension C: Control S/N D: Inductance E: Inductance Tolerance 2R2=2.2uH M=±20%；Y=±30% 4. Specification TAI-TECH Part Number Inductance Tolerance (uH) (%) I rms (A) Color Coding HPC3012A-1R0Y 1.0 ±30% 1V100K 111 0.048 2.20 1.71 Silver HPC3012A-1R5Y 1.5 ±30% 1V100K 95 0.055 1.70 1.60 Silver HPC3012A-2R2M 2.2 ±20% 1V100K 78 0.075 1.50 1.37 Silver HPC3012A-3R3M 3.3 ±20% 1V100K 61 0.100 1.20 1.21 Silver HPC3012A-4R7M 4.7 ±20% 1V100K 50 0.130 1.00 1.06 Silver HPC3012A-6R8M 6.8 ±20% 1V100K 43 0.190 0.85 0.89 Silver HPC3012A-100M 10 ±20% 1V100K 32 0.270 0.73 0.72 Silver HPC3012A-150M 15 ±20% 1V100K 26 0.450 0.53 0.57 Silver HPC3012A-220M 22 ±20% 1V100K 22 0.630 0.50 0.50 Silver Note: Isat：Based on inductance change （△L/L0：≦-30%）@ ambient temp. 25℃ Irms：Based on temperature rise （△T：40℃ typ.） www.tai-tech.com.tw P3 TAI-TECH HPC3012A-SERIES HPC3012A-SERIES 20 50 220 10 0 -10 150 -20 30 L(%) INDUCTANCE(uH) 40 220 -30 6R8 150 100 4R7 3R3 -40 20 2R2 100 10 0 0.1 -60 4R7 3R3 2R2 1R5 1R0 1 10 100 1R0 1R5 -50 6R8 -70 -80 1000 0 0.6 1.2 1.8 2.4 3 DC CURRENT(A) FREQUENCY(MHz) Core chipping The appearance standard of the chipping size on top side, and bottom side ferrite core is listed below. Type HPC3012A L W 0.6mm Max. 0.6mm Max. Void appearance tolerance Limit Size of voids occurring to coating resin is specified below. Exposed wire tolerance limit of coating resin part on product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction（dimension a）：Acceptable when a≦w/2 Nonconforming when a＞w/2 2. Length direction（dimension b）：Dimension b is not specified. 3. The total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. External appearance criterion for exposed wire Exposed end of the winding wire at the secondary side should be 2mm and below. www.tai-tech.com.tw P4 TAI-TECH 5. Material List No. Item Material 1 Core Ni-Zn ferrite 2 Wire Copper Wire 3 Coating Epoxy 4 Solder Lead free 6. Reliability and Test Condition Item Operating Temperature Storage Temperature Performance - 25 ~ +120℃. Test Condition Including self-generated heat - 40 ~ +85℃. - 5 to 40℃ for the product with taping. Rated current Inductance (L) Within the specified tolerance DC Resistance LCR Meter: HP 4285A or equivalent, 100kHz, 1V DC Ohmmeter: HIOKI3227 or equivalent Temperature characteristics Inductance change：Within±20% Resistance to flexure substrate No damage. Measurement of inductance shall be taken at temperature rang within–25℃ to +85℃. With reference to inductance value at+20 ℃,change rate shall be calculated. Measurement of inductance shall be taken at temperature rang within–40℃ to +125℃. With reference to inductance value at+20 ℃,change rate shall be calculated. The test samples shall be soldered to the testing board by the reflow. As illustrated below, apply force in the direction of the arrow indicating until deflection of the test board reaches to 2mm. Substrate size：100x40x1.0 Substrate material：glass epoxy-resin Solder cream thickness：0.10 The test samples shall be soldered to the testing board and by the reflow. Adhesion of Terminal electrode Shall not come off PC board. Applied force：10 N to X and Y directions. Duration：5s Solder cream thickness：0.10 The test samples shall be soldered to the test board by the reflow. Then it shall be submitted to below test conditions. Frequency: 10-55Hz Total Amplitude: 1.5mm (May not exceed acceleration 196m/S2 ) Sweeping Method:10Hz to 55Hz to 10Hz for 1min. Time：2 hours each in X,Y, and Z Direction. Recovery: At least 2hrs of recovery under the standard condition after the test, followed by the measurement within 48hrs. Resistance to Vibration Inductance change：Within±10% No abnormality observed in appearance. Solderability The test samples shall be dipped in flux, and then immersed in molten solder as shown in below. Flux：methanol solution containing rosin 25% At least 90% of surface of terminal electrode is covered by new solder. Solder temperature: 245±5℃ Time: 5±1.0 sec. Immersion depth: All sides of mounting terminal shall be immersed. Resistance to soldering Inductance change：Within±10% No abnormality observed in appearance. www.tai-tech.com.tw The test sample shall be exposed to reflow oven at 230±5℃ for 40 seconds, with peak temperature at 260±5℃ for 5 seconds,2 times. Test board thickness: 1.0mm Test board material: glass epoxy-resin P5 TAI-TECH Item Performance Test Condition The test samples shall be soldered to the test board by the reflow. The test samples shall be placed at specified temperature for specified time by step 1 to step 4 as shown below in sequence. The temperature cycles shall be repeated 100 cycles . Thermal shock Test Method and Remarks The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below. Temperature: 60±2℃ Humidity: 90~95%RH Time: 500+24/-0 hrs Damp heat life test Loading under damp heat life test The test samples shall be soldered to the test board by the reflow. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below. Temperature: 60±2℃ Humidity: 90~95%RH Applied current: Rated current Time: 500+24/-0 hrs Low temperature life test The test samples shall be soldered to the test board by the reflow. After that, the test samples shall be placed at test conditions as shown in below. Temperature:-40±2℃ Time:500+24/-0 hrs Loading at high temperature life test The test samples shall be soldered to the test board by the reflow. Temperature: 85±2℃. Applied current: Rated current Time: 500+24/-0 hrs. Inductance change：Within±10% No abnormality observed in appearance. 7. Soldering www.tai-tech.com.tw P6 TAI-TECH 8. Packaging Information (1) Reel Dimension (2) Tape Dimension COVER TAPE C B D 2.0±0.5 A EMBOSSED CARRIER Type A(mm) B(mm) C(mm) D(mm) Type A(mm) HPC3012A 10±1.5 60±1.0 13±0.5 180±0.5 HPC3012A 3.2±0.1 B(mm) Ko(mm) P(mm) W(mm) 3.2±0.1 1.6±0.1 (3) Packaging Quantity Type Chip / Reel HPC3012A 2000 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw 4.0±0.1 8.0±0.2 t(mm) 0.30±0.05