HPC4030NF-4R7M

TAIPAQ P1 SMD Power Inductor HPC4030NF-Series ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 17/04/19 新發行 羅宜春 梁周虎 張光 備 注 TAIPAQ P2 SMD Power Inductor HPC4030NF-Series 1. Features 1. Magnetic-resin shielded construction reduces buzz noise to ultra-low levels 2. Metallization on ferrite core results in excellent shock resistance and damage-free durability Halogen Pb Halogen-free Pb-free 3. Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI) 4. 30% higher current rating than conventional nductors of equal size 5. Takes up less PCB real estate and save more power 2. Applications 1. LED Lighting 2. Next-generation mobile devices with multifunction such as mobile TV and digital movie cameras 3. Flat-screen TVs, blue-ray disc recorders, set top box 4. Notebooks, desktop computers, servers, graphic cards cards 5. Portable gaming devices, personal navigation systems, personal multimedia devices 6. Automotive systems 7. Telecomm base stations Recommendend Land pattern 3. Dimension 100 Series HPC4030NF *A(mm) *B(mm) 4.0±0.2 E(mm) a(mm) b(mm) c(mm) 4.0±0.2 3.0Max. 1.35±0.3 3.4±0.2 C(mm) D(mm) 1.3Typ 1.5Typ 3.7Typ *Dimensions are not including the termination. For maximum overall dimensions with ternmination , add 0.1mm. 4. Part Numbering HPC 4030 NF A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance . - 100 M D E Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. A/B*C 1R0=1.00uh 100=10uh,101=100uh,102=1000uh K=±10%, L=±15%,M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional. magnetic shielding TAIPAQ P3 5. Specification Rated current Tempetature current I rms (A) Saturation current I sat (A) DCR (mΩ) @25℃ ±20%. 0.68 4.60 6.80 10 HPC4030NF-1R0M 1.00 4.20 5.30 14 HPC4030NF-1R5M 1.50 3.40 4.90 20 HPC4030NF-2R2M 2.20 3.00 4.90 30 HPC4030NF-3R3M 3.30 2.40 3.30 40 HPC4030NF-4R7M 4.70 2.05 2.90 60 HPC4030NF-5R6M 5.60 1.95 2.60 65 HPC4030NF-6R8M 6.80 1.80 2.75 90 HPC4030NF-8R2M 8.20 1.60 2.10 90 HPC4030NF-100M 10.0 1.50 2.00 100 HPC4030NF-120M 12.0 1.30 1.80 135 HPC4030NF-150M 15.0 1.20 1.70 190 HPC4030NF-180M 18.0 1.10 1.50 200 HPC4030NF-220M 22.0 1.00 1.30 225 HPC4030NF-330M 33.0 0.85 1.10 330 HPC4030NF-470M 47.0 0.72 0.95 445 Part Number Inductance L0 (uH)±20% @0A HPC4030NF-R68M Note: 1. All test data referenced to 25℃ ambient , Ls:100KHz/1V. 2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃. 4. Saturation Current ( Isat ) will cause L0 to drop approximately 30%. 5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. TAIPAQ P4 5. Material List e b a c d NO Items Materials a Core Ferrite Core b Wire Enameled Copper Wire c Glue Epoxy with magnetic powder d Terminal Ag/Ni/Sn+ Sn Solder e Ink Halogen-free ketone 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1.-10~+40℃,50~60%RH (Product without taping) 2.-40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Reliability Test Life Test Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 2 TAIPAQ P5 Item Performance Test Condition Type Peak value (g’s) Normal duration (D) (ms) SMD 1500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Shock Bending Solderability Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Wave form Velocity change (Vi)ft/sec Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,