HCI1005F-68NJ-M8

P1. TAI-TECH High Frequency Chip Inductor (Lead Free) HCI1005F-Series-M8 1.Features 1. Monolithic inorganic material construction. Halogen Pb Halogen-free Pb-free 2. Closed magnetic circuit avoids crosstalk. 3. S.M.T. type. 4. Suitable for reflow soldering. 5. Shapes and dimensions follow E.I.A. spec. 6. Available in various sizes. 7. Excellent solder ability and heat resistance. 8. High SRF up to 6GHz and above. 9. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimensions D C Chip Size A B A 1.00±0.05 B 0.50±0.05 C 0.50±0.05 D 0.25±0.10 Units: mm 3. Part Numbering HCI 1005 F A B C A: Series B: Dimension C: Material D: Inductance E: Inductance Tolerance F: MARKING - 6N8 J D E - M8 F LxW Lead Free Material 6N8=6.8 nH J=±5% , K=±10% 4.Specification Tai-Tech Part Number Test Inductance Frequency (nH) (MHz) Q Q (Typ.) Rated Current Frequency(MHz) DCR (Ω) SRF (MHz) min. 100 300 500 800 1000 (mA) max max. typ. min. typ. HCI1005F-1N0S-M8 1.0 100 8 11 25 34 43 52 300 0.08 0.04 10000 >13000 HCI1005F-1N2S-M8 1.2 100 8 11 25 35 44 52 300 0.09 0.04 10000 >13000 HCI1005F-1N5S-M8 1.5 100 8 11 24 33 44 48 300 0.10 0.05 6000 >13000 HCI1005F-1N8S-M8 1.8 100 8 11 23 30 36 42 300 0.12 0.06 6000 11000 HCI1005F-2N0S-M8 2.0 100 8 11 21 27 34 39 300 0.12 0.06 6000 10500 HCI1005F-2N2S-M8 2.2 100 8 10 18 25 31 36 300 0.13 0.07 6000 10000 HCI1005F-2N4S-M8 2.4 100 8 10 18 24 31 35 300 0.13 0.07 6000 9500 HCI1005F-2N7S-M8 2.7 100 8 10 18 24 31 34 300 0.13 0.08 6000 9000 HCI1005F-3N0S-M8 3.0 100 8 10 18 24 31 35 300 0.16 0.09 6000 8500 www.tai-tech.com.tw TAI-TECH Tai-Tech Part Number Test Inductance Frequency (nH) (MHz) Q Q (Typ.) Rated Current Frequency(MHz) DCR (Ω) SRF (MHz) min. 100 300 500 800 1000 (mA) max max. typ. min. typ. HCI1005F-3N3S-M8 3.3 100 8 10 18 24 31 35 300 0.16 0.10 6000 8000 HCI1005F-3N6S-M8 3.6 100 8 10 18 24 31 35 300 0.20 0.11 5000 7500 HCI1005F-3N9S-M8 3.9 100 8 10 18 24 31 35 300 0.21 0.12 4000 7000 HCI1005F-4N3S-M8 4.3 100 8 10 18 24 31 35 300 0.20 0.12 4000 6500 HCI1005F-4N7S-M8 4.7 100 8 10 18 24 31 34 300 0.21 0.12 4000 6000 HCI1005F-5N1S-M8 5.1 100 8 10 18 24 31 34 300 0.21 0.13 4000 5800 HCI1005F-5N6S-M8 5.6 100 8 10 18 24 30 35 300 0.23 0.15 4000 5700 HCI1005F-6N2S-M8 6.2 100 8 10 18 24 30 34 300 0.25 0.16 3900 5600 HCI1005F-6N8□-M8 6.8 100 8 10 18 23 29 32 300 0.25 0.17 3900 5500 HCI1005F-7N5□-M8 7.5 100 8 10 18 23 29 32 300 0.25 0.18 3700 5200 HCI1005F-8N2□-M8 8.2 100 8 10 18 23 29 31 300 0.28 0.21 3600 4900 HCI1005F-9N1□-M8 9.1 100 8 10 18 23 29 31 300 0.30 0.22 3400 4500 HCI1005F-10N□-M8 10 100 8 10 18 23 29 31 300 0.31 0.23 3200 4300 HCI1005F-12N□-M8 12 100 8 11 18 23 29 31 300 0.40 0.28 2700 3900 HCI1005F-15N□-M8 15 100 8 11 18 23 28 30 300 0.46 0.31 2300 3500 HCI1005F-18N□-M8 18 100 8 11 18 23 28 30 300 0.55 0.35 2100 3100 HCI1005F-22N□-M8 22 100 8 11 17 22 26 27 300 0.60 0.42 1900 2800 HCI1005F-27N□-M8 27 100 8 11 17 21 25 26 300 0.70 0.47 1600 2300 HCI1005F-33N□-M8 33 100 8 11 16 20 23 22 200 0.80 0.50 1300 1900 HCI1005F-39N□-M8 39 100 8 11 16 20 23 21 200 0.90 0.52 1200 1700 HCI1005F-47N□-M8 47 100 8 11 16 19 21 18 200 1.00 0.58 1000 1500 HCI1005F-56N□-M8 56 100 8 11 16 18 18 16 200 1.00 0.61 750 1300 HCI1005F-68N□-M8 68 100 8 11 15 17 18 11 180 1.20 0.70 750 1200 HCI1005F-82N□-M8 82 100 8 10 14 16 15 6 150 1.30 0.81 600 1100 HCI1005F-R10□-M8 100 100 8 10 14 14 12 - 150 1.50 0.94 600 1000 HCI1005F-R12□-M8 120 100 8 10 12 10 - - 150 1.60 1.10 600 800 HCI1005F-R15□-M8 150 100 8 12 17 17 - - 140 3.20 2.57 550 920 HCI1005F-R18□-M8 180 100 8 12 16 - - - 130 3.70 2.97 500 810 HCI1005F-R22□-M8 220 100 8 12 16 - - - 120 4.20 3.29 450 700 HCI1005F-R27□-M8 270 100 8 12 14 - - - 110 4.80 3.92 400 600 □：J=±5% , K=±10% www.tai-tech.com.tw P2. TAI-TECH 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB GHB FCA FCI Test Condition FHI FCH HCI MGI -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -40~+125℃ -40~+105℃ Transportation Storage Temperature --For long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current < 1A ∆T 20℃Max Temperature Rise Test Rated Current ≧ 1A ∆T 40℃Max Appearance: No significant abnormality. Solder heat Resistance Impedance change: Within ± 30%. Inductance change:：within±10% Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 260±5℃ Flux for lead free: ROL0 Dip time: 10±0.5sec. No mechanical damage. Preheating Dipping Natural cooling Remaining terminal electrode:75% min. 260°C 150°C 60 second More than 95% of the terminal Solderability 150° C 4±1 second 60 second W The terminal electrode and the dielectric must Terminal strength Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 245±5℃ Flux for lead free: ROL0 Dip time: 4±1sec. Preheating Dipping Natural cooling 245° C electrode should be covered with solder. 10±0.5 second not be damaged by the forces applied on the For FCB FCM HCB GHB FCI FHI FCH HCI MGI: Size Force (Kgf) Time(sec) 1005 0.2 >30 1608 0.5 right conditions. 20(.787) Solder a chip on a test substrate, bend the The terminal electrode and the dielectric must Flexture strength not be damaged by the forces applied on the Bending 45(1.772) 45(1.772) right conditions. substrate by 2mm (0.079in)and return. The duration of the applied forces shall be 60 40(1.575) (+ 5) Sec. 100(3.937) R 0.5(0.02) Bending Strength Size mm(inches) P-Kgf 1608 0.80(0.033) 0.3 The ferrite should not be damaged by Forces applied on the right condition. Appearance: Cracking, chipping and any other defects harmful to the characteristics should not be allowed. Random Vibration Test Impedance: within±30% Inductance change:：within±10%. www.tai-tech.com.tw Frequency: 10-55-10Hz for 15 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 15 min.. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). P3. TAI-TECH Item Performance Test Condition Temperature: 125±2℃(bead), 85±2℃(inductor) Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 2 to 3hrs. Life testing at High Appearance: no damage. Temperature Impedance: within±30%of initial value. Inductance: within±10%of initial value. Q: within±30%of initial value. (FCI FHI FCH) Q: within±20%of initial value. (HCI MGI ) Humidity Appearance: no damage. Thermal shock Low temperature storage Phase Humidity: 90~95%RH. Temperature: 40±2℃. Temperature: 60±2℃.(HCI MGI) Duration: 504±8hrs. Measured at room temperature after placing for 2 to 3hrs. Temperature(℃) Time(min.) 1 -40±2℃ Impedance: within±30%of initial value. 2 room temp. Inductance: within±10%of initial value. 3 +105±2℃ Q: within±30%of initial value. Measured: 500 times (FCI FHI FCH) Q: within±20%of initial value. (HCI MGI) 30±5 ≦0.5 30±5 Temperature: -40±2℃. Duration: 500±8hrs. Measured at room temperature after placing for 2 to 3hrs. test No mechanical damage Drop 10 times on a concrete floor from a height of 75cm Impedance change: ±30% Drop Condition for 1 cycle Step1: -40±2℃ 30±5 min. Step2: +105±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 2 to 3 hrs. Inductance change:：within±10% Derating **Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) 6 5 4 3 2 1 0 6.Soldering and Mounting 6A 5A 4A 3A 2A 1.5A 1A 85 125 Operating Temperature(°C) 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size HCI Type G(mm) H(mm) 0603 A(mm) B(mm) C(mm) D(mm) L(mm) 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.20~0.30 0.25~0.40 1005 1.0±0.05 0.50±0.05 0.50±0.05 0.25±0.10 1.50 0.45~0.55 0.45~0.55 L H Series PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. G www.tai-tech.com.tw P4. TAI-TECH 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING within 4~5s ( TEMPERATURE(° C) TP(260° C / 40s max.) 217 60~150s 200 150 NATURAL COOLING SOLDERING PRE-HEATING NATURAL COOLING 20~40s ) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. 60~180s 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height Upper limit Recommendable t 7.Packaging Information 7-1. Reel Dimension A C B D R1 .9 Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 .5 ±0 13 .5 2±0.5 0.5 R1 R0.5 120° 7"x8mm 7-2 Tape Dimension / 8mm ■Material of taping is paper .0 -0 .1 +0 .5 1 D: F:3.5±0.05 B0 t Size 060303 P 05 0. 10. + 56 1. D: P(mm) t(mm) 0.45max 2.0±0.05 0.45max 0.70±0.06 0.40±0.06 A0 W:8.0±0.1 t B0 P Bo(mm) Ao(mm) Ko(mm) Ko A0 P0:4±0.1 E:1.75±0.1 P2:2±0.1 F:3.5±0.1 W:8.0±0.3 E:1.75±0.1 P0:4±0.1 Size 100505 Ko www.tai-tech.com.tw Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) 0.80max 2.0±0.05 0.80max 1.15±0.10 0.65±0.10 P6. P5. TAI-TECH 7-3. Packaging Quantity Chip Size 100505 060303 Chip / Reel 10000 15000 Inner box 50000 75000 Middle box 250000 375000 Carton 500000 750000 7-4. Tearing Off Force F The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Top cover tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Base tape Application Notice •Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 3. Recommended products should be used within 6 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. Impedance, Inductance, Q v.s Frequency Characteristics(Typical) Impedance v.s. Frequency Characteristics Inductance v.s. Frequency Characteristics 22n 47n 100 10n 6.8n 10 1 10 100 1000 FREQUENCY(MHz) 10000 100 6.8n 100 47n 10n 33n Q 1000 INDUCTANCE(nH) IMPEDANCE(Ohm) HCI1005 Q vs Freq. 1000 10000 33n Q v.s. Frequency Characteristics HCI1005 L vs Freq. HCI1005 Z vs Freq. 10 10n 22n 22n 10 6.8n 47n 1 1 10 100 1000 FREQUENCY(MHz) www.tai-tech.com.tw 10000 10 100 1000 FREQUENCY(MHz) 10000