P1.
TAI-TECH
High Frequency Chip Inductor (Lead Free)
HCI1005F-Series-M8
1.Features
1. Monolithic inorganic material construction.
Halogen
Pb
Halogen-free
Pb-free
2. Closed magnetic circuit avoids crosstalk.
3. S.M.T. type.
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solder ability and heat resistance.
8. High SRF up to 6GHz and above.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimensions
D
C
Chip Size
A
B
A
1.00±0.05
B
0.50±0.05
C
0.50±0.05
D
0.25±0.10
Units: mm
3. Part Numbering
HCI
1005
F
A
B
C
A: Series
B: Dimension
C: Material
D: Inductance
E: Inductance Tolerance
F: MARKING
-
6N8
J
D
E
-
M8
F
LxW
Lead Free Material
6N8=6.8 nH
J=±5% , K=±10%
4.Specification
Tai-Tech
Part Number
Test
Inductance
Frequency
(nH)
(MHz)
Q
Q (Typ.)
Rated Current
Frequency(MHz)
DCR (Ω)
SRF (MHz)
min.
100
300
500
800
1000
(mA) max
max.
typ.
min.
typ.
HCI1005F-1N0S-M8
1.0
100
8
11
25
34
43
52
300
0.08
0.04
10000
>13000
HCI1005F-1N2S-M8
1.2
100
8
11
25
35
44
52
300
0.09
0.04
10000
>13000
HCI1005F-1N5S-M8
1.5
100
8
11
24
33
44
48
300
0.10
0.05
6000
>13000
HCI1005F-1N8S-M8
1.8
100
8
11
23
30
36
42
300
0.12
0.06
6000
11000
HCI1005F-2N0S-M8
2.0
100
8
11
21
27
34
39
300
0.12
0.06
6000
10500
HCI1005F-2N2S-M8
2.2
100
8
10
18
25
31
36
300
0.13
0.07
6000
10000
HCI1005F-2N4S-M8
2.4
100
8
10
18
24
31
35
300
0.13
0.07
6000
9500
HCI1005F-2N7S-M8
2.7
100
8
10
18
24
31
34
300
0.13
0.08
6000
9000
HCI1005F-3N0S-M8
3.0
100
8
10
18
24
31
35
300
0.16
0.09
6000
8500
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TAI-TECH
Tai-Tech
Part Number
Test
Inductance
Frequency
(nH)
(MHz)
Q
Q (Typ.)
Rated Current
Frequency(MHz)
DCR (Ω)
SRF (MHz)
min.
100
300
500
800
1000
(mA) max
max.
typ.
min.
typ.
HCI1005F-3N3S-M8
3.3
100
8
10
18
24
31
35
300
0.16
0.10
6000
8000
HCI1005F-3N6S-M8
3.6
100
8
10
18
24
31
35
300
0.20
0.11
5000
7500
HCI1005F-3N9S-M8
3.9
100
8
10
18
24
31
35
300
0.21
0.12
4000
7000
HCI1005F-4N3S-M8
4.3
100
8
10
18
24
31
35
300
0.20
0.12
4000
6500
HCI1005F-4N7S-M8
4.7
100
8
10
18
24
31
34
300
0.21
0.12
4000
6000
HCI1005F-5N1S-M8
5.1
100
8
10
18
24
31
34
300
0.21
0.13
4000
5800
HCI1005F-5N6S-M8
5.6
100
8
10
18
24
30
35
300
0.23
0.15
4000
5700
HCI1005F-6N2S-M8
6.2
100
8
10
18
24
30
34
300
0.25
0.16
3900
5600
HCI1005F-6N8□-M8
6.8
100
8
10
18
23
29
32
300
0.25
0.17
3900
5500
HCI1005F-7N5□-M8
7.5
100
8
10
18
23
29
32
300
0.25
0.18
3700
5200
HCI1005F-8N2□-M8
8.2
100
8
10
18
23
29
31
300
0.28
0.21
3600
4900
HCI1005F-9N1□-M8
9.1
100
8
10
18
23
29
31
300
0.30
0.22
3400
4500
HCI1005F-10N□-M8
10
100
8
10
18
23
29
31
300
0.31
0.23
3200
4300
HCI1005F-12N□-M8
12
100
8
11
18
23
29
31
300
0.40
0.28
2700
3900
HCI1005F-15N□-M8
15
100
8
11
18
23
28
30
300
0.46
0.31
2300
3500
HCI1005F-18N□-M8
18
100
8
11
18
23
28
30
300
0.55
0.35
2100
3100
HCI1005F-22N□-M8
22
100
8
11
17
22
26
27
300
0.60
0.42
1900
2800
HCI1005F-27N□-M8
27
100
8
11
17
21
25
26
300
0.70
0.47
1600
2300
HCI1005F-33N□-M8
33
100
8
11
16
20
23
22
200
0.80
0.50
1300
1900
HCI1005F-39N□-M8
39
100
8
11
16
20
23
21
200
0.90
0.52
1200
1700
HCI1005F-47N□-M8
47
100
8
11
16
19
21
18
200
1.00
0.58
1000
1500
HCI1005F-56N□-M8
56
100
8
11
16
18
18
16
200
1.00
0.61
750
1300
HCI1005F-68N□-M8
68
100
8
11
15
17
18
11
180
1.20
0.70
750
1200
HCI1005F-82N□-M8
82
100
8
10
14
16
15
6
150
1.30
0.81
600
1100
HCI1005F-R10□-M8
100
100
8
10
14
14
12
-
150
1.50
0.94
600
1000
HCI1005F-R12□-M8
120
100
8
10
12
10
-
-
150
1.60
1.10
600
800
HCI1005F-R15□-M8
150
100
8
12
17
17
-
-
140
3.20
2.57
550
920
HCI1005F-R18□-M8
180
100
8
12
16
-
-
-
130
3.70
2.97
500
810
HCI1005F-R22□-M8
220
100
8
12
16
-
-
-
120
4.20
3.29
450
700
HCI1005F-R27□-M8
270
100
8
12
14
-
-
-
110
4.80
3.92
400
600
□:J=±5% , K=±10%
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P2.
TAI-TECH
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Performance
FCB
FCM
HCB
GHB
FCA
FCI
Test Condition
FHI
FCH
HCI
MGI
-40~+125℃
(Including self-temperature rise)
-40~+105℃
(Including self-temperature rise)
-40~+125℃
-40~+105℃
Transportation
Storage Temperature
--For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Inductance (Ls)
Agilent4287
Q Factor
Refer to standard electrical characteristics list
Agilent16192
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current < 1A ∆T 20℃Max
Temperature Rise Test
Rated Current ≧ 1A ∆T 40℃Max
Appearance: No significant abnormality.
Solder heat Resistance
Impedance change: Within ± 30%.
Inductance change::within±10%
Preheat: 150℃,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 260±5℃
Flux for lead free: ROL0
Dip time: 10±0.5sec.
No mechanical damage.
Preheating Dipping Natural cooling
Remaining terminal electrode:75% min.
260°C
150°C
60
second
More than 95% of the terminal
Solderability
150° C
4±1
second
60
second
W
The terminal electrode and the dielectric must
Terminal strength
Preheat: 150℃,60sec.
Solder: Sn-Cu0.5
Solder tamperature: 245±5℃
Flux for lead free: ROL0
Dip time: 4±1sec.
Preheating Dipping Natural cooling
245° C
electrode should be covered
with solder.
10±0.5
second
not be damaged by the forces applied on the
For FCB FCM HCB GHB
FCI FHI FCH HCI MGI:
Size
Force (Kgf) Time(sec)
1005
0.2
>30
1608
0.5
right conditions.
20(.787)
Solder a chip on a test substrate, bend the
The terminal electrode and the dielectric must
Flexture strength
not be damaged by the forces applied on the
Bending
45(1.772)
45(1.772)
right conditions.
substrate by 2mm (0.079in)and return.
The duration of the applied forces shall be 60
40(1.575)
(+ 5) Sec.
100(3.937)
R 0.5(0.02)
Bending Strength
Size
mm(inches)
P-Kgf
1608
0.80(0.033)
0.3
The ferrite should not be damaged by
Forces applied on the right condition.
Appearance: Cracking, chipping and any other defects harmful to the
characteristics should not be allowed.
Random Vibration Test
Impedance: within±30%
Inductance change::within±10%.
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Frequency: 10-55-10Hz for 15 min.
Amplitude: 1.52mm
Directions and times: X, Y, Z directions for 15 min..
This cycle shall be performed 12 times in each
of three mutually perpendicular directions
(Total 9hours).
P3.
TAI-TECH
Item
Performance
Test Condition
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Life testing at High
Appearance: no damage.
Temperature
Impedance: within±30%of initial value.
Inductance: within±10%of initial value.
Q: within±30%of initial value. (FCI FHI FCH)
Q: within±20%of initial value. (HCI MGI )
Humidity
Appearance: no damage.
Thermal shock
Low temperature storage
Phase
Humidity: 90~95%RH.
Temperature: 40±2℃.
Temperature: 60±2℃.(HCI MGI)
Duration: 504±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
Temperature(℃) Time(min.)
1
-40±2℃
Impedance: within±30%of initial value.
2
room temp.
Inductance: within±10%of initial value.
3
+105±2℃
Q: within±30%of initial value.
Measured: 500 times
(FCI FHI FCH)
Q: within±20%of initial value.
(HCI MGI)
30±5
≦0.5
30±5
Temperature: -40±2℃.
Duration: 500±8hrs.
Measured at room temperature after placing
for 2 to 3hrs.
test
No mechanical damage
Drop 10 times on a concrete floor from a
height of 75cm
Impedance change: ±30%
Drop
Condition for 1 cycle
Step1: -40±2℃
30±5 min.
Step2: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after placing
for 2 to 3 hrs.
Inductance change::within±10%
Derating
**Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
Derated Current(A)
6
5
4
3
2
1
0
6.Soldering and Mounting
6A
5A
4A
3A
2A
1.5A
1A
85
125
Operating Temperature(°C)
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
HCI
Type
G(mm)
H(mm)
0603
A(mm) B(mm) C(mm) D(mm) L(mm)
0.6±0.03
0.30±0.03
0.30±0.03 0.15±0.05
0.80
0.20~0.30
0.25~0.40
1005
1.0±0.05
0.50±0.05
0.50±0.05 0.25±0.10
1.50
0.45~0.55
0.45~0.55
L
H
Series
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
Products shall be positioned in the sideway direction against the mechanical
stress to prevent failure.
G
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P4.
TAI-TECH
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
•Preheat circuit and products to 150℃
•350℃ tip temperature (max)
•Never contact the ceramic with the iron tip
•1.0mm tip diameter (max)
Iron Soldering
Reflow Soldering
PRE-HEATING
SOLDERING
within 4~5s
(
TEMPERATURE(° C)
TP(260° C / 40s max.)
217
60~150s
200
150
NATURAL
COOLING
SOLDERING
PRE-HEATING
NATURAL
COOLING
20~40s
)
•Use a 20 watt soldering iron with tip diameter of 1.0mm
•Limit soldering time to 4~5sec.
60~180s
350
150
Gradual cooling
Over 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Reflow times: 3 times max
Fig.1
Iron Soldering times:1 times max
Fig.2
6-2.3 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
Upper limit
Recommendable
t
7.Packaging Information
7-1. Reel Dimension
A
C
B
D
R1
.9
Type
A(mm)
B(mm)
C(mm)
D(mm)
7”x8mm
9.0±0.5
60±2
13.5±0.5
178±2
.5
±0
13
.5
2±0.5
0.5
R1
R0.5
120°
7"x8mm
7-2 Tape Dimension / 8mm
■Material of taping is paper
.0
-0
.1
+0
.5
1
D:
F:3.5±0.05
B0
t
Size
060303
P
05
0.
10.
+
56
1.
D:
P(mm)
t(mm)
0.45max
2.0±0.05
0.45max
0.70±0.06 0.40±0.06
A0
W:8.0±0.1
t
B0
P
Bo(mm) Ao(mm) Ko(mm)
Ko
A0
P0:4±0.1
E:1.75±0.1
P2:2±0.1
F:3.5±0.1
W:8.0±0.3
E:1.75±0.1
P0:4±0.1
Size
100505
Ko
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Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
0.80max
2.0±0.05
0.80max
1.15±0.10 0.65±0.10
P6.
P5.
TAI-TECH
7-3. Packaging Quantity
Chip Size
100505
060303
Chip / Reel
10000
15000
Inner box
50000
75000
Middle box
250000
375000
Carton
500000
750000
7-4. Tearing Off Force
F
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
165° to180°
Top cover tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Base tape
Application Notice
•Storage Conditions
To maintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH.
3. Recommended products should be used within 6 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
•Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Impedance, Inductance, Q v.s Frequency Characteristics(Typical)
Impedance v.s. Frequency Characteristics
Inductance v.s. Frequency Characteristics
22n
47n
100
10n
6.8n
10
1
10
100
1000
FREQUENCY(MHz)
10000
100
6.8n
100
47n
10n
33n
Q
1000
INDUCTANCE(nH)
IMPEDANCE(Ohm)
HCI1005 Q vs Freq.
1000
10000
33n
Q v.s. Frequency Characteristics
HCI1005 L vs Freq.
HCI1005 Z vs Freq.
10
10n
22n
22n
10
6.8n
47n
1
1
10
100
1000
FREQUENCY(MHz)
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10000
10
100
1000
FREQUENCY(MHz)
10000
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