ABG10A50M330

Power Inductors 1. External Dimensions (Unit:m/m) Type A B C D E a b c Q’TY/Reel ABG10A50 10.0±0.2 10.0±0.2 5.1Max 4.2Ref 1.7Ref 6.2Ref 2.0Ref 5.5Ref 700 2. Part Number Code ABG A A: B: C: D: E: F: 10 B A C Series Name Dimensions(mm) Materials Thickness(mm) Tolerance Inductance 50 D M E 330 F Power Inductors 10 10.0x10.0 NO use 50 5.1 Max M:±20% 330=33uH ： ： 3. Electrical Characteristics Part Number ABG10A50M330 Inductance Test Frequency DC Resistance (µH) (KHz) (mΩ)±30% 33.0 100KHz/1V 71.0 Heat Rating Current Irms (A) Saturation Current lsat (A) 3.5 5.2 Notes: ℃ ambient. b. Operating Temperature Range-40℃ to +125℃. a. All test data is referenced to 25 △ c. Irms: DC current(A)that will cause an approximate T of 40 ℃. d. lsat: DC current(A)that will cause Lo to drop approximately 40%. ℃ under worst case operating e. The part temperature(ambient + temp rise)should not exceed 125 conditions. Circuit design,component placement, PWB trace size and thickness,airflow and other ， cooling provisions all affect the part temperature Part temperature should be verified in the end application. Http://www.coilank.com E-mail:sales@coilank.com Power Inductors 4. Material List No Item Material Supplier UL NO. 1 CORE N401H SDR-10-4.8-5.2-2.6S CYOR EQUIVALENT N/A 2 WIRE UEWH/U2 PEWC OR EQUIVALENT E201757 3 Epoxy DA-1001BK/E-500AH(BLACK) CHOR EQUIVALENT N/A 5. Test Data ELECTRICAL CHARCTERISTIC MECHANICAL DIMENSIONS SPEC L(uH) DCR(mΩ) Isat(uH) A(mm) B(mm) C(mm) D(mm) TOL 33.0 71.0 10.0 10.0 5.1 4.2 NO ±20% ±30% ±0.2 ±0.2 Max Ref 1 30.83 68.83 5.2A (L0A-L5.2A) /L0A≤40% 20.95 10.01 10.03 4.86 OK 2 30.96 69.07 20.92 10.02 9.98 4.88 OK 3 30.58 70.65 21.88 10.01 10.00 4.89 OK 4 31.12 71.74 21.27 10.03 10.03 4.88 OK 5 31.29 71.94 21.13 9.99 9.99 4.87 OK 6 30.54 68.17 20.95 10.00 10.03 4.87 OK 7 30.65 70.89 20.89 10.03 9.96 4.88 OK 8 31.13 71.04 21.17 10.02 10.00 4.86 OK 9 31.07 69.66 21.18 10.00 10.02 4.89 OK 10 31.19 71.79 21.12 9.98 10.06 4.86 OK Test Equipmets:CD1063 、CD1320、CD1068、502BC Curve： 50 100 40 80 30 60 20 40 10 20 0 0 0 1 2 3 4 5 6 Current(A) Http://www.coilank.com E-mail:sales@coilank.com 7 Tenperature(℃) Indutance(uH) Inductance VS Temperature L(uH) ΔT(℃) Power Inductors 6. Test and Measurement Procedures 6.1 Test Conditions 6.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15 b. Relative Humidity: 65%±20% c. Air Pressure: 86KPa to 106KPa 6.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2 b. Relative Humidity: 65%±5% c. Air Pressure: 86KPa to 106Kpa ℃ ℃ 6.2 Visual Examination a. Inspection Equipment: 10X magnifier 6.3 Electrical Test 6.3.1 Inductance (L) a. Refer to the third item. b. Test equipment: CD1063 LCR meter or equivalent. c. Test Frequency and Voltage: Refer to the third item 6.3.2 Direct Current Resistance (DCR) a. Refer to the third item b. Test equipment: 502BC or equivalent. 6.3.3 Saturation Current (Isat) a. Refer to the third item b. Test equipment: Saturation current meter c. Definition of saturation current (Isat): DC current at which the inductance drops approximate 40% from its value without current. 6.3.4 Temperature rise current (Irms) a. Refer to the third item. b. Test equipment (see Fig.5.3.4-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 6.3.4-1): 1. Set test current to be 0mA. 2. Measure initial temperature of choke surface. 3. Gradually increase current and measure choke temperature for corresponding current. 4. Definition of Temperature rise current: DC current that causes the temperature rise ( T =40°C) from 20°C ambient (see Fig. 6.3.4-2). △ Fig.6.3.4-1 Http://www.coilank.com Fig.6.3.4-2 E-mail:sales@coilank.com Power Inductors 6.4Reliability Test Items Requirements Test Methods and Remarks No removal or split of the termination or other defects shall occur. ①Solder the inductor to the testing jig (glass epoxy board shown in Fig.6.4.1-1) using eutectic solder. Then applya force in the direction of the arrow. 17.7N force. Keep time: 5s 6.4.1 Terminal Strength ② ③ Fig.6.4.1-1 No visible mechanical damage. ① Solder the chip to the test jig (glass epoxy board) usingeutectic solder. Then apply a force in the directionshown as Fig.6.4.2-1. Flexure: 2mm Pressurizing Speed: 0.5mm/sec Keep time: 30±1s Test board size: 100X40X1.0 ② ③ ④ ⑤ 6.4.2 Resistance to Flexure Fig.6.4.2-1. ①Solder the chip to the testing jig (glass epoxy board shown as the following figure) using eutectic solder. ②Thechip shall be subjected to a simple harmonic 6.4.3 Vibration 6.4.4 Temperature coefficient 6.4.5 Solderability ① No visible mechanical damage. ② Inductance change: Within ±10% Inductance change: Within ±20% 90% or more of electrode area shall be Coated by new solder. motion having total amplitude of 1.5mm, thefrequency beingvaried uniformly between the approximate limitsof 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10Hz shall be traversed in approximately 1 minute. Thismotion shall be applied for a period of 2 hours in each3mutually perpendicular directions (total of 6hours). ③ ①Temperature: -40℃~+125℃ ②With a reference value of +20℃, change rate shall becalculated ①The test samples shall be dipped in flux, and then immersed in molten solder. ②Solder temperature: 245±5℃ ③Duration: 5±1 sec. ④Solder: Sn/3.0Ag/0.5Cu ⑤Flux: 25% resin and 75% ethanol in weight ⑥Immersion depth: all sides of mounting terminal shallbe immersed Http://www.coilank.com E-mail:sales@coilank.com Power Inductors Items Requirements Test Methods and Remarks ①Re-flowing Profile: Please refer to Fig. 6.4.6-1 ②Test board thickness: 1.0mm ③Test board material: glass epoxy resin ④The chip shall be stabilized at normal condition for 1~2hours before measuring 6.4.6 Resistance to Soldering Heat ①No visible mechanical damage. ②Inductance change: Within ±10% Fig. 6.4.6-1 ① No visible mechanical damage. ②Inductance change: Within ±10% 6.4.7 Thermal Shock ①Temperature and time: -40±3℃ for 30±3min→125℃for 30±3min ②Transforming interval: Max. 20 sec ③Tested cycle: 100 cycles ④The chip shall be stabilized at normal condition for 1~2 hours before measuring 6.4.8 Resistance to Low Temperature 6.4.9 Resistance to HighTemperature 6.4.10 Damp Heat ①No mechanical damage. ②Inductance change: Within ±10% ①No mechanical damage. ②Inductance change: Within ±10% ①No mechanical damage. ②Inductance change: Within ±10% ①Temperature: -40±3℃ ②Duration: 1000±24 hours ③The chip shall be stabilized at normal condition for 1~2 hours before measuring ①Temperature: 125±2℃ ②Duration: 1000±24 hours ③The chip shall be stabilized at normal condition for 1~2 hours before measuring. ①Temperature: 85±2℃ ②Humidity: 80% to 85%RH ③Duration: 1000±24 hours ④The chip shall be stabilized at normal condition for 1~2 hours before measuring 6.4.11 Loading Under Damp Heat ①No mechanical damage. ②Inductance change: Within ±10% ①Temperature: 85±2℃ ②Humidity: 80% to 85% RH ③Applied current: Irms ④Duration: 1000±24 hours ⑤The chip shall be stabilized at normal condition for 1~2 hours before measuring 6.4.12 Loading at High Temperature ①No mechanical damage. ②Inductance change: Within ±10% ①Temperature: 85±2℃ ②Applied current: Irms ③Duration: 1000±24 hours ④The chip shall be stabilized at normal condition for 1~2 hours before measuring Http://www.coilank.com E-mail:sales@coilank.com Power Inductors 7. Packaging, Storage 7.1 Tape and Reel Packaging Dimensions 7.1 .1 Taping Dimensions (Unit: mm) Please refer to Fig. 7.1.1-1 Fig. 7.1.1-1 TYPE ABG10A50 A0 B0 W E F P0 P1 P2 10.5±0.1 10.4±0.1 24.0±0.1 1.75±0.1 11.5±0.1 4.0±0.1 16.0±0.1 2.0±0.1 7.1.2 Direction of rolling Please refer to Fig. 7.1.2-1. Fig. 7.1.2-1. Http://www.coilank.com E-mail:sales@coilank.com D0 T K0 1.5±0.1 0.5±0.05 5.5±0.1 Power Inductors 7.1.3 Reel Dimensions (Unit: mm) Please refer to Fig. 7.1.3-1. Fig. 7.1.3-1. TYPE A B C D ABG10A50 24.5±2.0 330.0±2.0 100.0±2.0 28.5±2.0 7.2 Packaging 7.2.1 The inner box specification: 350*340*40MM Packing quantity: 700PCS/ box ： Bubble bag 37*45CM Job description: putting the air bubble bag products placed inside the box, sealed with scotch tape 7.2.2 the outside box specification: 370*360*255MM Packing quantity: 2100PCS/ box Job description: will be outside the box bottom sealed, inner box into the box. a. with transparent tape sealed box at the top b. the specified location with a box labels in the outer box. c..if the mantissa box under a FCL with inner box or filling full Http://www.coilank.com E-mail:sales@coilank.com Power Inductors 7.3 Storage a.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. ℃~40℃, 70%RH (Max.) c.The ambient temperature must be kept below 30℃.Even under ideal storage conditions, b. Recommended conditions: -10 solderability of products electrodes may decrease as time passes. For this reason, product should be used with one year from the time of delivery. d. In case of storage over 6 months, solderability shall be checked before actual usage. 8. Recommended Soldering Technologies 8.1 Re-flowing Profile: △ 1~2 ℃/sec. Ramp △ Pre-heating: 150~190℃/90±30 sec. △ Time above 240℃: 20~40sec △ Peak temperature: 255℃ Max./5sec; △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.2 times for Re-flowing 8.2 Iron Soldering Profile: △ Iron soldering power: Max.30W △ Pre-heating: 150℃/60sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the] Http://www.coilank.com E-mail:sales@coilank.com