HPC6028NF-101M

TAI-TECH P1 SMD Power Inductor HPC6028NF-Series ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/09/15 新發行 楊祥忠 詹偉特 何秦芝 1.1 16/10/04 更新材料成分表 楊祥忠 詹偉特 何秦芝 備 注 TAI-TECH P2 SMD Power Inductor HPC6028NF-Series 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension C Pb-free D F 1R0 A Halogen-free E *A(mm) *B(mm) *C(mm) HPC6028NF 6.0±0.2 6.0±0.2 2.6±0.2 D(mm) E(mm) F(mm) G(mm) H(mm) I(mm) 1.6±0.3 5.8±0.3 4.3ref 2.5 5.8 1.8 *Dimensions are not including the termination. For maximum overall dimensions with termination , add 0.1mm. Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. 3. Part Numbering HPC 6028 NF A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance . Pb Recommended Land pattern B Series Halogen - 1R0 Y D E A/B*C 1R0=1.00uh 100=10uh,101=100uh,102=1000uh K=±10%, L=±15%,M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional. magnetic shielding TAI-TECH P3 4. Specification Rated current Part Number Inductance Tolerance L0 (uH) @0A Temperature current I rms (A) Saturation current I sat (A) DCR (mΩ) @25℃ ±20%. HPC6028NF-1R0Y 1.00 ±30% 5.20 5.75 10.0 HPC6028NF-1R5Y 1.50 ±30% 4.95 5.30 14.0 HPC6028NF-2R2M 2.20 ±20% 4.50 5.00 18.0 HPC6028NF-3R3M 3.30 ±20% 3.60 4.30 24.0 HPC6028NF-4R7M 4.70 ±20% 3.10 3.20 30.0 HPC6028NF-6R8M 6.80 ±20% 2.50 2.85 47.0 HPC6028NF-100M 10.0 ±20% 2.00 2.10 65.0 HPC6028NF-150M 15.0 ±20% 1.80 2.00 98.0 HPC6028NF-220M 22.0 ±20% 1.50 1.60 138 HPC6028NF-330M 33.0 ±20% 1.30 1.40 200 HPC6028NF-470M 47.0 ±20% 1.06 1.15 280 HPC6028NF-680M 68.0 ±20% 0.81 1.00 420 HPC6028NF-101M 100 ±20% 0.72 0.80 605 Note: 1. All test data referenced to 25℃ ambient , Ls:100KHz/1V. 2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ 4. Saturation Current (Isat) will cause L0 to drop approximately 30% 5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 5. Material List e b a c d NO Items Materials a Core Ferrite Core b Wire Copper Wire c Glue Epoxy with magnetic d Solder Ag/Ni/Sn e ink Halogen-free ketone 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1. -10~+40℃,50~60%RH (Product without taping) 2. -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Life Test reflow for 2 Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Load Humidity reflow for 2 Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Moisture Resistance Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min for Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 2 TAI-TECH P5 Item Performance Test Condition Type Shock Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Bending Solderability More than 95% of the terminal electrode should be covered with solder。 Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,