SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.:
Sample Order No:
OSCILLATOR
Date:
EOS-E60256-1
SSR064000I3CH
HSO751S/ 64.000MHz
2014/06/26
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
HARMONY ELECTRONICS (SUZHOU) CO.,LTD
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路
39 號
No.39, HWA DONG RD.,
DALLIAO DIST.,DAFA
INDUSTRIAL PARK.,
KAOHSIUNG CITY 831,
TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409
號2樓
2F., NO.409, SEC.2, TIDING
BLVD., NEIHU DISTRICT,
TAIPEI CITY 114, TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI
RD., T.BEOKPRAI, A.
BANPONG, RAJCHABUREE
PROVINCE 70110, THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
Tittle
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源
工業區
QIAO TANG RD., TANGWEI
VILLAGE FU YONG TOWN
SHENZHEN CITY CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
Country of origin
HSO751S SPECIFICATION
Date
SUZHOU FACTORY:
蘇州市相城區黃埭鎮安民路 5 號
NO.5 ANMING ROAD,
HUANGDAI TOWN,
XIANGCHENG DISTRCT,
SUZHOU CITY, JIANGSU
PROVINCE
TEL:86-512-67592373
FAX:86-512-67592363
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1
HSO751S
SPECIFICATION
INDEX
ITEM
PAGE
1. Type •••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3
2. Output Frequency •••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3
3. Absolute Maximum Ratings ••••••••••••••••••••••••••••••••••••••••••••••••••
3
4. Electric Specifications •••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3-4
5. Dimensions ••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
5
6. Inside Structure•••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
6
7. Mechanical Performance ••••••••••••••••••••••••••••••••••••••••••••••••••••
6
8. Environment Performance
7
••••••••••••••••••••••••••••••••••••••••••••••••••
9. Supplement••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
10. Taping and Packing•••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
10-12
11.Flow Chart••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
13
12.Environmental Workload Chemical Substance Components List
14
Tittle
Country of origin
HSO751S SPECIFICATION
Date
8-9
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1. Type Name:
HSO751S
2. Output Frequency:
64.000000MHz
3. Absolute Maximum Ratings:
Item
Vdd terminal voltage
Input terminal voltage
Output terminal voltage
Output terminal current
Storage temp. range
4.
Symbol
Vdd
Vcont
Vout
Iout
Tstr
Value
-0.5 ~ 7.0
-0.5 ~ Vdd+0.5
-0.5 ~ Vdd+0.5
20
-55 ~ 125
Unit
V
V
V
mA
℃
Electric Specifications:
Δf/F
Topr
Vdd
Min
-50
-10
3.0
Value
Typ
25
3.3
Max
+50
+70
3.6
ppm
℃
V
Idd1
-
-
25
mA
Idd2
-
-
0.02
mA
Item
Symbol
Frequency tolerance
Operating temp. range
Supply voltage
Current consumption 1
(#1 pin: open or "H")
Current consumption 2
(#1 pin: "L" level)
Symmetry
Low level output voltage
High level output voltage
Rise & Fall time
Pin #1 options
Output load
Low level input current
High Level input current
Low level input voltage
High level input voltage
Output disable time
Output enable time
Aging
Duty
40
Vol
Voh
0.9xVdd
Tr & Tf
Iil
Iih
Vil
Vih
Tplz
Tpzl
-
Unit
Etc
Fig1,2
50
-
Condition
Vdd
Temp
3.3+/0.3V
-10~70
℃
3.3V
25+/-3
℃
60
%
0.1xVdd
V
V
7
ns
YES
C-MOS CL =30 pF (Idd1, Idd2 test at No Load)
-100
μA
100
μA
0.3xVdd
V
0.7xVdd
V
Fig3
3.3V
100
ns
5
ms
-5
5
ppm/year
25+/-3
℃
F : Output Frequency
Δf =Oscillation Frequency – F
Frequency Stability is inclusive of 25℃
Tolerance, operating temperature range, input voltage change,
Load change, first of aging, shock and vibration.
Moisture Sensitivity Level: Level 1
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Fig. 1) Measurement Circuit :
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Fig. 2) Output Wave Form:
Fig. 3) Input Output Condition:
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4
5. Dimensions:
#2
Pin Connections
#1 OE(Output Enable)
#2
GND
#3
OUT
Vdd
#4
1.4 #2
#1
7.0±0.2
1.4 Max.
0.55
#1
#4
2.0
5.0±0.2
H.ELE.YM
#3
Frequency
2.6
#3
#4
5.08
UNIT: mm
TOLERANCE: ±0.2
INK: M7251
Laser
1.8
Lot No.:
Year : Last digit of the year
Year
Code
2000
2010
0
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
11
L
12
M
Month : Alphabet assign below
Month
Code
1
A
2
B
3
C
4
D
5
E
6
F
7
G
8
H
9
J
10
K
Marking : Laser marking or Ink marking.
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5
6.
Inside Structure:
7
5
6
6
3
5
4,7 2
2
4
Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metalized Pad: W
Ni Plating
Au Plating
(2) IC:
IC (Si. Al.)
(3) Au Bonding Wire:
Au
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) LID:
Fe+Ni+Co
(6) Adhesive
Silver Conductive Silicon Resin
(7) Electrode
1
3
The use prohibition chemistry substance of
Table 1 of DHE-0204-1 (HE-QA-24) is not
included in this item.
1
7. Mechanical Performance:
Item
1
Natural Drop
2
Vibration
3
Sealing
Tightness
Solder ability
4
Drop 3 times from the height of 50cm onto min. 30mm
thickness hard wooden board.
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to
X, Y and Z 3 axes, Duration of 2 hours to each axis.
Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium
leak detector. – Fine Leakage.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
Tittle
A
A
--B
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HSO751S SPECIFICATION
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Code
Test Methods
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8.
1
2
3
4
5
Environment Performance:
Test Methods
Humidity
Temperature 60℃+/-2℃, RH 90~95%, Duration of 240
hours.
Back to room temperature first, then in 1~2 hours, the
component shall be checked.
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
-30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C
(30min) 25 cycles. Back to the room temperature first, then
in 1~2 hours, the component shall be checked.
+85deg.C +/-5deg.C, +3.3V Vdd Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
Storage in Low
Temperature
Storage in High
Temperature
Temperature
cycles
High
Temperature
Operation
A
A
A
A
A
Specifications code
Test Methods
A
Frequency variation shall be within +/-5ppm and equivalent resistance
shall be within the specification after the test
More than 90% of lead shall be covered by new solder.
B
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9.
Supplement:
9.1. Soldering
9.2. Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.
C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
9.3. Land Pattern Layout: (Example)
9.4. Solder Iron: (Example)
Bit temp.:350℃ Max. , Time: 3sec Max. , Each terminal solder a 1 time Max.
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9.5. Mounting:
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be sure
Of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering process.
Avoid mounting and processing by Ultrasonic welding because this method has a possibility
Of an excessive vibration spreading inside the crystal products and becoming the cause of
Characteristic deterioration and not oscillating.
9.6. Cleaning:
Cleaning liquid which corrodes Nickel shall not be used.
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
9.7. Handling:
HSO751S series is designed to withstand Drop and Vibration, however, the crystal blank
might be broken. So, if excess force is given, please check the characteristics before use.
HSO751S series has C-MOS circuit inside. Please pay attention to static-electricity as
same handling as other C-MOS. devices.
9.8. By-pass Capacitor:
It has no by-pass capacitor integrated. We recommend you to use capacitor (like ceramic chip
capacitor) 0.01μF in-between Vdd and GND.
9.9. Storage:
Please keep away from high temperature and high humidity, which may cause put solderbility.
No direct Sunlight, No dew as well.
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10.
Taping and Packing:
10.1.Emboss Tape Specifications:
10.2.Reel Specifications:
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
16.8+/-0.3
Outer Width
W2
19.5+/-1.0
Out Line diameter
B
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
Q
120deg
C
ψ13.2+/-0.5
E
2.4+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
10.3.Storage:
Temperature+40℃ Max.
Humidity 80% Max.
10.4.Quantity on Reel:
1,000 PCS/REEL
10.5.Label:
Label is following information:
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10.6. PACKAGE:
TYPE:
SPEC. No.:
Parts No.:
Lot No.:
Label
Up side(Produce)
Q.C
PASS
H10
FREQ.:
Q'TY:
MHz
PCS
HSF
HARMONY ELECTRONICS CORP.
Under side(Fixing Hole)
One reel quantity: [1000pcs]&[3000pcs]
1 Top and bottom with 2.3cm thickness
foam-rubber cushion for protection
2 Carton's Q'TY:1~15 pcs.
3 Carton Type=A,B ,C use 4 trigon pillar to fasten the Reel.
4 Need to add 3 pages dry agent in each outer box.
use 4 trigon pilla
OR
Green Product
ROHS Compliant
A
Carton Type
B
630/531/ 321/221
211/111
Produce Type 840/751 421
Reel
OTHER
15
15
15
1~7
200
200
200
195
200
200
200
195
230/260
230
230
150
Gree
n
Prod
uct
ROHS
Co mp
lian
D
C
t
1.Every Carton with 3 desiccant.
2.Top and bottom with 2.3cm thickness
foam-rubber cushion for protection
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11. Flow Chart:
LID(外 殼 蓋 )
BLANK(晶 片 )
LID進 料 檢 查
1
2
Incoming Inspection
of LID
LID洗 淨
Cleaning of LID
BASE(基 座 )
BLANK進 料 檢 查
7
8
9
10
4
Incoming Inspection
of BLANK
IC
BASE進 料 檢 查
IC進 料 檢 查
3
Incoming Inspection
of BASE
Incoming
Inspection of IC
化學蝕刻
Etching
頻率選別
5
Sorting of Freq.
IC 搭 載
IC Mounting
晶片排盤
Blank Array
6
打 金 線 ($)
Wire Bonding
蒸著前洗淨
11
12
13
14
15
16
Cleaning before
Base Plating
微蝕刻
Flash Etching
基礎蒸著
Base Plating
押入接著
Blank Ass'y
接著硬化
Adhesive Curing
接著檢查
Bonding Check
CI 檢 查 (C)
CI Inspection
(3rd: ALL;
Fund.:Designation Item ONLY)
(NOT available for SR Series)
17
18
氣 密 檢 查 II(氦 氣 加 壓 )
25
調整蒸著
Partial Adjustment/
ION Partial
26
溫 度 特 性 檢 查 (C)
超 音 波 洗 淨 (C)
Check of
Temp. Characteristics
(NOT available for SR Series)
DLD檢 查 (C)
Check of DLD
(SR Series Only)
Appearance Check
(NOT available for SR Series)
高真空烘烤
High Vacuum Annealing
20
熔 接 Seam Seal
21
印 字 +外 觀 檢 查
22
REFLOW
23
老 化 Aging
27
28
29
氣 密 檢 查 I (AIR)
Final Check
外觀檢查
Appearance Check
出貨檢查
Outgoing Inspection
Tapping/Packing
出 貨 Shipment
Leak Check I
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最 終 檢 查 ($)
Marking & Check
30
24
Leak Check II
Middle Check
Se am前 外 觀 檢 查 (C)
($): 特 殊 特 性
(For Special Characteristics)
(C): 指 定 製 程
arranged from customer requirement
氣 密 檢 查 II(HE)
中 間 檢 查 ($)
U.S Dry Cleaning
(NOT available for SR Series)
19
Leak Check II
(Helium Pressurization)
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12. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
HSO751S
PERCENTAGE
151(mg)
ppm
Si
0.8758
1322.458
Au
0.4983
752.433
Co & Co Compound
7.1725
10830.475
Mo & Mo Compound
0.4375
660.625
Ag
3.3220
5016.22
Cu
0.4983
752.433
Cr & Cr Compound
0.2718
410.418
33.5069
50595.419
Mn & Mn Compound
0.1963
296.413
W & W Compound
0.9664
1459.264
Ni & Ni Compound
14.2544
21524.144
Fe
25.6096
38670.496
Chemical Substance Components
Al
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REV.
DATE
REASON
No.
0
2014/06/26
New
CONTENTS
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