BCIHP1770-100M

(SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series (IHLP-6767GZ-11/IHLP-6767GZ-01) ● Photograph picture BCIHP1770 ● Dimensions Recommend PC Board Pattern ITEM BCIHP1770HC-Series BCIH11735HC-Series BCIH11740HC-Series A(mm) B(mm) C(mm) 17.0±0.30[1] 18.0±0.3 7.0 MAX 7.3 11.3 3.5 7.3 11.3 3.5 D(mm) E(mm) F(mm) G(mm) H(mm) 12.0±0.3 2.50±0.3 20.5 12.5 10.0 2.5±0.5 2.5±0.3 2.5±0.5 2.5±0.3 ● Part Numbering BCIHP 1770HC – 1R0 M – T01 A B C D E A/E:Series(系列代號) B:Dimension(尺寸) B×C C:Inductance(電感值) 1R0=1.0uH D:Inductance Tolerance(電感值公差) M=±20% ● Features 1. 2. 3. 4. Compliance with RoHs. Lowest DCR. Frequency range up to 1.0MHz. Handles high transient current spikes without saturation ● Applications 1. DC/DC converter for CPU in Notebook PC 2. Battery powered devices 3. Cellular phones LCD displays, HDDs, DVCs, DSCs, PDA etc. 4. Thin type on-board power supply module. TEL:+86-756-3383909 TAX:+86-756-3380704 ● 特點 1. 符合 RoHs. 2. 低電阻. 3. 頻率可達到 1.0 MHz. 4. 可處理在未飽和時的高瞬間電流. ● 應用 1. 用於筆記本電腦處理器的 DC/DC 轉換設備. 2. 電源,電池設備. 3. 適用於手機液晶屏顯示,HDD, DVC, DSC, PDA 等. 4. 薄型車載電源模組. Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 1 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● Specification ITEM BCIHP1770HC-1R0M-T02[IHLP-6767GZ-11] BCIHP1770HC-1R5M-T02[IHLP-6767GZ-11] BCIHP1770HC-2R2M-T02[IHLP-6767GZ-11] BCIHP1770HC-3R3M-T02[IHLP-6767GZ-11] BCIHP1770HC-4R7M-T02[IHLP-6767GZ-11] BCIHP1770HC-5R6M-T02[IHLP-6767GZ-11] BCIHP1770HC-6R8M-T02[IHLP-6767GZ-11] BCIHP1770HC-8R2M-T02[IHLP-6767GZ-11] BCIHP1770HC-100M-T02[IHLP-6767GZ-11] BCIHP1770HC-150M-T02[IHLP-6767GZ-11] BCIHP1770HC-220M-T02[IHLP-6767GZ-11] BCIHP1770HC-330M-T02[IHLP-6767GZ-11] BCIHP1770HC-470M-T02[IHLP-6767GZ-11] BCIHP1770HC-560M-T02[IHLP-6767GZ-11] BCIHP1770HC-680M-T02[IHLP-6767GZ-11] BCIHP1770HC-820M-T02[IHLP-6767GZ-11] BCIHP1770HC-101M-T02[IHLP-6767GZ-11] BCIH11735HC-R22M BCIH11740HC-R15N BCIH11740HC-R22M TEL:+86-756-3383909 TAX:+86-756-3380704 INDUCTANCE uH @100KHZ,1.0V,0A 1.00 1.50 2.20 3.30 4.70 5.60 6.80 8.20 10.00 15.00 22.00 33.00 47.00 56.00 68.00 82.00 100.00 0.22 0.15 0.22 (1) DCR mΩ 25℃ TYP 1.27 1.62 1.98 2.93 4.18 4.60[2] 6.15 8.10 9.33 14.40 21.00 37.00 42.70 57.80 75.70 91.70 110.00 7.35 HEAT RATING 1.21 1.54 1.85 2.79 3.98 4.45[2] 5.86 7.71 8.89 13.70 20.00 35.10 40.70 55.00 72.10 87.30 105.00 4.9 TYPICAL(Irms) 0.35±7% 0.55 SATU RATION DCR mΩ CURRENT DC AMPS CURRENT DC AMPS 25℃ MAX (5) (6) 0.6 Bao Cheng Electronics Corp Ltd www.baocheng.biz 55.50 48.00 43.50 35.00 30.00 28.00 22.50 21.00 19.00 14.00 12.00 10.70 8.70 7.20 6.10 5.50 5.00 13.0 00 50.0 0 31.0 00 TYPICAL(Isat) 32.00 31.00 28.00 27.00 21.00 21.00 18.50 18.00 17.00 12.00 9.50 9.00 8.60 4.20 4.50 4.50 4.00 45.00 65.00 60.00 19 JAN 2016 TAPE BCIHP1770HC-Series P: 2 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series Note: (1) (2) (3) (4) (5) (6) (7) (1) (2) (3) (4) (5) (6) (7) Tolerance of Inductance: N=±30% ,M=±20%. All test data is referenced to 25℃ ambient. Inductance is measured at 100KHz. 25℃ ambient. Operating Temperature Range-40℃ to +125℃. DC current (Irms) (A) that will cause an approximate △T of 40℃. DC current (Isat) (A) that will cause Lo to drop approximately 30%. The part Temperature (ambient + temp rise) should not exceed 125℃ under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature Part temperature should be verified in the end application. 電感的公差：N=±30%,M=±20%. 所有的測試資料應該是在 25℃的環境溫度下測試. 感值測試頻率 100KHz. 操作溫度範圍－40℃到+125℃. 加 DC(Irms)電流值(A)會導致△T 40℃左右的變化. 加 DC(Isat)電流值(A)會導致初始值下降 30%左右. 產品的溫度不能超過 125℃，即使在最壞的操作情況下，基板設計，元件放置，PWB 尺寸和厚度， 氣流和一些冷卻設備都會影響產品溫度，產品溫度要在最終應用時才被驗證. TEL:+86-756-3383909 TAX:+86-756-3380704 Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 3 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● Material List NO 1 2 ITEM Core Wire External Electode 3 Electroplating 4 Paint Materials Magnetic Metal Powder or equivalen Polyester Wire or equivalen Copper Ni/Sn Epoxy resin ● Packaging Information (1) Reel Dimension & Tape Dimension / Packaging Quantity ITEN BCIHP1770 Q’TY (PCS) W1±0.3 W2±0.5 300 32.80 40.20 DIMENSIONS (m/m) W± A0± B0± 32.00 17.80 18.60 K0± P± F± 7.30 24.00 15.50 T±0.05 0.40 (2) Tearing Off Force The force tearing off cover 10 to 130 grams (0.1N to 1.3N) in the arrow direction under the following conditions. ● Storage conditions/Note things (1) Storage temperature and humidity conditions : 1. Product packing with Carrier tape: +5℃~+40℃ and less than 60% RH. 2. Product alone: -20℃~+60℃ and less than 60% RH. (2) Products should be used within 6 months. (3) The packaging material should be kept where no chlorine or sulfur exists in the air. (4) Do not touch the electrodes (soldering terminals) with fingers as this may lead to deterioration of solder ability (5) The use of tweezers or vacuum pick-ups is strongly recommended for individual components. (6) Bulk handling should ensure that abrasion and mechanical shock are minimized. TEL:+86-756-3383909 TAX:+86-756-3380704 Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 4 / 9 (SMD Power Inductors) SMD Power Inductors BCIHP1770HC-Series ● Package for standard ITEM Packing method & Dimensions Box Size W=345mm D=345mm H=185mm ITEM BCIHP1770 TEL:+86-756-3383909 TAX:+86-756-3380704 Packing Quantity 300 Pcs/Reel (3.5Kg(Ref)) Reel Quantity 4 Reel/Box Bao Cheng Electronics Corp Ltd www.baocheng.biz Total Quantity 1,200 Pcs/Box (14.8Kg(Ref)) 19 JAN 2016 TAPE BCIHP1770HC-Series P: 5 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● General Characteristics Operation Temperature External Appearance -40℃ to +125℃ (Includes temperature when the coil is heated) On visual inspection, the coil has no external defects. ● Electrical Performance Test Inductance DCR Refer to standard electrical characteristics list. Saturation Current(Isat) BCIHP1770HC-Series △L≦30% typical. Heat Rated Current(Irms) Approximately △T≦40℃. ● Reliability Test Solder Ability Test 1. More than 90% of terminal electrode should be covered with solder.  After fluxing, component shall be dipped in a melted.  Solder: bath at 245℃±5℃ for 5±0.5 seconds. 1. 2. Heat resistance of  Reflow Soldering Test    1.  Adhesion strength Test Components should have not evidence of electrical and mechanical damage. Inductance: within±10% of initial value. Preheat:150±5℃ 60seconds. Solder temperature: 255+5℃/-0℃. Flux: rosin. Dip time:10±0.5seconds. No apparent damage Product is mounted on PCB. Thereafter R340 pressure fixture is used to apply pressure to product from backside of the board at a rate of approx. 1mm/sec. until bending width becomes 1mm and keep it for 5sec. 1. No separation or indication of electrode.  A static load using a R5.0 pressing tool shall be applied to the Welding strength Test body of the specimen in the direction of the arrow and shall be hold for 3±1 sec. Insulating Resistance Over 100MΩ at 100V D.C. between coil and core. Dielectric Strength Vibration Test Drop Test TEL:+86-756-3383909 TAX:+86-756-3380704 No dielectric breakdown at 30V D.C. for 1 minute between coil and core. 1. No separation or Inductance deviation within +10% after vibration for 1 hour. In each of three orientations at Sweep vibration indication of (10~55~10HZ) with 1.5mmP-P amplitudes. electrode. 2. △L/L≦15% Inductance deviation within +10% after being dropped once with 981m/s2 (100G) shock Attitude upon a rubber block method shock testing machine, in three different orientations. Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 6 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● Reliability Test Item High Temperature Storage Test Low Temperature Storage Test High Temperature Humidity Test Thermal Shock Test Storage Test Required Characteristics 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15% Test Method/Condition  Temperature:125℃±3℃ Time:96±2 hours.  Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%  Temperature:-40℃±3℃ Time:96±2 hours.  Tested not less than 1 hour, nor more than 2 hours at room. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%     Temperature:85℃±3℃. Humidity:85±5%RH Test Time:96±2 hours Tested not less than 1 hour. Nor more than 2 hours at room temperature. 1. No case deformation or change in appearance 2. △L/L≦15% 3. △Q/Q≦30% 4. △DCR/DCR≦15%  First–40℃ for 30 Minutes, last 125℃ for 30 Minutes as 1 cycle. Go through 20 cycles. TEL:+86-756-3383909 TAX:+86-756-3380704 Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 7 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● Soldering re-flow IPC/JEDEC J-STD-020C, Figure 5-1 TEL:+86-756-3383909 TAX:+86-756-3380704 Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 8 / 9 (SMD Power Inductors) Powder Molding Type BCIHP1770HC-Series ● Modify records Numbering [1] [2] [3] Date Modify content 2015/3/28 Dimensions A:17.0 ±0.15 has been changed to A:17.0 ± 0.30 2015/4/17 BCIHP1770-5R6M-T01 DCR:4.44mΩ MAX has been changed to DCR:4.60mΩ MAX. DCR:4.23mΩ Typ has been changed to DCR:4.45mΩ Typ. 2016/10/27 BCIHP1770-xxx-T01 change for BCIHP1770HC-xxx-T02 TEL:+86-756-3383909 TAX:+86-756-3380704 BCIHP1770HC-xxx-T02 change for BCIHP1770HC-xxx-T03 Bao Cheng Electronics Corp Ltd www.baocheng.biz 19 JAN 2016 TAPE BCIHP1770HC-Series P: 9 / 9