HPC6045NF-3R3MTH

TAI-TECH P1 SMD Power Inductor HPC6045NF-Series(TH) ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 17/07/17 新發行 羅宜春 梁周虎 卜文娟 備 註 TAI-TECH P2 SMD Power Inductor HPC6045NF-Series(TH) 1. Features 1. This specification applies Low Profile Power Inductors. 2. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2. Dimension Halogen Pb Halogen-free Pb-free Recommended Land pattern 2R2 B(mm) B’(mm) C(mm) D(mm) E(mm) HPC6045NF 6.0±0.3 6.0±0.3 Series A(mm) 4.8±0.2 4.2±0.3 1.7±0.3 4.5±0.3 4.25±0.3 6045 NF A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance . L(mm) G(mm) G1(mm) H(mm) 6.5 4.25 1.80min 4.8 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. 3. Part Numbering HPC F(mm) - 2R2 YTH D E A/B*C 2R2=2.20uh 100=10uh,101=100uh,102=1000uh M=±20%,Y=±30%. marking direction cannot decide polarity. Color: Black, unidirectional. magnetic shielding TAI-TECH P3 4. Specification Rated current Part Number Inductance L0 (uH) @0A K L Typ Max Typ Max HPC6045NF-R36□(TH) 0.36 / / ±20% ±30% 9.00 8.50 18.00 16.50 4.80 HPC6045NF-R47□(TH) 0.47 / / ±20% ±30% 8.60 8.00 17.00 16.00 6.80 HPC6045NF-R82□(TH) 0.82 / / ±20% ±30% 8.20 7.50 14.50 13.50 8.50 HPC6045NF-1R0□(TH) 1.00 / / ±20% ±30% 8.00 7.30 13.50 12.50 10.0 HPC6045NF-1R2□(TH) 1.20 / / ±20% ±30% 7.50 7.00 12.50 11.50 10.5 HPC6045NF-1R3□(TH) 1.30 / / ±20% ±30% 7.50 7.00 12.50 11.50 10.5 HPC6045NF-1R5□(TH) 1.50 / / ±20% ±30% 7.00 6.60 12.00 11.00 11.7 HPC6045NF-1R8□(TH) 1.80 / / ±20% ±30% 6.80 6.20 11.00 10.00 12.0 HPC6045NF-2R0□(TH) 2.00 / / ±20% ±30% 6.50 5.80 10.50 9.50 13.5 HPC6045NF-2R2□(TH) 2.20 / / ±20% ±30% 6.00 5.30 9.50 8.55 15.0 HPC6045NF-2R3□(TH) 2.30 / / ±20% ±30% 5.80 5.00 9.30 8.20 16.0 HPC6045NF-3R0□(TH) 3.00 / / ±20% ±30% 5.20 4.60 8.00 7.50 20.0 HPC6045NF-3R3□(TH) 3.30 / / ±20% ±30% 5.00 4.50 7.80 7.30 21.0 / Tolerance M Temperature current I rms (A) Y Saturation current I sat (A) DCR (mΩ) @25℃ ±20%. HPC6045NF-3R6□(TH) 3.60 / ±20% ±30% 4.90 4.30 7.40 6.90 22.5 HPC6045NF-4R7□(TH) 4.70 / ±15% ±20% ±30% 4.50 4.00 6.80 6.20 26.0 HPC6045NF-5R6□(TH) 5.60 / ±15% ±20% ±30% 4.10 3.70 6.40 5.70 31.0 HPC6045NF-6R3□(TH) 6.30 / ±15% ±20% ±30% 3.80 3.50 5.90 5.30 33.0 HPC6045NF-6R8□(TH) 6.80 / ±15% ±20% ±30% 3.60 3.30 5.70 5.15 34.0 HPC6045NF-8R2□(TH) 8.20 / ±15% ±20% ±30% 3.40 2.90 5.10 4.50 46.0 HPC6045NF-100□(TH) 10.0 ±10% ±15% ±20% ±30% 3.20 2.60 4.60 4.20 52.0 HPC6045NF-150□(TH) 15.0 ±10% ±15% ±20% ±30% 2.80 2.20 3.80 3.30 71.0 HPC6045NF-180□(TH) 18.0 ±10% ±15% ±20% ±30% 2.60 2.10 3.40 2.90 80.0 HPC6045NF-220□(TH) 22.0 ±10% ±15% ±20% ±30% 2.30 1.90 3.30 2.70 96.0 HPC6045NF-330□(TH) 33.0 ±10% ±15% ±20% ±30% 1.80 1.50 2.50 2.10 145 HPC6045NF-470□(TH) 47.0 ±10% ±15% ±20% ±30% 1.60 1.20 2.00 1.75 200 HPC6045NF-560□(TH) 56.0 ±10% ±15% ±20% ±30% 1.40 1.00 1.80 1.65 230 HPC6045NF-680□(TH) 68.0 ±10% ±15% ±20% ±30% 1.10 0.92 1.60 1.52 305 HPC6045NF-820□(TH) 82.0 ±10% ±15% ±20% ±30% 0.98 0.88 1.50 1.40 365 HPC6045NF-101□(TH) 100 ±10% ±15% ±20% ±30% 0.92 0.82 1.33 1.25 456 HPC6045NF-121□(TH) 120 ±10% ±15% ±20% ±30% 0.85 0.79 1.20 1.10 500 HPC6045NF-151□(TH) 150 ±10% ±15% ±20% ±30% 0.75 0.70 1.10 1.00 626 HPC6045NF-181□(TH) 180 ±10% ±15% ±20% ±30% 0.68 0.60 1.00 0.90 745 HPC6045NF-221□(TH) 220 ±10% ±15% ±20% ±30% 0.60 0.50 0.88 0.77 900 HPC6045NF-331□(TH) 330 ±10% ±15% ±20% ±30% 0.55 0.45 0.60 0.55 1400 HPC6045NF-471□(TH) 470 ±10% ±15% ±20% ±30% 0.40 0.35 0.50 0.45 2050 Note: 1. All test data referenced to 25℃ ambient , Ls/Q:1MHz/1V. 2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER. 3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ 4. Saturation Current (Isat) will cause L0 to drop approximately 30% 5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 5. Material List g b a c e d f NO Items Materials a Core Ferrite Core b Wire Enameled Copper Wire c Glue Epoxy with magnetic powder d Terminal Lead free-Sn Solder e Adhesive Epoxy f Copper foil Pure Copper g Ink Halogen-free ketone 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1. -10~+40℃,50~60%RH (Product without taping) 2. -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Life Test Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs 2 Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 2 TAI-TECH Item P5 Performance Bending Shock Solder ability Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg ,